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MC145152P2

NXP Semiconductors

MC145152P2 by NXP Semiconductors

MC145152P2 by NXP Semiconductors is a PLL frequency synthesizer with 28 terminals, operating voltage range of 3-9V. It has a temperature range of -40 to 85°C and uses CMOS technology. This rectangular package is ideal for industrial applications requiring precise frequency synthesis circuits.

Median Price

$10.683

Lifecycle Status

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Overview

Upgrade your electronic designs with the MC145152P2 from NXP Semiconductors, a leader in semiconductor technology. This Phase Locked Loop (PLL) & Frequency Synthesis Circuit offers reliable performance and precise frequency control for a wide range of applications. With a compact design and industrial-grade temperature range, this PLL Frequency Synthesizer delivers exceptional value and flexibility, making it the perfect choice for demanding projects. Trust NXP Semiconductors to provide the quality and innovation you need to take your designs to the next level.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

This material offers a cost-effective and lightweight solution for the package, making the product easy to handle and transport.

Nominal Supply Voltage (Vsup): 5 V

Operating at a common and stable voltage level ensures compatibility with standard power supplies and reduces the risk of power-related issues.

No. of Terminals: 28

Having a high number of terminals allows for more connectivity options and integration possibilities, making the product versatile.

Maximum Operating Temperature: 85 °C

Being able to operate at high temperatures ensures reliable performance in various environmental conditions, making the product suitable for industrial applications.

Technology: CMOS

CMOS technology offers low power consumption and high noise immunity, enhancing the efficiency and reliability of the product.

Technical Specifications

Phase Locked Loops (PLL) & Frequency Synthesis Circuits MC145152P2 attributes and parameters. Explore more Phase Locked Loops (PLL) & Frequency Synthesis Circuits devices from NXP Semiconductors

Specs

Other IC type:

JESD-30 Code:

R-PDIP-T28

Length:

36.83 mm

No. of Functions:

1

No. of Terminals:

28

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

DIP

Package Equivalence Code:

DIP28,.6

Package Shape:

Package Style (Meter):

IN-LINE

Maximum Seated Height:

5.08 mm

Maximum Supply Current (Isup):

24 mA

Maximum Supply Voltage (Vsup):

9 V

Minimum Supply Voltage (Vsup):

3 V

Nominal Supply Voltage (Vsup):

5 V

Surface Mount:

NO

Technology:

CMOS

Temperature Grade:

Terminal Form:

THROUGH-HOLE

Terminal Pitch:

2.54 mm

Terminal Position:

DUAL

Width (mm):

15.24 mm

Trade Compliance

MC145152P2 Other Function Semiconductors trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

NSN

5962-01-383-1856, 5962013831856

NIIN

013831856

Manufacturer Highlights

NXP Semiconductors

NXP is a leading semiconductor company that creates cutting-edge technology to power secure connections in a smarter world. Founded in 2006, they have grown to become one of the top five global semiconductor companies and serve their customers in over 70 countries around the world.

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The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

Executive Director, President, CEO

Kurt Sievers

Executive VP, CFO

Bill Betz

Executive VP, Chief Sales Officer

Ron Martino

Manufacturer fab locations 7

Fab name Location Fab Initiation Wafer Capacity

ICN8

Fabrication

Fab Initiation

1996

Netherlands

Nijmegen

Wafer Capacity

55,000

1996

55,000

ATMC (Austin Tech & Mfg Center)

Fabrication

Fab Initiation

1995

USA

Austin

Wafer Capacity

30,000

1995

30,000

N/A

Fabrication

Fab Initiation

1989

Germany

Boeblingen

Wafer Capacity

1989

CHD

Fabrication

Fab Initiation

1993

USA

Chandler

Wafer Capacity

30,000

1993

30,000

OHTC

Fabrication

Fab Initiation

1991

USA

Austin

Wafer Capacity

24,000

1991

24,000

New Expansion Fab

Fabrication

Fab Initiation

2026

USA

Austin

Wafer Capacity

2026

ECHO

Fabrication

Fab Initiation

2020

USA

Chandler

Wafer Capacity

10,000

2020

10,000

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