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LMX2326TMX

Texas Instruments

LMX2326TMX by Texas Instruments

LMX2326TMX by Texas Instruments is a PLL frequency synthesizer with 16 terminals, operating voltage range of 2.3V to 5.5V, and temperature grade suitable for industrial applications. It features a small outline package with thin profile and shrink pitch, making it ideal for surface mount designs in various electronic systems requiring precise frequency synthesis capabilities up to 85°C.

Median Price

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Lifecycle Status

Suppliers In-Stock

8

In-Stock Inventory

1k+

Distributors (In-Stock)

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Vyrian

USA . 3,185 parts In-Stock

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Digiode

USA . 2,549 parts In-Stock

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2,549

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ComSIT Distribution GmbH

Germany . 1,581 parts In-Stock

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Anansix

USA . 1,211 parts In-Stock

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Prism Electronics

USA . 1,164 parts In-Stock

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Semi Source

USA . 493 parts In-Stock

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493

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Bristol Electronics

USA . 221 parts In-Stock

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Specialty Parts & Electronic Components, Inc. (S.P.E.C.)

USA . 50 parts In-Stock

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50

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One Stop Electronics

USA . 482 parts In-Stock

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$2.500

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482

$2.500

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AZTECH Wire

Italy . 380 parts In-Stock

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$7.902

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Parana Technologies

USA . 1,979 parts In-Stock

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$20.237

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$20.224

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ChromeModa Solutions

Germany . 4,085 parts In-Stock

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$22.738

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$18.645

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IDEA Electronic Components Group

UK . 950 parts In-Stock

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$22.738

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$21.601

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$20.464

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Kepictronics

USA . 25,000 parts In-Stock

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S.R.D Solutions

India . 6,000 parts In-Stock

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Alle Elektronik GmbH

Germany . 4,558 parts In-Stock

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Perfect Parts

USA . 3,278 parts In-Stock

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Lixinc

USA . 3,161 parts In-Stock

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Authorized Procurement Solutions

USA . 3,000 parts In-Stock

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Corphita

USA . 2,104 parts In-Stock

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GreenTree Electronics

Israel . 1,900 parts In-Stock

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DigiPath Technology Company

USA . 1,528 parts In-Stock

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$20.501

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1,528

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$20.501

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Overview

Discover the unparalleled performance of the LMX2326TMX by Texas Instruments, a cutting-edge Phase Locked Loop (PLL) & Frequency Synthesis Circuit. With a reputation for excellence, Texas Instruments delivers top-quality products that exceed industry standards. Ideal for a wide range of applications, this product offers unmatched precision and reliability. Unlock a world of possibilities with the LMX2326TMX, providing customers with exceptional value, benefits, and advantages that set it apart from the competition. Choose Texas Instruments for innovation you can trust.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy for the package body makes the product lightweight and cost-effective.

Surface Mount: YES

Being surface mountable enables easy and efficient assembly onto the circuit board.

Nominal Supply Voltage (Vsup): 3 V

Operates at a standard nominal supply voltage of 3V, making it compatible with a wide range of applications.

Maximum Operating Temperature: 85 °C

Capable of operating at high temperatures, making it suitable for industrial applications.

Technology: BICMOS

Utilizes BICMOS technology for efficient performance and low power consumption.

Technical Specifications

Phase Locked Loops (PLL) & Frequency Synthesis Circuits LMX2326TMX attributes and parameters. Explore more Phase Locked Loops (PLL) & Frequency Synthesis Circuits devices from Texas Instruments

Specs

Other IC type:

JESD-30 Code:

R-PDSO-G16

JESD-609 Code:

e0

Length:

5 mm

Moisture Sensitivity Level (MSL):

1

No. of Functions:

1

No. of Terminals:

16

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Shape:

Package Style (Meter):

SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

Peak Reflow Temperature (C):

260

Maximum Seated Height:

1.1 mm

Maximum Supply Voltage (Vsup):

5.5 V

Minimum Supply Voltage (Vsup):

2.3 V

Nominal Supply Voltage (Vsup):

3 V

Surface Mount:

YES

Technology:

BICMOS

Temperature Grade:

Terminal Finish:

TIN LEAD

Terminal Form:

GULL WING

Terminal Pitch:

.65 mm

Terminal Position:

DUAL

Width (mm):

4.4 mm

Trade Compliance

LMX2326TMX Other Function Semiconductors trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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