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MC74HC4046ADG

Onsemi

MC74HC4046ADG by Onsemi

MC74HC4046ADG by Onsemi is a Phase Locked Loop (PLL) IC with 16 terminals. It operates at supply voltages ranging from 2V to 6V and has a temperature range of -55°C to 125°C. This CMOS technology-based IC is ideal for frequency synthesis circuits in military-grade applications.

Median Price

$29.500

Lifecycle Status

Suppliers In-Stock

6

In-Stock Inventory

1k+

Distributors (In-Stock)

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NAC Semi

USA . 33 parts In-Stock

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$29.500

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Vyrian

USA . 6,347 parts In-Stock

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Digiode

USA . 2,261 parts In-Stock

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Chip Stock

USA . 944 parts In-Stock

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Nova Conductors

Japan . 700 parts In-Stock

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700

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Velocity Electronics

USA . 83 parts In-Stock

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83

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Semicontronic

India . 245 parts In-Stock

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$5.500

100+ parts

$5.362

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$5.335

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245

$5.500

$5.362

$5.335

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AZTECH Wire

Italy . 428 parts In-Stock

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$7.352

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428

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Ampacity Inc.

Singapore . 810 parts In-Stock

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$7.500

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810

$7.500

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Advanced Electronics

New Zealand . 150 parts In-Stock

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$9.734

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$8.858

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$7.982

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150

$9.734

$8.858

$7.982

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Aztec Data Supply Inc.

USA . 3,375 parts In-Stock

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$23.792

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$23.792

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RC Electronics

USA . 40,130 parts In-Stock

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$1.870

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$1.710

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$1.660

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$1.660

Lixinc

USA . 17,785 parts In-Stock

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Perfect Parts

USA . 10,899 parts In-Stock

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Argo Parts USA

USA . 3,517 parts In-Stock

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Continental Prestige Electronics

USA . 3,203 parts In-Stock

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Problanco Electronics

Mexico . 2,618 parts In-Stock

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Kulean Microsystems

USA . 2,259 parts In-Stock

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SupplyDigital Components

Austria . 1,804 parts In-Stock

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TANS Electronics

Latvia . 1,603 parts In-Stock

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Corphita

USA . 1,595 parts In-Stock

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Bastille Electronics

Australia . 870 parts In-Stock

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UHIMA Technologies

Türkiye . 849 parts In-Stock

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Corohmni

South Africa . 346 parts In-Stock

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Microchip USA

USA . 146 parts In-Stock

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Overview

Unlock the power of precise frequency control with the MC74HC4046ADG by Onsemi. As a leader in Phase Locked Loops (PLL) & Frequency Synthesis Circuits, Onsemi delivers unmatched quality and reliability. Ideal for a wide range of applications, this product offers customers exceptional value with its small outline package and wide operating temperature range. Experience seamless performance and enhanced functionality with the MC74HC4046ADG from Onsemi.

Feature Benefit Bullets

Package Body Material:

PLASTIC/EPOXY - Provides durability and protection for the circuit within.

Surface Mount:

YES - Allows for easy and efficient installation on circuit boards.

Package Shape:

RECTANGULAR - Makes it easy to fit into existing designs and layouts.

Nominal Supply Voltage (Vsup):

4.5 V - Suitable for a wide range of applications and power sources.

Power Supplies (V):

2/6 - Offers flexibility in power input options for different systems.

No. of Terminals:

16 - Provides ample connectivity for various components and peripherals.

Package Style (Meter):

SMALL OUTLINE - Saves space on the circuit board, ideal for compact designs.

Maximum Operating Temperature:

125 °C - Ensures reliability and stability in high-temperature environments.

Minimum Operating Temperature:

55 °C - Can withstand extreme cold conditions without malfunctioning.

Terminal Finish:

TIN - Ensures good conductivity and prevents corrosion for long-term use.

Terminal Position:

DUAL - Allows for easy and secure connection to other components in the circuit.

Maximum Seated Height:

1.75 mm - Low profile design enables use in slim devices or compact spaces.

Width (mm):

3.9 mm - Ideal size for fitting into tight spaces or densely populated circuit boards.

Other IC type:

PHASE LOCKED LOOP - Offers precise frequency control and synchronization in electronic systems.

Minimum Supply Voltage (Vsup):

2 V - Can operate efficiently with low power input, ideal for energy-saving applications.

Maximum Time At Peak Reflow Temperature (s):

30 - Provides a stable connection during soldering for reliable performance.

Peak Reflow Temperature °C:

260 - Withstands high-temperature soldering processes without damage.

Length:

9.9 mm - Compact size for easy integration into various electronic devices and systems.

Temperature Grade:

MILITARY - Meets rigorous standards for reliability and performance in demanding environments.

Technology:

CMOS - Utilizes low power consumption and high noise immunity for efficient operation.

Terminal Form:

GULL WING - Ensures secure and reliable connections on the circuit board.

Terminal Pitch:

1.27 mm - Allows for easy alignment and soldering during assembly.

Maximum Supply Voltage (Vsup):

6 V - Supports a wide range of power sources, offering versatility in usage.

Technical Specifications

Phase Locked Loops (PLL) & Frequency Synthesis Circuits MC74HC4046ADG attributes and parameters. Explore more Phase Locked Loops (PLL) & Frequency Synthesis Circuits devices from Onsemi

Specs

Additional Features:

CONTAINS THREE PHASE COMPARATORS

Other IC type:

JESD-30 Code:

R-PDSO-G16

JESD-609 Code:

e3

Length:

9.9 mm

Moisture Sensitivity Level (MSL):

1

No. of Functions:

1

No. of Terminals:

16

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-55 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

SOP

Package Equivalence Code:

SOP16,.25

Package Shape:

Package Style (Meter):

SMALL OUTLINE

Peak Reflow Temperature (C):

260

Power Supplies (V):

2/6

Qualification:

Not Qualified

Maximum Seated Height:

1.75 mm

Sub-Category:

PLL or Frequency Synthesis Circuits

Maximum Supply Voltage (Vsup):

6 V

Minimum Supply Voltage (Vsup):

2 V

Nominal Supply Voltage (Vsup):

4.5 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

TIN

Terminal Form:

GULL WING

Terminal Pitch:

1.27 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

30

Width (mm):

3.9 mm

Trade Compliance

MC74HC4046ADG Other Function Semiconductors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

NSN

5962-01-599-5558, 5962015995558

NIIN

015995558

PCN

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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