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LV49157V

Onsemi

LV49157V by Onsemi

LV49157V by Onsemi is a BICMOS audio amplifier with 15W output power, suitable for commercial extended temperature applications. It features a small outline package with 44 terminals and operates on a supply voltage range of 9-18V. This surface-mount device has dual terminal positions and is ideal for audio and video amplification in compact electronic systems.

Median Price

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Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

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Digiode

USA . 2,343 parts In-Stock

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Vyrian

USA . 692 parts In-Stock

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SupplyDigital Components

Austria . 4,543 parts In-Stock

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Problanco Electronics

Mexico . 2,749 parts In-Stock

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Kulean Microsystems

USA . 2,501 parts In-Stock

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Corphita

USA . 1,712 parts In-Stock

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TANS Electronics

Latvia . 591 parts In-Stock

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Corohmni

South Africa . 320 parts In-Stock

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UHIMA Technologies

Türkiye . 146 parts In-Stock

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Overview

Enhance your audio and video experience with the LV49157V by Onsemi. Crafted with precision and expertise, this audio amplifier offers unparalleled quality and performance. Perfect for various applications in the audio and video industry, this product delivers a seamless and immersive sound experience. With its compact design and advanced technology, the LV49157V guarantees reliable and efficient operation. Upgrade your audio system today and enjoy the benefits of superior sound quality with Onsemi's LV49157V.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Plastic material is lightweight and durable, making the product easy to handle and long-lasting.

Surface Mount: YES

Surface mount technology allows for easy installation on circuit boards, saving time and effort.

Package Shape: RECTANGULAR

Rectangular shape makes it easy to integrate into electronic devices with straight edges.

General IC Type: AUDIO AMPLIFIER

Specifically designed for audio amplification, ensuring high-quality sound output.

Power Supplies (V): 15

Optimal power supply voltage for efficient performance and power output.

No. of Terminals: 44

Sufficient number of terminals for connecting various components and peripherals.

Package Style (Meter): SMALL OUTLINE, HEAT SINK/SLUG, LOW PROFILE, SHRINK PITCH

Multiple package styles provide flexibility in installation options and heat dissipation.

Maximum Operating Temperature: 75 °C

High maximum operating temperature ensures reliability and stability in various environments.

Minimum Operating Temperature: -25 °C

Low minimum operating temperature allows for operation in cold environments without issues.

Terminal Position: DUAL

Dual terminal position provides redundancy and flexibility in connecting the product.

Nominal Output Power: 15 W

Sufficient output power for driving speakers or amplifying audio signals effectively.

Maximum Seated Height: 1.7 mm

Low profile design saves space and allows for compact integration into devices.

Width: 5.6 mm

Narrow width allows for easy placement on circuit boards without taking up too much space.

Minimum Supply Voltage (Vsup): 9 V

Low minimum supply voltage ensures compatibility with various power sources.

Length: 15 mm

Compact length allows for easy fitting into tight spaces or small devices.

Temperature Grade: COMMERCIAL EXTENDED

Commercial extended temperature grade ensures reliable operation in commercial applications.

No. of Channels: 2

Dual channels provide stereo output for enhanced audio performance and spatial separation.

Technology: BICMOS

BICMOS technology combines the benefits of bipolar and CMOS technology for efficient and high-performance operation.

Terminal Form: GULL WING

Gull wing terminal form allows for easy soldering and secure connection to circuit boards.

Maximum Supply Current: 55 mA

Low maximum supply current consumption for energy-efficient operation.

Terminal Pitch: 0.65 mm

Narrow terminal pitch enables tight spacing on circuit boards for compact design.

Maximum Supply Voltage (Vsup): 18 V

High maximum supply voltage capability for flexibility in power input options.

Technical Specifications

Audio & Video Amplifiers LV49157V attributes and parameters. Explore more Audio & Video Amplifiers devices from Onsemi

Specs

General IC Type:

JESD-30 Code:

R-PDSO-G44

Length:

15 mm

No. of Channels:

2

No. of Functions:

1

No. of Terminals:

44

Maximum Operating Temperature:

75 Cel

Minimum Operating Temperature:

-25 Cel

Nominal Output Power:

15 W

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

SSOP44,.3

Package Shape:

Package Style (Meter):

SMALL OUTLINE, HEAT SINK/SLUG, LOW PROFILE, SHRINK PITCH

Power Supplies (V):

15

Qualification:

Not Qualified

Maximum Seated Height:

1.7 mm

Sub-Category:

Audio/Video Amplifiers

Maximum Supply Current:

55 mA

Maximum Supply Voltage (Vsup):

18 V

Minimum Supply Voltage (Vsup):

9 V

Surface Mount:

YES

Technology:

BICMOS

Temperature Grade:

Terminal Form:

Terminal Pitch:

.65 mm

Terminal Position:

DUAL

Width:

5.6 mm

Trade Compliance

LV49157V General Purpose ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.33.00.01

SB

8542.33.00.00

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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