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LV49821VH

Onsemi

LV49821VH by Onsemi

LV49821VH by Onsemi is a 16-terminal audio amplifier IC with 2 functions. Operating b/w -30 °C to 70°C, it requires a 5V power supply and draws a max current of 13mA. Ideal for audio and video applications, this BICMOS technology chip comes in a small outline package for surface mounting.

Median Price

-

Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 2,144 parts In-Stock

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2,144

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Digiode

USA . 1,153 parts In-Stock

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1,153

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

TANS Electronics

Latvia . 4,129 parts In-Stock

1+ parts

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4,129

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Problanco Electronics

Mexico . 3,785 parts In-Stock

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3,785

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SupplyDigital Components

Austria . 3,295 parts In-Stock

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3,295

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Kulean Microsystems

USA . 1,896 parts In-Stock

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1,896

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Corphita

USA . 1,826 parts In-Stock

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1,826

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Corohmni

South Africa . 428 parts In-Stock

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428

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UHIMA Technologies

Türkiye . 10 parts In-Stock

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10

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Overview

Enhance your audio and video experience with the LV49821VH by Onsemi. As a trusted manufacturer in the industry, Onsemi delivers top-quality amplifiers that are perfect for a wide range of applications. From home entertainment systems to professional audio setups, this product offers exceptional value, benefits, and advantages for customers seeking superior sound performance. Upgrade your sound system today with the LV49821VH and enjoy crystal-clear audio like never before.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Provides durability and ruggedness, making the amplifier suitable for various environments and applications.

Surface Mount: YES

Enables easy installation and allows for space-saving on PCBs.

No. of Functions: 2

Includes multiple functions in a single IC, providing versatility and efficiency in audio amplification.

Package Shape: RECTANGULAR

Facilitates easy placement and integration into circuit designs.

General IC Type: AUDIO AMPLIFIER

Specifically designed for audio applications, ensuring high-quality sound output.

Power Supplies (V): 5

Operates efficiently with a standard 5V power supply, making it compatible with many systems.

No. of Terminals: 16

Offers multiple connection points for enhanced functionality and connectivity.

Package Style (Meter): SMALL OUTLINE, SHRINK PITCH

Compact size and shrink pitch design save space on the PCB, ideal for compact electronic devices.

Maximum Operating Temperature: 70 °C

Can withstand higher operating temperatures, suitable for applications where heat dissipation is a concern.

Minimum Operating Temperature: -30 °C

Can operate in low-temperature environments, providing versatility in various operating conditions.

Terminal Position: DUAL

Dual terminal position allows for better connectivity and ease of installation.

Technology: BICMOS

Utilizes advanced BiCMOS technology for improved performance and power efficiency.

Terminal Form: GULL WING

Gull wing terminal form offers reliable solder connections, ensuring stable operation.

Maximum Supply Current: 13 mA

Efficiently utilizes power with a maximum supply current of 13 mA, suitable for energy-efficient designs.

Terminal Pitch: 0.635 mm

Fine terminal pitch allows for high-density mounting, maximizing the use of available PCB space.

Technical Specifications

Audio & Video Amplifiers LV49821VH attributes and parameters. Explore more Audio & Video Amplifiers devices from Onsemi

Specs

General IC Type:

JESD-30 Code:

R-PDSO-G16

No. of Functions:

2

No. of Terminals:

16

Maximum Operating Temperature:

70 Cel

Minimum Operating Temperature:

-30 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

SSOP16,.25

Package Shape:

Package Style (Meter):

SMALL OUTLINE, SHRINK PITCH

Power Supplies (V):

5

Qualification:

Not Qualified

Sub-Category:

Audio/Video Amplifiers

Maximum Supply Current:

13 mA

Surface Mount:

YES

Technology:

BICMOS

Temperature Grade:

Terminal Form:

Terminal Pitch:

.635 mm

Terminal Position:

DUAL

Trade Compliance

LV49821VH General Purpose ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.33.00.01

SB

8542.33.00.00

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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