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LMX1501AM

Texas Instruments

LMX1501AM by Texas Instruments

LMX1501AM by Texas Instruments is a PLL frequency synthesizer with 16 terminals, operating at temperatures from -40 to 85°C. It has a supply voltage range of 2.7-5.5V and uses BICMOS technology. This rectangular package is surface-mountable and ideal for industrial applications requiring precise frequency synthesis.

Median Price

$11.030

Lifecycle Status

Suppliers In-Stock

12

In-Stock Inventory

1k+

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Forefront Electronics and Design

USA . 7 parts In-Stock

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$11.030

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Vyrian

USA . 8,818 parts In-Stock

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Digiode

USA . 4,799 parts In-Stock

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PC Components Company LLC

USA . 3,821 parts In-Stock

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Bristol Electronics

USA . 3,821 parts In-Stock

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Anansix

USA . 1,021 parts In-Stock

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A2Z Electronics, Inc.

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Prism Electronics

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Connector Distribution Corp

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Right Parts Inc.

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Inland Empire Components Inc.

USA . 7 parts In-Stock

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R&J Components

USA . 5 parts In-Stock

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Parana Technologies

USA . 1,233 parts In-Stock

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$0.983

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$1.874

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$0.983

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DigiPath Technology Company

USA . 662 parts In-Stock

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$1.083

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$0.996

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662

$1.083

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ChromeModa Solutions

Germany . 3,756 parts In-Stock

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$1.105

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$0.906

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IDEA Electronic Components Group

UK . 708 parts In-Stock

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$1.105

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$0.994

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One Stop Electronics

USA . 1,642 parts In-Stock

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$3.500

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AZTECH Wire

Italy . 669 parts In-Stock

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$8.380

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Lixinc

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Alle Elektronik GmbH

Germany . 3,877 parts In-Stock

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Corphita

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Authorized Procurement Solutions

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Kepictronics

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Perfect Parts

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Overview

Unlock the power of precision frequency synthesis with the LMX1501AM by Texas Instruments. Manufactured to the highest standards, this Phase Locked Loop (PLL) circuit offers unparalleled accuracy and reliability for a wide range of applications. From telecommunications to radar systems, this versatile device delivers superior performance in a compact package, making it the go-to choice for engineers seeking top-tier solutions. Trust in Texas Instruments for cutting-edge technology that meets your needs.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Provides durability and reliability for the product

Surface Mount: YES

Allows for easier and more efficient PCB assembly

Nominal Supply Voltage (Vsup): 5 V

Compatible with common voltage standards, making it versatile

Maximum Operating Temperature: 85 °C

Can withstand high temperatures, suitable for industrial applications

Technology: BICMOS

Utilizes a combination of bipolar and CMOS technology for improved performance

Technical Specifications

Phase Locked Loops (PLL) & Frequency Synthesis Circuits LMX1501AM attributes and parameters. Explore more Phase Locked Loops (PLL) & Frequency Synthesis Circuits devices from Texas Instruments

Specs

Additional Features:

7-BIT AUXILIARY INPUT COUNTER; SELECTABLE 64/65 OR 128/129 PRESCALER

Other IC type:

JESD-30 Code:

R-PDSO-G16

JESD-609 Code:

e0

Length:

9.9 mm

No. of Functions:

1

No. of Terminals:

16

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

SOP

Package Equivalence Code:

SOP16,.25

Package Shape:

Package Style (Meter):

SMALL OUTLINE

Power Supplies (V):

3/5

Qualification:

Not Qualified

Maximum Seated Height:

1.75 mm

Sub-Category:

PLL or Frequency Synthesis Circuits

Maximum Supply Voltage (Vsup):

5.5 V

Minimum Supply Voltage (Vsup):

2.7 V

Nominal Supply Voltage (Vsup):

5 V

Surface Mount:

YES

Technology:

BICMOS

Temperature Grade:

Terminal Finish:

Tin/Lead (Sn/Pb)

Terminal Form:

GULL WING

Terminal Pitch:

1.27 mm

Terminal Position:

DUAL

Width (mm):

3.9 mm

Trade Compliance

LMX1501AM Other Function Semiconductors trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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