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LMX2306TM

Texas Instruments

LMX2306TM by Texas Instruments

LMX2306TM by Texas Instruments is a PLL frequency synthesizer with 16 terminals, operating voltage range of 2.3V to 5.5V, and temperature grade of industrial (-40°C to 85°C). It features a small outline package shape (4.4mm x 5mm) suitable for surface mount applications in various electronic devices requiring precise frequency synthesis capabilities.

Median Price

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Lifecycle Status

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13

In-Stock Inventory

1k+

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Digiode

USA . 4,190 parts In-Stock

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Vyrian

USA . 676 parts In-Stock

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Bristol Electronics

USA . 581 parts In-Stock

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Anansix

USA . 258 parts In-Stock

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Cyclops Electronics Ltd

UK . 214 parts In-Stock

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LWI Electronics Inc

India . 147 parts In-Stock

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Prism Electronics

USA . 50 parts In-Stock

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A&K Electronics

USA . 26 parts In-Stock

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Diverse Electronics

Canada . 22 parts In-Stock

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Carlin Systems, Inc.

USA . 18 parts In-Stock

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North Shore Components

USA . 15 parts In-Stock

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NAC Semi

USA . 15 parts In-Stock

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Dark Horse Electronics

USA . 5 parts In-Stock

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One Stop Electronics

USA . 1,556 parts In-Stock

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$5.500

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Parana Technologies

USA . 2,131 parts In-Stock

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$13.569

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$14.074

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DigiPath Technology Company

USA . 1,837 parts In-Stock

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$14.941

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ChromeModa Solutions

Germany . 1,065 parts In-Stock

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$15.246

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$12.502

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IDEA Electronic Components Group

UK . 154 parts In-Stock

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$15.246

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$14.484

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$13.721

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AZTECH Wire

Italy . 797 parts In-Stock

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Lixinc

USA . 9,140 parts In-Stock

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Corphita

USA . 4,820 parts In-Stock

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Alle Elektronik GmbH

Germany . 3,208 parts In-Stock

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Perfect Parts

USA . 678 parts In-Stock

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GreenTree Electronics

Israel . 175 parts In-Stock

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Kepictronics

USA . 168 parts In-Stock

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ChipTracer

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Overview

Unlock precision and reliability with the LMX2306TM by Texas Instruments, a top-tier manufacturer known for cutting-edge technology. This Phase Locked Loop (PLL) & Frequency Synthesis Circuit offers seamless integration and exceptional performance in various applications. With a small outline and dual terminal position, this product provides unparalleled value and benefits to customers seeking high-quality solutions. Experience the advantages of advanced technology with the LMX2306TM and elevate your projects to new heights.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Plastic/Epoxy material provides durability and reliability to the package, making it suitable for various industrial applications.

Surface Mount: YES

Surface mount capability allows for easy and efficient PCB assembly, saving time and reducing production costs.

Nominal Supply Voltage (Vsup): 3 V

Operating at a nominal supply voltage of 3V makes this PLL & Frequency Synthesis Circuit efficient and compatible with common power sources.

Maximum Operating Temperature: 85 °C

With a maximum operating temperature of 85°C, this product can function reliably in a wide range of environmental conditions.

Technology: BICMOS

Utilizing BiCMOS technology combines the benefits of both bipolar and CMOS technologies, resulting in high speed performance and low power consumption.

Technical Specifications

Phase Locked Loops (PLL) & Frequency Synthesis Circuits LMX2306TM attributes and parameters. Explore more Phase Locked Loops (PLL) & Frequency Synthesis Circuits devices from Texas Instruments

Specs

Other IC type:

JESD-30 Code:

R-PDSO-G16

Length:

5 mm

No. of Functions:

1

No. of Terminals:

16

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Shape:

Package Style (Meter):

SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

Maximum Seated Height:

1.1 mm

Maximum Supply Voltage (Vsup):

5.5 V

Minimum Supply Voltage (Vsup):

2.3 V

Nominal Supply Voltage (Vsup):

3 V

Surface Mount:

YES

Technology:

BICMOS

Temperature Grade:

Terminal Form:

GULL WING

Terminal Pitch:

.65 mm

Terminal Position:

DUAL

Width (mm):

4.4 mm

Trade Compliance

LMX2306TM Other Function Semiconductors trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

NSN

5962-99-611-6668, 5962996116668

NIIN

996116668

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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