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LMX2541SQ3320E

Texas Instruments

LMX2541SQ3320E by Texas Instruments

LMX2541SQ3320E by Texas Instruments is a PLL frequency synthesizer with 36 terminals, operating at 3.3V. It features a square package shape, -40 to 85°C temperature range, and BICMOS technology. Ideal for industrial applications requiring precise frequency synthesis in compact designs.

Median Price

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Lifecycle Status

Suppliers In-Stock

4

In-Stock Inventory

1k+

Distributors (In-Stock)

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Digiode

USA . 4,199 parts In-Stock

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Vyrian

USA . 4,109 parts In-Stock

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Anansix

USA . 438 parts In-Stock

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438

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Prism Electronics

USA . 20 parts In-Stock

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20

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One Stop Electronics

USA . 1,077 parts In-Stock

1+ parts

$1.500

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$1.500

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AZTECH Wire

Italy . 891 parts In-Stock

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$12.167

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Parana Technologies

USA . 1,507 parts In-Stock

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$19.258

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$19.290

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$19.258

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$19.290

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DigiPath Technology Company

USA . 294 parts In-Stock

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$21.205

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294

$21.205

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ChromeModa Solutions

Germany . 6,530 parts In-Stock

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$21.638

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$17.743

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IDEA Electronic Components Group

UK . 125 parts In-Stock

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$21.638

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$20.556

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$19.474

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125

$21.638

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$19.474

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Lixinc

USA . 13,398 parts In-Stock

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Corphita

USA . 5,214 parts In-Stock

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Overview

Unlock unparalleled precision and reliability with the LMX2541SQ3320E by Texas Instruments, a cutting-edge Phase Locked Loop (PLL) & Frequency Synthesis Circuit. Designed to meet the highest industry standards, this surface-mount chip offers exceptional performance in a compact square package. From industrial automation to telecommunications, this PLL frequency synthesizer is the go-to choice for engineers seeking top-tier quality and seamless integration. Elevate your projects with Texas Instruments' LMX2541SQ3320E and experience unmatched value and efficiency like never before.

Feature Benefit Bullets

Surface Mount YES

This product can be easily mounted on a PCB, saving space and making it suitable for compact designs.

Nominal Supply Voltage (Vsup) 3.3 V

Operates at a common supply voltage, ensuring compatibility with a wide range of systems.

Package Style (Meter) CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

This package style allows for efficient heat dissipation and a compact design, ideal for applications where space is limited.

Maximum Operating Temperature 85 °C

Can withstand high operating temperatures, making it suitable for industrial environments where heat may be a concern.

Technology BICMOS

Utilizes BiCMOS technology, offering a balance of speed and low power consumption, making it an efficient choice for various applications.

Technical Specifications

Phase Locked Loops (PLL) & Frequency Synthesis Circuits LMX2541SQ3320E attributes and parameters. Explore more Phase Locked Loops (PLL) & Frequency Synthesis Circuits devices from Texas Instruments

Specs

Other IC type:

JESD-30 Code:

S-XQCC-N36

Length:

6 mm

No. of Functions:

1

No. of Terminals:

36

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

UNSPECIFIED

Package Code:

Package Shape:

Package Style (Meter):

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

Peak Reflow Temperature (C):

NOT SPECIFIED

Qualification:

Not Qualified

Maximum Seated Height:

.8 mm

Maximum Supply Voltage (Vsup):

3.45 V

Minimum Supply Voltage (Vsup):

3.15 V

Nominal Supply Voltage (Vsup):

3.3 V

Surface Mount:

YES

Technology:

BICMOS

Temperature Grade:

Terminal Form:

NO LEAD

Terminal Pitch:

.5 mm

Terminal Position:

QUAD

Maximum Time At Peak Reflow Temperature (s):

NOT SPECIFIED

Width (mm):

6 mm

Trade Compliance

LMX2541SQ3320E Other Function Semiconductors trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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