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MC74HC4046ADTG

Onsemi

MC74HC4046ADTG by Onsemi

MC74HC4046ADTG by Onsemi is a 16-terminal PLL IC with Vsup ranging from 2V to 6V. It operates in temperatures from -55°C to 125°C, ideal for military-grade applications. The compact rectangular package with gull wing terminals makes it suitable for surface mount designs.

Median Price

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Lifecycle Status

Suppliers In-Stock

5

In-Stock Inventory

1k+

Distributors (In-Stock)

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Vyrian

USA . 9,492 parts In-Stock

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Digiode

USA . 1,849 parts In-Stock

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USA . 1,125 parts In-Stock

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Nova Conductors

Japan . 100 parts In-Stock

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Carlin Systems, Inc.

USA . 5 parts In-Stock

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Ampacity Inc.

Singapore . 1,235 parts In-Stock

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$3.500

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AZTECH Wire

Italy . 733 parts In-Stock

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$14.156

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Microchip USA

USA . 6,231 parts In-Stock

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SupplyDigital Components

Austria . 5,843 parts In-Stock

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Kulean Microsystems

USA . 3,733 parts In-Stock

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Perfect Parts

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Problanco Electronics

Mexico . 2,021 parts In-Stock

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Aranea Global

USA . 2,000 parts In-Stock

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Corphita

USA . 610 parts In-Stock

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TANS Electronics

Latvia . 492 parts In-Stock

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Corohmni

South Africa . 476 parts In-Stock

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UHIMA Technologies

Türkiye . 155 parts In-Stock

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Overview

Unlock precise frequency control and synchronization with the MC74HC4046ADTG by Onsemi. As a leading manufacturer in Phase Locked Loops (PLL) & Frequency Synthesis Circuits, Onsemi ensures top-notch quality and reliability. This versatile component is perfect for applications requiring accurate signal generation, such as telecommunications, radar systems, and frequency synthesizers. Experience seamless integration and optimal performance with Onsemi's MC74HC4046ADTG, delivering unmatched value and benefits to meet your circuit design needs.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Provides durability and protection for the internal components of the PLL and frequency synthesis circuits.

Surface Mount: YES

Enables easy installation and saves space on the PCB, making it ideal for compact electronic devices.

Nominal Supply Voltage (Vsup): 4.5 V

Optimal voltage level for efficient performance and power consumption of the circuits.

Maximum Operating Temperature: 125 °C

Ensures reliable operation even in high-temperature environments.

Minimum Operating Temperature: -55 °C

Allows the product to function in extremely cold conditions without any issues.

Technology: CMOS

Utilizes Complementary Metal-Oxide-Semiconductor technology for high-speed operation and low power consumption.

Technical Specifications

Phase Locked Loops (PLL) & Frequency Synthesis Circuits MC74HC4046ADTG attributes and parameters. Explore more Phase Locked Loops (PLL) & Frequency Synthesis Circuits devices from Onsemi

Specs

Other IC type:

JESD-30 Code:

R-PDSO-G16

JESD-609 Code:

e4

Length:

5 mm

Moisture Sensitivity Level (MSL):

1

No. of Functions:

1

No. of Terminals:

16

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-55 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

TSSOP16,.25

Package Shape:

Package Style (Meter):

SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

Peak Reflow Temperature (C):

260

Power Supplies (V):

2/6

Qualification:

Not Qualified

Maximum Seated Height:

1.2 mm

Sub-Category:

PLL or Frequency Synthesis Circuits

Maximum Supply Voltage (Vsup):

6 V

Minimum Supply Voltage (Vsup):

2 V

Nominal Supply Voltage (Vsup):

4.5 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

NICKEL PALLADIUM GOLD

Terminal Form:

GULL WING

Terminal Pitch:

.65 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

30

Width (mm):

4.4 mm

Trade Compliance

MC74HC4046ADTG Other Function Semiconductors trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

PCN

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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