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SN74LV4046APWRG4

Texas Instruments

SN74LV4046APWRG4 by Texas Instruments

SN74LV4046APWRG4 by Texas Instruments is a Phase Locked Loop (PLL) IC with 16 terminals, operating voltage of 3.3/5V, and temperature range of -40 to 85°C. It is used in frequency synthesis circuits for industrial applications requiring precise frequency control and synchronization.

Median Price

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Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 8,056 parts In-Stock

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8,056

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Digiode

USA . 3,509 parts In-Stock

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3,509

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Distributors (Availability)

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Ampacity Inc.

Singapore . 623 parts In-Stock

1+ parts

$0.500

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623

$0.500

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One Stop Electronics

USA . 426 parts In-Stock

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$2.500

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426

$2.500

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Semicontronic

India . 244 parts In-Stock

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$5.500

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$5.362

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$5.335

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244

$5.500

$5.362

$5.335

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AZTECH Wire

Italy . 500 parts In-Stock

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$7.907

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500

$7.907

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Parana Technologies

USA . 911 parts In-Stock

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$13.330

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$13.840

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911

$13.330

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$13.840

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DigiPath Technology Company

USA . 2,200 parts In-Stock

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$14.677

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2,200

$14.677

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IDEA Electronic Components Group

UK . 1,987 parts In-Stock

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$14.977

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$14.228

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$13.479

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1,987

$14.977

$14.228

$13.479

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ChromeModa Solutions

Germany . 1,155 parts In-Stock

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$14.977

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$12.281

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1,155

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$12.281

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Corphita

USA . 488 parts In-Stock

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Corohmni

South Africa . 102 parts In-Stock

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Overview

Unlock the power of precise frequency synthesis with the SN74LV4046APWRG4 by Texas Instruments. Crafted with quality and expertise, this Phase Locked Loop (PLL) offers unparalleled performance in a compact package. Ideal for industrial applications, this innovative circuit ensures reliable operation even in extreme temperatures. Experience seamless integration and superior functionality with Texas Instruments' SN74LV4046APWRG4. Elevate your projects with precision and efficiency today.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Plastic/Epoxy material provides durability and protects the internal components of the product, ensuring a longer lifespan.

Surface Mount: YES

Surface mount technology allows for easy and efficient installation on circuit boards, saving time and effort during assembly.

Nominal Supply Voltage (Vsup): 3.6 V

Optimal supply voltage of 3.6 V ensures stable and reliable performance of the product.

Maximum Operating Temperature: 85 °C

High maximum operating temperature of 85°C allows the product to function effectively even in challenging environmental conditions.

Technology: CMOS

CMOS technology offers low power consumption and high noise immunity, making the product energy-efficient and reliable.

Technical Specifications

Phase Locked Loops (PLL) & Frequency Synthesis Circuits SN74LV4046APWRG4 attributes and parameters. Explore more Phase Locked Loops (PLL) & Frequency Synthesis Circuits devices from Texas Instruments

Specs

Other IC type:

JESD-30 Code:

R-PDSO-G16

JESD-609 Code:

e4

Length:

5 mm

Moisture Sensitivity Level (MSL):

1

No. of Functions:

1

No. of Terminals:

16

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

TSSOP16,.25

Package Shape:

Package Style (Meter):

SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

Peak Reflow Temperature (C):

260

Power Supplies (V):

3.3/5

Qualification:

Not Qualified

Maximum Seated Height:

1.2 mm

Sub-Category:

PLL or Frequency Synthesis Circuits

Maximum Supply Voltage (Vsup):

5.5 V

Minimum Supply Voltage (Vsup):

3 V

Nominal Supply Voltage (Vsup):

3.6 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

NICKEL PALLADIUM GOLD

Terminal Form:

GULL WING

Terminal Pitch:

.65 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

30

Width (mm):

4.4 mm

Trade Compliance

SN74LV4046APWRG4 Other Function Semiconductors trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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