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LV4900HR

Onsemi

LV4900HR by Onsemi

LV4900HR by Onsemi is a BICMOS audio amplifier with 2 functions, operating at temperatures from -25 to 70 °C. It has 44 terminals in a small outline package and requires a 12V power supply. Ideal for audio and video amplification applications due to its surface mount capability and gull wing terminal form.

Median Price

-

Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

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Vyrian

USA . 1,413 parts In-Stock

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Digiode

USA . 765 parts In-Stock

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765

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SupplyDigital Components

Austria . 8,017 parts In-Stock

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TANS Electronics

Latvia . 5,332 parts In-Stock

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Kulean Microsystems

USA . 3,960 parts In-Stock

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Problanco Electronics

Mexico . 3,287 parts In-Stock

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UHIMA Technologies

Türkiye . 563 parts In-Stock

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563

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Corohmni

South Africa . 86 parts In-Stock

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Corphita

USA . 55 parts In-Stock

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Overview

Elevate your audio and video experience with the LV4900HR by Onsemi. Crafted with precision and expertise, this audio amplifier delivers unmatched quality and performance in a compact package. Whether you're enhancing your home entertainment system or upgrading your car audio, this versatile amplifier is designed to elevate your listening experience to new heights. With its advanced technology and reliable design, the LV4900HR offers customers exceptional value, benefits, and advantages that will surely impress even the most discerning audiophiles. Experience the difference with Onsemi's top-of-the-line amplifier today.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy material makes the product lightweight and durable, making it easy to handle and less prone to damage.

Surface Mount: YES

Surface mount capability allows for easy installation and integration into various devices or circuits, saving space and reducing assembly time.

No. of Functions: 2

Having 2 functions in a single component provides versatility and flexibility in audio amplification applications, allowing for more customization and functionality.

Package Shape: RECTANGULAR

Rectangular package shape ensures compatibility with standard mounting methods and makes it easier to incorporate into existing designs.

General IC Type: AUDIO AMPLIFIER

Being specifically designed for audio amplification ensures high-quality sound output and performance, making it a suitable choice for audio applications.

Power Supplies (V): 12

Operating at 12V allows for compatibility with a wide range of power sources, making it versatile and suitable for various audio amplifier setups.

No. of Terminals: 44

Having 44 terminals provides ample connection points for various input and output signals, allowing for more complex audio amplification configurations.

Package Style (Meter): SMALL OUTLINE, SHRINK PITCH

The small outline and shrink pitch package style saves space and allows for dense packing, making it ideal for applications with limited space constraints.

Maximum Operating Temperature: 70 °C

Operating at a maximum temperature of 70 °C ensures stability and reliability even under high operating conditions, making it suitable for demanding environments.

Minimum Operating Temperature: -25 °C

The ability to operate at a minimum temperature of -25 °C ensures functionality even in low temperature environments, increasing the product's versatility.

Terminal Position: DUAL

Dual terminal positions offer increased flexibility in terms of connectivity and installation options, making it easier to interface with other components.

Technology: BICMOS

Utilizing BICMOS technology combines the benefits of both bipolar and CMOS technologies, providing high-speed performance and low power consumption for efficient audio amplification.

Terminal Form: GULL WING

Gull wing terminal form provides mechanical strength and solderability, ensuring reliable electrical connections and long-term durability.

Maximum Supply Current: 70 mA

Operating with a maximum supply current of 70 mA ensures energy efficiency and reduces power consumption, making it a cost-effective choice for audio amplification.

Terminal Pitch: 0.8 mm

Having a terminal pitch of 0.8 mm allows for precise and compact placement of terminals, facilitating easy installation and reducing the risk of short circuits.

Technical Specifications

Audio & Video Amplifiers LV4900HR attributes and parameters. Explore more Audio & Video Amplifiers devices from Onsemi

Specs

General IC Type:

JESD-30 Code:

R-PDSO-G44

No. of Functions:

2

No. of Terminals:

44

Maximum Operating Temperature:

70 Cel

Minimum Operating Temperature:

-25 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

SOP44,.4,32

Package Shape:

Package Style (Meter):

SMALL OUTLINE, SHRINK PITCH

Power Supplies (V):

12

Qualification:

Not Qualified

Sub-Category:

Audio/Video Amplifiers

Maximum Supply Current:

70 mA

Surface Mount:

YES

Technology:

BICMOS

Temperature Grade:

Terminal Form:

Terminal Pitch:

.8 mm

Terminal Position:

DUAL

Trade Compliance

LV4900HR General Purpose ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.33.00.01

SB

8542.33.00.00

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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