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LV4910T-TLM-E

Onsemi

LV4910T-TLM-E by Onsemi

LV4910T-TLM-E by Onsemi is a 2W audio amplifier with 0.4% harmonic distortion. It operates b/w -20 to 75 °C and requires 2.5-5.5V supply voltage. Ideal for small outline applications in commercial extended temperature grade environments.

Median Price

$5.860

Lifecycle Status

Suppliers In-Stock

5

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Chip1Stop

Japan . 950 parts In-Stock

1+ parts

$5.860

100+ parts

$2.890

1k+ parts

$2.090

10k+ parts

-

950

$5.860

$2.890

$2.090

-

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 769 parts In-Stock

1+ parts

$5.567

100+ parts

-

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-

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769

$5.567

-

-

-

Cyclops Electronics Ltd

UK . 14,000 parts In-Stock

1+ parts

-

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14,000

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-

-

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Vyrian

USA . 7,688 parts In-Stock

1+ parts

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7,688

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Flip Electronics

USA . 1,000 parts In-Stock

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-

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1,000

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Ampacity Inc.

Singapore . 805 parts In-Stock

1+ parts

$4.980

100+ parts

-

1k+ parts

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805

$4.980

-

-

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Corphita

USA . 656 parts In-Stock

1+ parts

$5.274

100+ parts

-

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656

$5.274

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-

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Corohmni

South Africa . 131 parts In-Stock

1+ parts

$5.860

100+ parts

-

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131

$5.860

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AZTECH Wire

Italy . 323 parts In-Stock

1+ parts

$10.780

100+ parts

-

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323

$10.780

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Component Stockers USA

USA . 757 parts In-Stock

1+ parts

$99.990

100+ parts

-

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757

$99.990

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Metaverse IC Inc.

Canada . 14,000 parts In-Stock

1+ parts

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14,000

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QUARKTWIN TECHNOLOGY LTD

USA . 9,231 parts In-Stock

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9,231

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SupplyDigital Components

Austria . 7,711 parts In-Stock

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7,711

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Perfect Parts

USA . 5,936 parts In-Stock

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5,936

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Microchip USA

USA . 5,640 parts In-Stock

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5,640

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Problanco Electronics

Mexico . 5,442 parts In-Stock

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5,442

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TANS Electronics

Latvia . 4,597 parts In-Stock

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4,597

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Kulean Microsystems

USA . 4,505 parts In-Stock

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4,505

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Authorized Procurement Solutions

USA . 950 parts In-Stock

1+ parts

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950

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GreenTree Electronics

Israel . 950 parts In-Stock

1+ parts

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950

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Kepictronics

USA . 766 parts In-Stock

1+ parts

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766

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UHIMA Technologies

Türkiye . 4 parts In-Stock

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4

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Overview

Elevate your audio experience with the LV4910T-TLM-E by Onsemi, a top-of-the-line audio amplifier that guarantees premium quality and exceptional performance. Designed by a reputable manufacturer in the industry, this amplifier is perfect for various audio and video applications. With its compact design and advanced technology, this product offers unmatched value, benefits, and advantages to customers looking to enhance their sound systems. Upgrade your audio setup today with the LV4910T-TLM-E and immerse yourself in crystal clear sound like never before.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The plastic/epoxy body material makes the amplifier lightweight and durable, making it easy to handle and resistant to damage.

Surface Mount: YES

Being surface mountable allows for easy installation and integration into various electronic devices or circuit boards.

General IC Type: AUDIO AMPLIFIER

Specifically designed for audio amplification, ensuring high-quality sound output for optimal listening experience.

Nominal Output Power: 2 W

With a nominal output power of 2 W, this amplifier can provide sufficient power for driving speakers or headphones with clarity and precision.

No. of Channels: 2

Having two channels allows for stereo sound reproduction, creating a more immersive audio experience with separate left and right audio signals.

Technology: BICMOS

Utilizing BICMOS technology combines the advantages of both bipolar and CMOS technologies, offering high-speed performance and low power consumption.

Technical Specifications

Audio & Video Amplifiers LV4910T-TLM-E attributes and parameters. Explore more Audio & Video Amplifiers devices from Onsemi

Specs

General IC Type:

Harmonic Distortion:

.4 %

JESD-30 Code:

R-PDSO-G30

JESD-609 Code:

e6

Length:

9.75 mm

Moisture Sensitivity Level (MSL):

3

No. of Channels:

2

No. of Functions:

1

No. of Terminals:

30

Maximum Operating Temperature:

75 Cel

Minimum Operating Temperature:

-20 Cel

Nominal Output Power:

2 W

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

TSSOP30,.3

Package Shape:

Package Style (Meter):

SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

Power Supplies (V):

5

Qualification:

Not Qualified

Maximum Seated Height:

1.2 mm

Sub-Category:

Audio/Video Amplifiers

Maximum Supply Voltage (Vsup):

5.5 V

Minimum Supply Voltage (Vsup):

2.5 V

Surface Mount:

YES

Technology:

BICMOS

Temperature Grade:

Terminal Finish:

TIN BISMUTH

Terminal Form:

Terminal Pitch:

.65 mm

Terminal Position:

DUAL

Width:

5.6 mm

Trade Compliance

LV4910T-TLM-E General Purpose ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.33.00.01

SB

8542.33.00.00

PCN

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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