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LV4904V

Onsemi

LV4904V by Onsemi

LV4904V by Onsemi is a 44-terminal audio amplifier IC with 14W output power. It operates b/w -30 °C to 70°C, suitable for small outline applications. With dual terminals and gull wing form, it's ideal for audio and video amplification in compact devices.

Median Price

-

Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

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Digiode

USA . 969 parts In-Stock

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Vyrian

USA . 140 parts In-Stock

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SupplyDigital Components

Austria . 5,993 parts In-Stock

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Problanco Electronics

Mexico . 2,792 parts In-Stock

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TANS Electronics

Latvia . 2,372 parts In-Stock

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Corphita

USA . 1,995 parts In-Stock

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Kulean Microsystems

USA . 1,666 parts In-Stock

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UHIMA Technologies

Türkiye . 444 parts In-Stock

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Corohmni

South Africa . 100 parts In-Stock

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Perfect Parts

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Overview

Unleash the power of crystal-clear audio with the LV4904V by Onsemi. Crafted with precision and expertise, this small outline, low-profile audio amplifier is designed to deliver 14W of pure sound quality. Perfect for a wide range of applications, from home entertainment systems to car audio setups, this versatile amplifier guarantees a rich and immersive listening experience like no other. Elevate your audio game and immerse yourself in the music with the LV4904V by Onsemi - where quality meets performance.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

This material is lightweight and durable, making the amplifier easy to handle and resistant to damage.

Surface Mount: YES

Allows for easy and secure installation on circuit boards, saving space and ensuring a stable connection.

General IC Type: AUDIO AMPLIFIER

Specifically designed for audio applications, ensuring high-quality sound output.

Nominal Output Power: 14 W

Provides sufficient power for amplifying audio signals, delivering clear and loud sound.

Maximum Supply Voltage (Vsup): 20 V

Supports a wide range of input voltages, making it versatile and compatible with various systems.

Technical Specifications

Audio & Video Amplifiers LV4904V attributes and parameters. Explore more Audio & Video Amplifiers devices from Onsemi

Specs

General IC Type:

JESD-30 Code:

R-PDSO-G44

Length:

15 mm

No. of Channels:

2

No. of Functions:

1

No. of Terminals:

44

Maximum Operating Temperature:

70 Cel

Minimum Operating Temperature:

-30 Cel

Nominal Output Power:

14 W

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Shape:

Package Style (Meter):

SMALL OUTLINE, HEAT SINK/SLUG, LOW PROFILE, SHRINK PITCH

Maximum Seated Height:

1.7 mm

Maximum Supply Voltage (Vsup):

20 V

Minimum Supply Voltage (Vsup):

8 V

Surface Mount:

YES

Temperature Grade:

Terminal Form:

Terminal Pitch:

.65 mm

Terminal Position:

DUAL

Width:

5.6 mm

Trade Compliance

LV4904V General Purpose ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.33.00.01

SB

8542.33.00.00

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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