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LC72121M

Onsemi

LC72121M by Onsemi

The Onsemi LC72121M is a CMOS Phase Locked Loop (PLL) with 24 terminals and 3/3.3V power supplies. It operates in industrial temperature range (-40 to 85 °C) and has a max supply current of 6mA. This PLL circuit is used for frequency synthesis applications in various electronic devices.

Median Price

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Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

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Vyrian

USA . 2,305 parts In-Stock

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Digiode

USA . 1,053 parts In-Stock

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Kulean Microsystems

USA . 8,364 parts In-Stock

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Problanco Electronics

Mexico . 5,387 parts In-Stock

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Authorized Procurement Solutions

USA . 4,000 parts In-Stock

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TANS Electronics

Latvia . 2,015 parts In-Stock

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Kepictronics

USA . 2,000 parts In-Stock

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Corphita

USA . 1,464 parts In-Stock

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UHIMA Technologies

Türkiye . 683 parts In-Stock

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SupplyDigital Components

Austria . 497 parts In-Stock

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Corohmni

South Africa . 424 parts In-Stock

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Overview

Unlock the full potential of your electronic devices with the LC72121M by Onsemi. As a leading manufacturer in the industry, Onsemi delivers top-quality Phase Locked Loops & Frequency Synthesis Circuits that guarantee precision and reliability. Perfect for a wide range of applications, this product offers exceptional value and benefits, providing customers with seamless performance and unparalleled results. Upgrade your technology with the LC72121M and experience the difference today.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Plastic/Epoxy material provides good durability and protection for the circuits inside the package, ensuring longevity and reliability.

Surface Mount: YES

Surface mount technology allows for easy and efficient installation on circuit boards, saving space and simplifying manufacturing processes.

Package Shape: RECTANGULAR

Rectangular shape is commonly used and fits well in standard circuit board layouts, making integration seamless.

Power Supplies (V): 3/3.3

Compatible with common power supply voltages, ensuring easy integration with existing systems.

No. of Terminals: 24

Sufficient number of terminals for connecting various components and ensuring flexibility in circuit design.

Package Style (Meter): SMALL OUTLINE, SHRINK PITCH

Small outline and shrink pitch package style saves space on the circuit board and allows for dense packing of components.

Maximum Operating Temperature: 85 °C

High maximum operating temperature ensures reliability in a wide range of environmental conditions.

Minimum Operating Temperature: -40 °C

Low minimum operating temperature allows for use in harsh environments or extreme conditions without performance degradation.

Terminal Position: DUAL

Dual terminal position provides redundancy and improves connectivity reliability.

Temperature Grade: INDUSTRIAL

Industrial temperature grade ensures stable performance in demanding industrial applications.

Maximum Supply Current (Isup): 6 mA

Low maximum supply current consumption helps in minimizing power usage and heat dissipation.

Technology: CMOS

CMOS technology offers low power consumption, high noise immunity, and compatibility with a wide range of devices.

Terminal Form: GULL WING

Gull wing terminal form provides reliable solder connections, making installation easier and ensuring robust electrical connections.

Terminal Pitch: 1 mm

Fine terminal pitch allows for high-density integration on the circuit board without sacrificing connectivity or reliability.

Technical Specifications

Phase Locked Loops (PLL) & Frequency Synthesis Circuits LC72121M attributes and parameters. Explore more Phase Locked Loops (PLL) & Frequency Synthesis Circuits devices from Onsemi

Specs

JESD-30 Code:

R-PDSO-G24

No. of Terminals:

24

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

SOP24,.3,40

Package Shape:

Package Style (Meter):

SMALL OUTLINE, SHRINK PITCH

Power Supplies (V):

3/3.3

Qualification:

Not Qualified

Sub-Category:

PLL or Frequency Synthesis Circuits

Maximum Supply Current (Isup):

6 mA

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Form:

GULL WING

Terminal Pitch:

1 mm

Terminal Position:

DUAL

Trade Compliance

LC72121M Other Function Semiconductors trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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