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LMX2515LQ0701

Texas Instruments

LMX2515LQ0701 by Texas Instruments

LMX2515LQ0701 by Texas Instruments is a PLL frequency synthesizer with 28 terminals, operating voltage of 2.5-3.3V, and package style of very thin profile chip carrier. It is suitable for applications requiring precise frequency synthesis in temperature range of -30 to 85°C.

Median Price

-

Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 3,053 parts In-Stock

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3,053

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Anansix

USA . 2,618 parts In-Stock

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2,618

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Digiode

USA . 1,365 parts In-Stock

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1,365

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Distributors (Availability)

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One Stop Electronics

USA . 625 parts In-Stock

1+ parts

$4.500

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625

$4.500

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AZTECH Wire

Italy . 321 parts In-Stock

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$9.477

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321

$9.477

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Parana Technologies

USA . 1,535 parts In-Stock

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$17.242

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$17.458

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1,535

$17.242

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$17.458

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DigiPath Technology Company

USA . 451 parts In-Stock

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$18.986

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$17.467

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451

$18.986

$17.467

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IDEA Electronic Components Group

UK . 2,249 parts In-Stock

1+ parts

$19.373

100+ parts

$18.404

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$17.436

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2,249

$19.373

$18.404

$17.436

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ChromeModa Solutions

Germany . 1,341 parts In-Stock

1+ parts

$19.373

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$15.886

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1,341

$19.373

$15.886

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Authorized Procurement Solutions

USA . 4,000 parts In-Stock

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4,000

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Corphita

USA . 1,391 parts In-Stock

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Overview

Unlock the potential of your electronic projects with the LMX2515LQ0701 by Texas Instruments. As a leading manufacturer in the industry, Texas Instruments ensures top-quality PLL & Frequency Synthesis Circuits like this one. Ideal for applications requiring precise frequency generation, this chip carrier offers a nominal supply voltage of 2.8V and a wide operating temperature range. With a compact square shape and 28 terminals, it provides easy integration into your designs. Trust in Texas Instruments to deliver reliable solutions that bring value and innovation to your projects. Choose the LMX2515LQ0701 for unmatched performance and efficiency.

Feature Benefit Bullets

Surface Mount: YES

Ease of installation and compact design for efficient use of space.

Nominal Supply Voltage (Vsup): 2.8 V

Optimal voltage for stable and efficient performance.

Package Style: CHIP CARRIER, VERY THIN PROFILE

Slim profile for space-saving and convenient integration into designs.

Maximum Operating Temperature: 85 °C

Suitable for operating in a wide range of temperature conditions.

Minimum Operating Temperature: -30 °C

Can withstand low temperatures, suitable for various environments.

Terminal Finish: TIN LEAD

Provides durable and reliable contact points for better connectivity.

Width (mm): 5 mm

Compact width for fitting into tight spaces.

Terminal Pitch: 0.5 mm

Fine pitch for precise connections and compact layout.

Moisture Sensitivity Level (MSL): 2

Moderate sensitivity to moisture, suitable for most environments.

Technical Specifications

Phase Locked Loops (PLL) & Frequency Synthesis Circuits LMX2515LQ0701 attributes and parameters. Explore more Phase Locked Loops (PLL) & Frequency Synthesis Circuits devices from Texas Instruments

Specs

Other IC type:

JESD-30 Code:

S-XQCC-N28

JESD-609 Code:

e0

Length:

5 mm

Moisture Sensitivity Level (MSL):

2

No. of Functions:

1

No. of Terminals:

28

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-30 Cel

Package Body Material:

UNSPECIFIED

Package Code:

Package Equivalence Code:

LCC28,.2SQ,20

Package Shape:

Package Style (Meter):

CHIP CARRIER, VERY THIN PROFILE

Peak Reflow Temperature (C):

260

Power Supplies (V):

3

Qualification:

Not Qualified

Maximum Seated Height:

.8 mm

Sub-Category:

PLL or Frequency Synthesis Circuits

Maximum Supply Current (Isup):

13.3 mA

Maximum Supply Voltage (Vsup):

3.3 V

Minimum Supply Voltage (Vsup):

2.5 V

Nominal Supply Voltage (Vsup):

2.8 V

Surface Mount:

YES

Temperature Grade:

Terminal Finish:

TIN LEAD

Terminal Form:

NO LEAD

Terminal Pitch:

.5 mm

Terminal Position:

QUAD

Width (mm):

5 mm

Trade Compliance

LMX2515LQ0701 Other Function Semiconductors trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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