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MC145152DW2

NXP Semiconductors

MC145152DW2 by NXP Semiconductors

MC145152DW2 by NXP Semiconductors is a PLL frequency synthesizer with 28 terminals, operating voltage range of 3-9V. It has a small outline package, suitable for industrial temperature grades (-40 to 85°C). With CMOS technology and gull wing terminals, it's ideal for phase-locked loops and frequency synthesis circuits.

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Holdelec - ElecDif-Pro

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Semicontronic

India . 382 parts In-Stock

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Overview

Unlock the power of precision frequency synthesis with the MC145152DW2 by NXP Semiconductors. Engineered with top-notch quality and reliability, this Phase Locked Loop (PLL) device is designed to deliver outstanding performance in a wide range of industrial applications. With its advanced technology and compact design, the MC145152DW2 offers customers unparalleled value, efficiency, and flexibility. Trust NXP Semiconductors to provide you with the tools you need to take your projects to the next level.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The plastic/epoxy package body material makes the product lightweight and cost-effective.

Surface Mount: YES

Being surface mountable makes installation of the product easier and more convenient.

Nominal Supply Voltage (Vsup): 5 V

Operating at a standard 5V supply voltage makes it compatible with a wide range of systems.

No. of Terminals: 28

Having a high number of terminals allows for more connectivity options and flexibility in usage.

Maximum Operating Temperature: 85 °C

The high maximum operating temperature ensures reliable performance even in harsh environments.

Minimum Operating Temperature: -40 °C

The low minimum operating temperature allows the product to function in a wide range of temperature conditions.

Technology: CMOS

Utilizing CMOS technology results in low power consumption and high noise immunity, making it efficient and reliable.

Technical Specifications

Phase Locked Loops (PLL) & Frequency Synthesis Circuits MC145152DW2 attributes and parameters. Explore more Phase Locked Loops (PLL) & Frequency Synthesis Circuits devices from NXP Semiconductors

Specs

Other IC type:

JESD-30 Code:

R-PDSO-G28

Length:

17.925 mm

No. of Functions:

1

No. of Terminals:

28

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

SOP

Package Equivalence Code:

SOP28,.4

Package Shape:

Package Style (Meter):

SMALL OUTLINE

Peak Reflow Temperature (C):

260

Maximum Seated Height:

2.65 mm

Maximum Supply Current (Isup):

30 mA

Maximum Supply Voltage (Vsup):

9 V

Minimum Supply Voltage (Vsup):

3 V

Nominal Supply Voltage (Vsup):

5 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Form:

GULL WING

Terminal Pitch:

1.27 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

40

Width (mm):

7.5 mm

Trade Compliance

MC145152DW2 Other Function Semiconductors trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

NSN

5962-01-588-7585, 5962015887585

NIIN

015887585

PCN

Manufacturer Highlights

NXP Semiconductors

NXP is a leading semiconductor company that creates cutting-edge technology to power secure connections in a smarter world. Founded in 2006, they have grown to become one of the top five global semiconductor companies and serve their customers in over 70 countries around the world.

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Management team

Executive Director, President, CEO

Kurt Sievers

Executive VP, CFO

Bill Betz

Executive VP, Chief Sales Officer

Ron Martino

Manufacturer fab locations 7

Fab name Location Fab Initiation Wafer Capacity

ICN8

Fabrication

Fab Initiation

1996

Netherlands

Nijmegen

Wafer Capacity

55,000

1996

55,000

ATMC (Austin Tech & Mfg Center)

Fabrication

Fab Initiation

1995

USA

Austin

Wafer Capacity

30,000

1995

30,000

N/A

Fabrication

Fab Initiation

1989

Germany

Boeblingen

Wafer Capacity

1989

CHD

Fabrication

Fab Initiation

1993

USA

Chandler

Wafer Capacity

30,000

1993

30,000

OHTC

Fabrication

Fab Initiation

1991

USA

Austin

Wafer Capacity

24,000

1991

24,000

New Expansion Fab

Fabrication

Fab Initiation

2026

USA

Austin

Wafer Capacity

2026

ECHO

Fabrication

Fab Initiation

2020

USA

Chandler

Wafer Capacity

10,000

2020

10,000

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