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LMX2330LSLBX

Texas Instruments

LMX2330LSLBX by Texas Instruments

LMX2330LSLBX by Texas Instruments is a PLL frequency synthesizer with 24 terminals, BICMOS technology, and 3/5V power supplies. It operates in industrial temperature range (-40 to 85°C) and has a max supply current of 6.6mA. Ideal for applications requiring precise frequency synthesis in compact chip carrier package.

Median Price

$2.300

Lifecycle Status

Suppliers In-Stock

5

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 4,501 parts In-Stock

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Bristol Electronics

USA . 2,105 parts In-Stock

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$2.300

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$2.021

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2,105

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$2.021

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Microfarads

USA . 1,958 parts In-Stock

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1,958

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Digiode

USA . 782 parts In-Stock

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782

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Anansix

USA . 496 parts In-Stock

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496

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

AZTECH Wire

Italy . 754 parts In-Stock

1+ parts

$6.441

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754

$6.441

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One Stop Electronics

USA . 1,123 parts In-Stock

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$7.500

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$7.500

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Advanced Electronics

New Zealand . 350 parts In-Stock

1+ parts

$11.913

100+ parts

$10.841

1k+ parts

$9.769

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-

350

$11.913

$10.841

$9.769

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Parana Technologies

USA . 779 parts In-Stock

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$19.544

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$19.546

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779

$19.544

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DigiPath Technology Company

USA . 2,282 parts In-Stock

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$21.521

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2,282

$21.521

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ChromeModa Solutions

Germany . 5,158 parts In-Stock

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$21.960

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$18.007

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5,158

$21.960

$18.007

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IDEA Electronic Components Group

UK . 1,542 parts In-Stock

1+ parts

$21.960

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$20.862

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$19.764

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1,542

$21.960

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$19.764

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Assy Fe

Spain . 21,530 parts In-Stock

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Corphita

USA . 4,355 parts In-Stock

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Overview

Experience the cutting-edge technology of Texas Instruments with the LMX2330LSLBX PLL Frequency Synthesizer. This industrial-grade device offers unparalleled precision and reliability for a wide range of applications. Whether you're designing wireless communication systems or radar systems, this chip carrier package delivers exceptional performance in extreme temperatures. With a low supply current and advanced BICMOS technology, this Phase Locked Loop circuit provides the value and efficiency that customers demand. Trust Texas Instruments to bring innovation and quality to your projects with the LMX2330LSLBX.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy material makes the package lightweight and cost-effective.

Surface Mount: YES

Surface mount technology allows for easy and efficient PCB assembly.

Package Shape: RECTANGULAR

The rectangular shape helps in efficient space utilization on the PCB.

Power Supplies (V): 3/5

Support for multiple power supply voltages (3V and 5V) provides flexibility in design and compatibility with different systems.

No. of Terminals: 24

The high number of terminals allow for connectivity to various components, enabling versatile functionality.

Package Style (Meter): CHIP CARRIER

The chip carrier package style is compact and offers good thermal properties for reliable performance.

Maximum Operating Temperature: 85 °C

The high maximum operating temperature ensures the stability of the device even in demanding industrial environments.

Minimum Operating Temperature: -40 °C

The low minimum operating temperature allows the device to function in a wide range of temperature conditions.

Terminal Position: QUAD

The quad terminal position simplifies the PCB layout and enhances signal integrity.

Other IC type: PLL FREQUENCY SYNTHESIZER

The integration of PLL frequency synthesizer functionality adds precision and stability to frequency synthesis circuits.

Temperature Grade: INDUSTRIAL

The industrial temperature grade ensures reliable operation in harsh industrial environments.

Maximum Supply Current (Isup): 6.6 mA

The low maximum supply current allows for energy-efficient operation and reduces power consumption.

Technology: BICMOS

The BICMOS technology offers a combination of bipolar and CMOS characteristics, providing high-speed performance and low power consumption.

Terminal Form: NO LEAD

The no-lead terminal form enhances reliability and simplifies soldering processes during assembly.

Terminal Pitch: 0.5 mm

The small terminal pitch of 0.5mm enables high-density mounting and compact PCB design.

Technical Specifications

Phase Locked Loops (PLL) & Frequency Synthesis Circuits LMX2330LSLBX attributes and parameters. Explore more Phase Locked Loops (PLL) & Frequency Synthesis Circuits devices from Texas Instruments

Specs

Other IC type:

JESD-30 Code:

R-PQCC-N24

No. of Terminals:

24

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

LCC24,.17X.14,20

Package Shape:

Package Style (Meter):

CHIP CARRIER

Power Supplies (V):

3/5

Qualification:

Not Qualified

Sub-Category:

PLL or Frequency Synthesis Circuits

Maximum Supply Current (Isup):

6.6 mA

Surface Mount:

YES

Technology:

BICMOS

Temperature Grade:

Terminal Form:

NO LEAD

Terminal Pitch:

.5 mm

Terminal Position:

QUAD

Trade Compliance

LMX2330LSLBX Other Function Semiconductors trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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