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LMX2306TMX

Texas Instruments

LMX2306TMX by Texas Instruments

LMX2306TMX by Texas Instruments is a PLL frequency synthesizer with 16 terminals, operating voltage range of 2.3V to 5.5V, and industrial temperature grade. It features a small outline package with dimensions of 5mm x 4.4mm x 1.1mm, suitable for surface mount applications in various electronic devices requiring precise frequency synthesis capabilities at temperatures ranging from -40°C to 85°C.

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13

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1k+

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Chip Stock

USA . 4,960 parts In-Stock

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Vyrian

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Digiode

USA . 2,605 parts In-Stock

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Anansix

USA . 2,020 parts In-Stock

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Inventory MP

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Q Components

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Prism Electronics

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Specialty Parts & Electronic Components, Inc. (S.P.E.C.)

USA . 131 parts In-Stock

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Bristol Electronics

USA . 130 parts In-Stock

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Zilex Electronics Inc.

Canada . 100 parts In-Stock

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Quantum Digital Technology

USA . 63 parts In-Stock

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Electronics Depot

USA . 10 parts In-Stock

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Nova Conductors

Japan . 10 parts In-Stock

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One Stop Electronics

USA . 542 parts In-Stock

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Ampacity Inc.

Singapore . 1,029 parts In-Stock

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Corohmni

South Africa . 31 parts In-Stock

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AZTECH Wire

Italy . 550 parts In-Stock

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Parana Technologies

USA . 1,964 parts In-Stock

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$10.875

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DigiPath Technology Company

USA . 1,255 parts In-Stock

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ChromeModa Solutions

Germany . 6,940 parts In-Stock

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IDEA Electronic Components Group

UK . 889 parts In-Stock

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Lixinc

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Argo Parts USA

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Alle Elektronik GmbH

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Continental Prestige Electronics

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Perfect Parts

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A-Z Elektronik GmbH

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Corphita

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Aranea Global

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Overview

Enhance your electronic projects with the LMX2306TMX by Texas Instruments, a top-tier Phase Locked Loop & Frequency Synthesis Circuit. Crafted with precision and expertise, this product delivers unparalleled performance and reliability. Ideal for industrial applications, this PLL frequency synthesizer offers seamless integration and optimal functionality. Upgrade your designs with this compact and efficient solution, providing value and benefits that exceed expectations. Elevate your projects with the quality and innovation of Texas Instruments.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

This material provides durability and protection for the internal components of the PLL and frequency synthesis circuit, ensuring a longer lifespan.

Surface Mount: YES

Being surface mountable makes this product easy to integrate into circuit boards, enhancing the overall convenience of installation.

Nominal Supply Voltage (Vsup): 3 V

This voltage requirement is common and widely compatible with many electronic systems, making it versatile for various applications.

Maximum Operating Temperature: 85 °C

This high temperature tolerance allows the PLL and frequency synthesis circuit to function reliably in diverse environmental conditions without overheating.

Technology: BICMOS

The BICMOS technology used in this product combines the advantages of both bipolar and CMOS technologies, providing high performance and low power consumption.

Technical Specifications

Phase Locked Loops (PLL) & Frequency Synthesis Circuits LMX2306TMX attributes and parameters. Explore more Phase Locked Loops (PLL) & Frequency Synthesis Circuits devices from Texas Instruments

Specs

Other IC type:

JESD-30 Code:

R-PDSO-G16

JESD-609 Code:

e0

Length:

5 mm

Moisture Sensitivity Level (MSL):

1

No. of Functions:

1

No. of Terminals:

16

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Shape:

Package Style (Meter):

SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

Peak Reflow Temperature (C):

260

Maximum Seated Height:

1.1 mm

Maximum Supply Voltage (Vsup):

5.5 V

Minimum Supply Voltage (Vsup):

2.3 V

Nominal Supply Voltage (Vsup):

3 V

Surface Mount:

YES

Technology:

BICMOS

Temperature Grade:

Terminal Finish:

TIN LEAD

Terminal Form:

GULL WING

Terminal Pitch:

.65 mm

Terminal Position:

DUAL

Width (mm):

4.4 mm

Trade Compliance

LMX2306TMX Other Function Semiconductors trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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