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LV49152V-TLM-E

Onsemi

LV49152V-TLM-E by Onsemi

AUDIO AMPLIFIER; Temperature Grade: COMMERCIAL; Terminal Form: GULL WING; No. of Terminals: 44; Package Code: SSOP; Package Shape: RECTANGULAR;

Median Price

$2.940

Lifecycle Status

Suppliers In-Stock

4

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Mouser Electronics

USA . 1,883 parts In-Stock

1+ parts

$2.940

100+ parts

$2.060

1k+ parts

$1.620

10k+ parts

$1.370

1,883

$2.940

$2.060

$1.620

$1.370

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 1,414 parts In-Stock

1+ parts

$2.793

100+ parts

-

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1,414

$2.793

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Vyrian

USA . 57 parts In-Stock

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$2.940

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57

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Flip Electronics

USA . 4,400 parts In-Stock

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Distributors (Availability)

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Component Stockers USA

USA . 5,031 parts In-Stock

1+ parts

$1.780

100+ parts

$1.690

1k+ parts

$1.640

10k+ parts

-

5,031

$1.780

$1.690

$1.640

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Corphita

USA . 789 parts In-Stock

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$2.646

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789

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Corohmni

South Africa . 190 parts In-Stock

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$2.940

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190

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Perfect Parts

USA . 31,808 parts In-Stock

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TANS Electronics

Latvia . 6,710 parts In-Stock

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6,710

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Problanco Electronics

Mexico . 5,987 parts In-Stock

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SupplyDigital Components

Austria . 5,620 parts In-Stock

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Authorized Procurement Solutions

USA . 5,000 parts In-Stock

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QUARKTWIN TECHNOLOGY LTD

USA . 4,849 parts In-Stock

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Microchip USA

USA . 4,062 parts In-Stock

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GreenTree Electronics

Israel . 4,000 parts In-Stock

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Kulean Microsystems

USA . 3,925 parts In-Stock

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Kepictronics

USA . 1,950 parts In-Stock

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1,950

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Metaverse IC Inc.

Canada . 1,950 parts In-Stock

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1,950

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UHIMA Technologies

Türkiye . 350 parts In-Stock

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350

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Technical Specifications

Audio & Video Amplifiers LV49152V-TLM-E attributes and parameters. Explore more Audio & Video Amplifiers devices from Onsemi

Specs

General IC Type:

JESD-30 Code:

R-PDSO-G44

JESD-609 Code:

e6

Moisture Sensitivity Level (MSL):

3

No. of Functions:

2

No. of Terminals:

44

Maximum Operating Temperature:

70 Cel

Minimum Operating Temperature:

-20 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

SSOP44,.3

Package Shape:

Package Style (Meter):

SMALL OUTLINE, SHRINK PITCH

Peak Reflow Temperature (C):

260

Power Supplies (V):

15

Qualification:

Not Qualified

Sub-Category:

Audio/Video Amplifiers

Maximum Supply Current:

55 mA

Surface Mount:

YES

Technology:

BICMOS

Temperature Grade:

Terminal Finish:

TIN BISMUTH

Terminal Form:

Terminal Pitch:

.635 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

30

Trade Compliance

LV49152V-TLM-E General Purpose ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.33.00.01

SB

8542.33.00.00

PCN

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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