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UC3634DW

Texas Instruments

UC3634DW by Texas Instruments

The Texas Instruments UC3634DW is a PLL frequency synthesizer IC with 16 terminals, operating voltage of 8-15V. It features a small outline package, dual terminal position, and operates b/w 0-70°C. Ideal for applications requiring precise frequency synthesis in commercial-grade electronics.

Median Price

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Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 6,984 parts In-Stock

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6,984

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Digiode

USA . 253 parts In-Stock

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253

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Semicontronic

India . 431 parts In-Stock

1+ parts

$3.500

100+ parts

$3.412

1k+ parts

$3.395

10k+ parts

-

431

$3.500

$3.412

$3.395

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One Stop Electronics

USA . 1,553 parts In-Stock

1+ parts

$5.500

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1,553

$5.500

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Ampacity Inc.

Singapore . 216 parts In-Stock

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$5.500

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216

$5.500

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AZTECH Wire

Italy . 225 parts In-Stock

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$15.924

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225

$15.924

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Parana Technologies

USA . 1,476 parts In-Stock

1+ parts

$21.116

100+ parts

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$21.379

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1,476

$21.116

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$21.379

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DigiPath Technology Company

USA . 2,325 parts In-Stock

1+ parts

$23.251

100+ parts

$21.391

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2,325

$23.251

$21.391

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IDEA Electronic Components Group

UK . 2,216 parts In-Stock

1+ parts

$23.726

100+ parts

$22.540

1k+ parts

$21.353

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2,216

$23.726

$22.540

$21.353

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ChromeModa Solutions

Germany . 906 parts In-Stock

1+ parts

$23.726

100+ parts

$19.455

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906

$23.726

$19.455

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Corphita

USA . 1,143 parts In-Stock

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1,143

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Corohmni

South Africa . 95 parts In-Stock

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95

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Overview

Unlock a world of precision frequency control with the UC3634DW from Texas Instruments. As a leader in Phase Locked Loops (PLL) & Frequency Synthesis Circuits, Texas Instruments delivers top-quality products that guarantee reliability and performance. Perfect for applications requiring precise frequency synchronization, this small outline package offers customers a compact solution with a wide supply voltage range and commercial-grade temperature operation. Trust Texas Instruments to provide cutting-edge technology that meets your needs with the UC3634DW.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The plastic/epoxy material used for the package body provides good mechanical strength while keeping the overall weight of the product low.

Surface Mount: YES

Surface mount capability allows for easy and efficient PCB assembly, saving time and effort during manufacturing.

Nominal Supply Voltage (Vsup): 12 V

A common 12V supply voltage makes integration with existing systems simpler and more convenient.

Maximum Operating Temperature: 70 °C

The high maximum operating temperature of 70°C ensures reliable performance even under harsh operating conditions.

Minimum Operating Temperature: 0 °C

The low minimum operating temperature of 0°C allows for use in a wide range of environmental conditions.

Technology: BIPOLAR

The use of bipolar technology contributes to high performance and stability of the frequency synthesis circuits.

Technical Specifications

Phase Locked Loops (PLL) & Frequency Synthesis Circuits UC3634DW attributes and parameters. Explore more Phase Locked Loops (PLL) & Frequency Synthesis Circuits devices from Texas Instruments

Specs

Additional Features:

MOTION CONTROL APPLICATIONS

Other IC type:

JESD-30 Code:

R-PDSO-G16

Length:

10.365 mm

No. of Functions:

1

No. of Terminals:

16

Maximum Operating Temperature:

70 Cel

Minimum Operating Temperature:

0 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

SOP

Package Equivalence Code:

SOP16,.4

Package Shape:

Package Style (Meter):

SMALL OUTLINE

Peak Reflow Temperature (C):

NOT SPECIFIED

Power Supplies (V):

12

Qualification:

Not Qualified

Maximum Seated Height:

2.64 mm

Sub-Category:

PLL or Frequency Synthesis Circuits

Maximum Supply Voltage (Vsup):

15 V

Minimum Supply Voltage (Vsup):

8 V

Nominal Supply Voltage (Vsup):

12 V

Surface Mount:

YES

Technology:

BIPOLAR

Temperature Grade:

Terminal Form:

GULL WING

Terminal Pitch:

1.27 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

NOT SPECIFIED

Width (mm):

7.5 mm

Trade Compliance

UC3634DW Other Function Semiconductors trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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