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LC72121

Onsemi

LC72121 by Onsemi

LC72121 by Onsemi is a Phase Locked Loop (PLL) & Frequency Synthesis Circuit with 22 terminals. It operates at temperatures ranging from -40 to 85 °C and requires power supplies of 3/3.3V. This CMOS technology device in an industrial-grade package is ideal for applications requiring precise frequency control.

Median Price

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Lifecycle Status

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2

In-Stock Inventory

< 1k

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Vyrian

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Digiode

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Kulean Microsystems

USA . 7,681 parts In-Stock

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SupplyDigital Components

Austria . 1,992 parts In-Stock

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Kepictronics

USA . 1,500 parts In-Stock

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Problanco Electronics

Mexico . 1,317 parts In-Stock

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Assy Fe

Spain . 1,000 parts In-Stock

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UHIMA Technologies

Türkiye . 639 parts In-Stock

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TANS Electronics

Latvia . 607 parts In-Stock

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Corphita

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Corohmni

South Africa . 336 parts In-Stock

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Overview

Enhance your electronic designs with the LC72121 from Onsemi. This Phase Locked Loop (PLL) & Frequency Synthesis Circuit offers superior quality and reliability, backed by Onsemi's reputation for excellence in manufacturing. Ideal for a wide range of applications, this product provides precise frequency control and synchronization, ensuring optimal performance across various devices. Don't compromise on quality - choose the LC72121 for unmatched value and benefits that will elevate your projects to the next level.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Plastic/Epoxy material provides durability and reliability, making the product suitable for industrial applications.

Package Shape: RECTANGULAR

Rectangular shape allows for easy integration into circuit designs and PCB layouts.

Power Supplies (V): 3/3.3

Compatible with common power supply voltages, making it easy to integrate into existing systems.

No. of Terminals: 22

Sufficient number of terminals for connectivity options, allowing for versatile usage.

Package Style (Meter): IN-LINE, SHRINK PITCH

In-line package style with shrink pitch design helps in saving space and improving overall system efficiency.

Maximum Operating Temperature: 85 °C

High maximum operating temperature ensures reliable performance even in demanding environmental conditions.

Minimum Operating Temperature: -40 °C

Low minimum operating temperature allows for usage in a wide range of temperature environments.

Terminal Position: DUAL

Dual terminal position provides flexibility in installation and connectivity options.

Temperature Grade: INDUSTRIAL

Industrial-grade temperature grade ensures stability and performance in harsh industrial environments.

Maximum Supply Current (Isup): 6 mA

Low maximum supply current consumption helps in reducing power consumption and improving efficiency.

Technology: CMOS

CMOS technology offers low power consumption and high noise immunity, making the product energy-efficient and reliable.

Terminal Form: THROUGH-HOLE

Through-hole terminal form allows for easy soldering and secure connections, improving overall reliability.

Terminal Pitch: 1.78 mm

Standard terminal pitch size for easy integration into circuit designs and PCB layouts.

Technical Specifications

Phase Locked Loops (PLL) & Frequency Synthesis Circuits LC72121 attributes and parameters. Explore more Phase Locked Loops (PLL) & Frequency Synthesis Circuits devices from Onsemi

Specs

JESD-30 Code:

R-PDIP-T22

No. of Terminals:

22

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

SDIP22,.3

Package Shape:

Package Style (Meter):

IN-LINE, SHRINK PITCH

Power Supplies (V):

3/3.3

Qualification:

Not Qualified

Sub-Category:

PLL or Frequency Synthesis Circuits

Maximum Supply Current (Isup):

6 mA

Surface Mount:

NO

Technology:

CMOS

Temperature Grade:

Terminal Form:

THROUGH-HOLE

Terminal Pitch:

1.78 mm

Terminal Position:

DUAL

Trade Compliance

LC72121 Other Function Semiconductors trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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