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LV4912GP

Onsemi

LV4912GP by Onsemi

LV4912GP by Onsemi is a 24-terminal audio amplifier IC with 2W output power. Operating b/w -20 to 75 °C, it requires 2.7-5.5V supply voltage and draws max 10mA current. Ideal for audio applications in commercial settings due to its BICMOS technology and compact chip carrier package style at just 3.5mm width and length.

Median Price

-

Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 1,824 parts In-Stock

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1,824

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Digiode

USA . 1,638 parts In-Stock

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1,638

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

TANS Electronics

Latvia . 8,224 parts In-Stock

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8,224

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Kulean Microsystems

USA . 5,014 parts In-Stock

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5,014

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SupplyDigital Components

Austria . 3,988 parts In-Stock

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3,988

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Problanco Electronics

Mexico . 1,994 parts In-Stock

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1,994

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Corphita

USA . 494 parts In-Stock

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494

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Corohmni

South Africa . 163 parts In-Stock

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UHIMA Technologies

Türkiye . 99 parts In-Stock

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99

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Overview

Upgrade your audio and video experience with the LV4912GP by Onsemi, a high-quality audio amplifier that takes your sound to the next level. Manufactured by industry leader Onsemi, this chip carrier package offers unmatched performance and reliability. Perfect for a wide range of applications, this amplifier is the perfect choice for customers looking for superior sound quality and seamless integration. Say goodbye to subpar audio and hello to crystal-clear sound with the LV4912GP.

Feature Benefit Bullets

Surface Mount: YES

Surface mount technology allows for easy and efficient assembly of the amplifier onto circuit boards, making it suitable for mass production.

Package Shape: SQUARE

The square package shape provides a compact design, saving space and allowing for easy integration into various audio and video device applications.

General IC Type: AUDIO AMPLIFIER

Being specifically designed for audio amplification, this IC ensures high-quality sound output, making it a reliable choice for audio equipment.

Nominal Output Power: 2 W

With a nominal output power of 2W, this amplifier can effectively drive speakers or headphones, delivering clear and powerful audio.

Maximum Operating Temperature: 75 °C

The high maximum operating temperature ensures reliable performance even under elevated temperature conditions, increasing the amplifier's durability.

Minimum Supply Voltage (Vsup): 2.7 V

The low minimum supply voltage requirement allows for flexibility in power sources, making it suitable for a wide range of applications.

Technology: BICMOS

Utilizing BiCMOS technology combines the benefits of both bipolar and CMOS technologies, enabling high-performance audio amplification with low power consumption.

Technical Specifications

Audio & Video Amplifiers LV4912GP attributes and parameters. Explore more Audio & Video Amplifiers devices from Onsemi

Specs

General IC Type:

JESD-30 Code:

S-XQCC-N24

Length:

3.5 mm

No. of Channels:

1

No. of Functions:

1

No. of Terminals:

24

Maximum Operating Temperature:

75 Cel

Minimum Operating Temperature:

-20 Cel

Nominal Output Power:

2 W

Package Body Material:

UNSPECIFIED

Package Code:

Package Equivalence Code:

LCC24,.13SQ,20

Package Shape:

Package Style (Meter):

CHIP CARRIER

Power Supplies (V):

5

Qualification:

Not Qualified

Sub-Category:

Audio/Video Amplifiers

Maximum Supply Current:

10 mA

Maximum Supply Voltage (Vsup):

5.5 V

Minimum Supply Voltage (Vsup):

2.7 V

Surface Mount:

YES

Technology:

BICMOS

Temperature Grade:

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

QUAD

Width:

3.5 mm

Trade Compliance

LV4912GP General Purpose ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.33.00.01

SB

8542.33.00.00

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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