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CD4046BD

Texas Instruments

CD4046BD by Texas Instruments

CD4046BD by Texas Instruments is a 16-terminal PLL IC with Vsup ranging from 5V to 15V. Operating temperature spans -55°C to 125°C, suitable for military-grade applications. Its CMOS technology and phase-locked loop design make it ideal for frequency synthesis circuits.

Median Price

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Lifecycle Status

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Vyrian

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Nova Conductors

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Odintec Ltd.

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Prism Electronics

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LittleDiode

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One Stop Electronics

USA . 552 parts In-Stock

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Ampacity Inc.

Singapore . 1,644 parts In-Stock

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Advanced Electronics

New Zealand . 10 parts In-Stock

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Parana Technologies

USA . 199 parts In-Stock

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AZTECH Wire

Italy . 418 parts In-Stock

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DigiPath Technology Company

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ChromeModa Solutions

Germany . 6,457 parts In-Stock

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IDEA Electronic Components Group

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Corohmni

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Overview

Unlock the power of precision frequency control with the Texas Instruments CD4046BD. As a leading manufacturer in the industry, Texas Instruments delivers top-notch quality and reliability that customers can trust. The CD4046BD falls under the category of Phase Locked Loops (PLL) & Frequency Synthesis Circuits, making it an essential component for applications requiring accurate frequency synchronization. With a wide range of operating temperatures and supply voltages, this versatile product offers unmatched value and performance to meet all your circuit design needs. Trust Texas Instruments for superior products that deliver exceptional results every time.

Feature Benefit Bullets

Package Body Material: CERAMIC, METAL-SEALED COFIRED

The use of ceramic and metal-sealed cofired package body material ensures high durability and reliability, making this product suitable for harsh operating conditions.

Nominal Supply Voltage (Vsup): 10 V

The nominal supply voltage of 10V provides a balanced power input, optimizing the performance of the Phase Locked Loop (PLL) & Frequency Synthesis Circuits.

Maximum Operating Temperature: 125 °C

With a maximum operating temperature of 125°C, this product can withstand high temperatures, making it suitable for industrial and military applications.

Technology: CMOS

Utilizing CMOS technology ensures low power consumption and high noise immunity, enhancing the overall efficiency and reliability of the PLL & Frequency Synthesis Circuits.

Technical Specifications

Phase Locked Loops (PLL) & Frequency Synthesis Circuits CD4046BD attributes and parameters. Explore more Phase Locked Loops (PLL) & Frequency Synthesis Circuits devices from Texas Instruments

Specs

Other IC type:

JESD-30 Code:

R-CDIP-T16

No. of Functions:

1

No. of Terminals:

16

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-55 Cel

Package Body Material:

CERAMIC, METAL-SEALED COFIRED

Package Code:

DIP

Package Equivalence Code:

DIP16,.3

Package Shape:

Package Style (Meter):

IN-LINE

Peak Reflow Temperature (C):

NOT SPECIFIED

Power Supplies (V):

5/15

Qualification:

Not Qualified

Sub-Category:

PLL or Frequency Synthesis Circuits

Maximum Supply Voltage (Vsup):

18 V

Minimum Supply Voltage (Vsup):

5 V

Nominal Supply Voltage (Vsup):

10 V

Surface Mount:

NO

Technology:

CMOS

Temperature Grade:

Terminal Form:

THROUGH-HOLE

Terminal Pitch:

2.54 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

NOT SPECIFIED

Trade Compliance

CD4046BD Other Function Semiconductors trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

NSN

5962-01-274-5252, 5962012745252, 5962-01-120-8352, 5962011208352, 5962-99-656-9602, 5962996569602

NIIN

012745252, 011208352, 996569602

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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