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LMX2487ESQX/NOPB

Texas Instruments

LMX2487ESQX/NOPB by Texas Instruments

LMX2487ESQX/NOPB by Texas Instruments is a PLL frequency synthesizer with 24 terminals, operating at 3V. It has a wide temperature range from -40 to 85°C and is suitable for industrial applications. This chip carrier package with a very thin profile is surface mountable and features matte tin terminal finish.

Median Price

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Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 8,231 parts In-Stock

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Anansix

USA . 1,711 parts In-Stock

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1,711

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Digiode

USA . 1,165 parts In-Stock

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1,165

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Distributors (Availability)

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One Stop Electronics

USA . 1,636 parts In-Stock

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$7.500

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1,636

$7.500

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AZTECH Wire

Italy . 639 parts In-Stock

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$15.502

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639

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Parana Technologies

USA . 1,155 parts In-Stock

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$17.199

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$17.413

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1,155

$17.199

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$17.413

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ChromeModa Solutions

Germany . 6,060 parts In-Stock

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$19.325

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$15.846

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6,060

$19.325

$15.846

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IDEA Electronic Components Group

UK . 1,113 parts In-Stock

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$19.325

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$18.359

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$17.392

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1,113

$19.325

$18.359

$17.392

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Advanced Electronics

New Zealand . 500 parts In-Stock

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$28.418

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$25.860

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$23.303

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500

$28.418

$25.860

$23.303

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QUARKTWIN TECHNOLOGY LTD

USA . 3,827 parts In-Stock

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Corphita

USA . 2,557 parts In-Stock

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DigiPath Technology Company

USA . 2,135 parts In-Stock

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$17.423

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$17.423

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Microchip USA

USA . 300 parts In-Stock

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Overview

Unlock the power of precise frequency control with the LMX2487ESQX/NOPB by Texas Instruments. Crafted with high-quality materials and advanced technology, this Phase Locked Loop (PLL) & Frequency Synthesis Circuit offers unparalleled performance and reliability. Perfect for a wide range of applications, this innovative product ensures seamless operation and optimal efficiency. Experience the value and benefits of superior engineering with the LMX2487ESQX/NOPB, providing customers with a competitive edge in their projects. Elevate your designs with Texas Instruments' cutting-edge solutions.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

This material is lightweight, durable, and cost-effective, making the product easy to handle and resistant to damage during handling and shipping.

Surface Mount: YES

Surface mount technology allows for easier and more reliable assembly processes, reducing assembly time and potential human error.

Nominal Supply Voltage (Vsup): 3 V

A standard supply voltage of 3V makes the product compatible with a wide range of applications, providing flexibility and ease of integration.

Maximum Operating Temperature: 85 °C

With a high maximum operating temperature, the product can function reliably in a variety of environmental conditions, ensuring long-term performance and durability.

Terminal Finish: MATTE TIN

Matte tin finish provides good solderability and corrosion resistance, ensuring solid connections and reliability in electronic circuits.

Temperature Grade: INDUSTRIAL

Industrial-grade temperature rating means the product can operate effectively in harsh industrial environments, providing reliability and longevity in demanding applications.

Moisture Sensitivity Level (MSL): 3

MSL 3 indicates that the product is moderately sensitive to moisture, making it suitable for a wide range of storage and handling conditions without compromising performance.

Technical Specifications

Phase Locked Loops (PLL) & Frequency Synthesis Circuits LMX2487ESQX/NOPB attributes and parameters. Explore more Phase Locked Loops (PLL) & Frequency Synthesis Circuits devices from Texas Instruments

Specs

Additional Features:

QUADRUPLE MODULUS PRESCALER (RF):16/17/20/21 OR 32/33/36/37

Other IC type:

JESD-30 Code:

S-PQCC-N24

JESD-609 Code:

e3

Length:

4 mm

Moisture Sensitivity Level (MSL):

3

No. of Functions:

1

No. of Terminals:

24

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

LCC24,.16SQ,20

Package Shape:

Package Style (Meter):

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

Peak Reflow Temperature (C):

260

Power Supplies (V):

3

Qualification:

Not Qualified

Maximum Seated Height:

.8 mm

Sub-Category:

PLL or Frequency Synthesis Circuits

Maximum Supply Voltage (Vsup):

3.6 V

Minimum Supply Voltage (Vsup):

2.5 V

Nominal Supply Voltage (Vsup):

3 V

Surface Mount:

YES

Temperature Grade:

Terminal Finish:

MATTE TIN

Terminal Form:

NO LEAD

Terminal Pitch:

.5 mm

Terminal Position:

QUAD

Maximum Time At Peak Reflow Temperature (s):

30

Width (mm):

4 mm

Trade Compliance

LMX2487ESQX/NOPB Other Function Semiconductors trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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