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CD74HCT7046AMTG4

Texas Instruments

CD74HCT7046AMTG4 by Texas Instruments

CD74HCT7046AMTG4 by Texas Instruments is a Phase Locked Loop IC with 16 terminals, operating at 5V. It has a temperature range of -55 to 125°C and is suitable for military-grade applications requiring PLL & frequency synthesis circuits in compact designs. The package style is small outline, making it ideal for surface mount PCBs.

Median Price

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Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

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Vyrian

USA . 6,017 parts In-Stock

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Digiode

USA . 838 parts In-Stock

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Native Components

USA . 458 parts In-Stock

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$0.552

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$0.552

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Northwest PG Solutions

USA . 848 parts In-Stock

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$0.607

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Corohmni

South Africa . 150 parts In-Stock

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$1.365

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One Stop Electronics

USA . 1,269 parts In-Stock

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$2.500

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Parana Technologies

USA . 751 parts In-Stock

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$3.446

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$3.972

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751

$3.446

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ChromeModa Solutions

Germany . 4,020 parts In-Stock

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$3.872

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$3.175

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IDEA Electronic Components Group

UK . 1,556 parts In-Stock

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$3.872

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$3.485

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AZTECH Wire

Italy . 621 parts In-Stock

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$6.294

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Semicontronic

India . 1,483 parts In-Stock

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$6.500

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$6.338

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$6.305

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Ampacity Inc.

Singapore . 1,440 parts In-Stock

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$7.500

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Advanced Electronics

New Zealand . 2,500 parts In-Stock

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$26.434

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$21.676

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DigiPath Technology Company

USA . 2,258 parts In-Stock

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Corphita

USA . 2,258 parts In-Stock

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Overview

Unlock the potential of your electronic designs with the CD74HCT7046AMTG4 by Texas Instruments. Renowned for their high-quality components, Texas Instruments delivers superior performance and reliability in the realm of Phase Locked Loops & Frequency Synthesis Circuits. This versatile product offers customers unparalleled value, providing precise frequency control and synchronization for a wide range of applications. Trust in Texas Instruments to elevate your projects to new heights of efficiency and innovation.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Plastic/epoxy material is cost-effective and widely available, making the product affordable and easy to obtain.

Surface Mount: YES

Surface mount technology allows for compact and efficient placement of the component on a PCB, saving space and simplifying assembly processes.

Nominal Supply Voltage (Vsup): 5 V

Operating at a standard supply voltage of 5V makes integration into existing systems straightforward and compatible with many other components.

Maximum Operating Temperature: 125 °C

The high maximum operating temperature ensures the reliability and durability of the product in demanding conditions.

Minimum Operating Temperature: -55 °C

The wide range of minimum operating temperature allows the product to function effectively in both extreme cold and hot environments.

Technology: CMOS

CMOS technology provides low power consumption and high noise immunity, making the product efficient and reliable in various applications.

Maximum Seated Height: 1.75 mm

The low seated height of the package allows for a slim and compact design, ideal for space-constrained applications.

Technical Specifications

Phase Locked Loops (PLL) & Frequency Synthesis Circuits CD74HCT7046AMTG4 attributes and parameters. Explore more Phase Locked Loops (PLL) & Frequency Synthesis Circuits devices from Texas Instruments

Specs

Other IC type:

JESD-30 Code:

R-PDSO-G16

JESD-609 Code:

e4

Length:

9.9 mm

Moisture Sensitivity Level (MSL):

1

No. of Functions:

1

No. of Terminals:

16

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-55 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

SOP

Package Equivalence Code:

SOP16,.25

Package Shape:

Package Style (Meter):

SMALL OUTLINE

Peak Reflow Temperature (C):

260

Power Supplies (V):

5

Qualification:

Not Qualified

Maximum Seated Height:

1.75 mm

Sub-Category:

PLL or Frequency Synthesis Circuits

Maximum Supply Voltage (Vsup):

5.5 V

Minimum Supply Voltage (Vsup):

4.5 V

Nominal Supply Voltage (Vsup):

5 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

NICKEL PALLADIUM GOLD

Terminal Form:

GULL WING

Terminal Pitch:

1.27 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

30

Width (mm):

3.9 mm

Trade Compliance

CD74HCT7046AMTG4 Other Function Semiconductors trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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