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LC72137

Onsemi

LC72137 by Onsemi

The Onsemi LC72137 is a CMOS Phase Locked Loop (PLL) with 22 terminals. It operates on 3/3.3V power supplies, has a temp range of -20 to 70 °C, and draws max current of 6mA. Ideal for frequency synthesis circuits in commercial-grade applications due to its rectangular plastic package style.

Median Price

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Lifecycle Status

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3

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1k+

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Vyrian

USA . 1,733 parts In-Stock

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Digiode

USA . 1,694 parts In-Stock

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Cyclops Electronics Ltd

UK . 630 parts In-Stock

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SupplyDigital Components

Austria . 2,786 parts In-Stock

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Problanco Electronics

Mexico . 2,042 parts In-Stock

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TANS Electronics

Latvia . 1,885 parts In-Stock

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Corphita

USA . 1,124 parts In-Stock

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UHIMA Technologies

Türkiye . 597 parts In-Stock

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Corohmni

South Africa . 309 parts In-Stock

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Kulean Microsystems

USA . 289 parts In-Stock

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Overview

Unlock the potential of your electronic devices with the high-quality LC72137 by Onsemi. As a leading manufacturer in Phase Locked Loops (PLL) & Frequency Synthesis Circuits, Onsemi guarantees superior performance and reliability. This versatile product is perfect for a wide range of applications, offering customers exceptional value and benefits. With its innovative technology, the LC72137 ensures precision and efficiency, making it the ideal choice for all your frequency synthesis needs. Trust Onsemi to deliver top-notch products that exceed your expectations.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

This material provides a good balance of durability and cost-effectiveness for the product.

Package Shape: RECTANGULAR

The rectangular shape allows for efficient use of space and easy integration into various electronic systems.

Power Supplies (V): 3/3.3

Having multiple power supply options enables flexibility in different applications and voltage requirements.

No. of Terminals: 22

The high number of terminals allows for multiple connections and functions to be supported within the circuit.

Package Style (Meter): IN-LINE, SHRINK PITCH

The in-line package style with shrink pitch design enhances the overall compactness and efficiency of the product.

Maximum Operating Temperature: 70 °C

The high maximum operating temperature ensures reliable performance even under demanding conditions.

Minimum Operating Temperature: -20 °C

The low minimum operating temperature indicates good performance even in colder environments.

Terminal Position: DUAL

The dual terminal position provides redundancy and options for multiple connection configurations.

Temperature Grade: COMMERCIAL

Being rated for commercial temperature grade indicates suitability for a wide range of commercial applications.

Maximum Supply Current (Isup): 6 mA

The low maximum supply current consumption ensures energy efficiency and minimal power usage.

Technology: CMOS

The CMOS technology offers low power consumption, high noise immunity, and compatibility with a wide range of applications.

Terminal Form: THROUGH-HOLE

The through-hole terminal form provides secure and reliable connections for the circuit components.

Terminal Pitch: 1.78 mm

The small terminal pitch allows for compact layout design and efficient use of space on the circuit board.

Technical Specifications

Phase Locked Loops (PLL) & Frequency Synthesis Circuits LC72137 attributes and parameters. Explore more Phase Locked Loops (PLL) & Frequency Synthesis Circuits devices from Onsemi

Specs

JESD-30 Code:

R-PDIP-T22

No. of Terminals:

22

Maximum Operating Temperature:

70 Cel

Minimum Operating Temperature:

-20 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

SDIP22,.3

Package Shape:

Package Style (Meter):

IN-LINE, SHRINK PITCH

Power Supplies (V):

3/3.3

Qualification:

Not Qualified

Sub-Category:

PLL or Frequency Synthesis Circuits

Maximum Supply Current (Isup):

6 mA

Surface Mount:

NO

Technology:

CMOS

Temperature Grade:

Terminal Form:

THROUGH-HOLE

Terminal Pitch:

1.78 mm

Terminal Position:

DUAL

Trade Compliance

LC72137 Other Function Semiconductors trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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