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LMX2335TMX

Texas Instruments

LMX2335TMX by Texas Instruments

LMX2335TMX by Texas Instruments is a PLL frequency synthesizer with 16 terminals, operating at a voltage range of 2.7V to 5.5V. It features BICMOS technology, GULL WING terminal form, and a small outline package suitable for industrial applications requiring precise frequency synthesis in the temperature range of -40°C to 85°C.

Median Price

$6.950

Lifecycle Status

Suppliers In-Stock

7

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

DF Sales Co.

USA . 1,140 parts In-Stock

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$6.950

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$6.950

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DF Sales Co.

USA . 1,140 parts In-Stock

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$6.950

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1,140

$6.950

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Vyrian

USA . 8,149 parts In-Stock

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8,149

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Digiode

USA . 2,936 parts In-Stock

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2,936

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Anansix

USA . 2,709 parts In-Stock

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2,709

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Bristol Electronics

USA . 255 parts In-Stock

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255

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Extreme Components

USA . 134 parts In-Stock

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134

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

One Stop Electronics

USA . 869 parts In-Stock

1+ parts

$4.500

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869

$4.500

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AZTECH Wire

Italy . 479 parts In-Stock

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$9.938

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479

$9.938

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Parana Technologies

USA . 325 parts In-Stock

1+ parts

$16.307

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$16.614

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325

$16.307

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$16.614

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DigiPath Technology Company

USA . 2,086 parts In-Stock

1+ parts

$17.957

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$16.520

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2,086

$17.957

$16.520

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ChromeModa Solutions

Germany . 4,489 parts In-Stock

1+ parts

$18.323

100+ parts

$15.025

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4,489

$18.323

$15.025

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IDEA Electronic Components Group

UK . 862 parts In-Stock

1+ parts

$18.323

100+ parts

$17.407

1k+ parts

$16.491

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862

$18.323

$17.407

$16.491

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Corphita

USA . 5,032 parts In-Stock

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Overview

Elevate your electronic designs with the LMX2335TMX by Texas Instruments. Crafted with precision and expertise, this Phase Locked Loop (PLL) & Frequency Synthesis Circuit offers unmatched performance and reliability. Ideal for a wide range of applications, this compact and efficient device provides seamless frequency synthesis while maintaining optimal power consumption. Trust in Texas Instruments to deliver superior quality and innovation. Upgrade your projects today with the LMX2335TMX and experience unparalleled value and benefits like never before.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

This material provides a lightweight and durable package for the product, making it suitable for various applications.

Surface Mount: YES

The surface mount feature allows for easy and efficient assembly on circuit boards, saving time and reducing costs.

Nominal Supply Voltage (Vsup): 5 V

The 5V supply voltage ensures compatibility with standard power sources, making integration into existing systems straightforward.

No. of Terminals: 16

With 16 terminals, this product offers versatility in connectivity options, allowing for flexible usage in different circuits.

Maximum Operating Temperature: 85 °C

The high maximum operating temperature of 85°C ensures reliable performance even in demanding environmental conditions.

Technology: BICMOS

The BICMOS technology used in this product provides a good balance between high-speed performance and low power consumption, making it efficient in various applications.

Technical Specifications

Phase Locked Loops (PLL) & Frequency Synthesis Circuits LMX2335TMX attributes and parameters. Explore more Phase Locked Loops (PLL) & Frequency Synthesis Circuits devices from Texas Instruments

Specs

Other IC type:

JESD-30 Code:

R-PDSO-G16

JESD-609 Code:

e0

Length:

5 mm

No. of Functions:

1

No. of Terminals:

16

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

TSSOP20,.25

Package Shape:

Package Style (Meter):

SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

Power Supplies (V):

3/5

Qualification:

Not Qualified

Maximum Seated Height:

1.1 mm

Sub-Category:

PLL or Frequency Synthesis Circuits

Maximum Supply Current (Isup):

12 mA

Maximum Supply Voltage (Vsup):

5.5 V

Minimum Supply Voltage (Vsup):

2.7 V

Nominal Supply Voltage (Vsup):

5 V

Surface Mount:

YES

Technology:

BICMOS

Temperature Grade:

Terminal Finish:

Tin/Lead (Sn/Pb)

Terminal Form:

GULL WING

Terminal Pitch:

.65 mm

Terminal Position:

DUAL

Width (mm):

4.4 mm

Trade Compliance

LMX2335TMX Other Function Semiconductors trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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