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LMX2335LTMX

Texas Instruments

LMX2335LTMX by Texas Instruments

LMX2335LTMX by Texas Instruments is a PLL frequency synthesizer with 16 terminals, operating voltage range of 2.7V to 5.5V, and BICMOS technology. It has a small outline package with dimensions of 5mm x 4.4mm x 1.1mm, suitable for industrial temperature applications like wireless communication systems and radar equipment due to its wide supply voltage range and low supply current consumption of 2.6mA at max temperature of 85°C.

Median Price

-

Lifecycle Status

Suppliers In-Stock

4

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 6,369 parts In-Stock

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6,369

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Digiode

USA . 3,782 parts In-Stock

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3,782

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Anansix

USA . 655 parts In-Stock

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655

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Sinequanon

UK . 350 parts In-Stock

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350

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Parana Technologies

USA . 1,422 parts In-Stock

1+ parts

$4.500

100+ parts

-

1k+ parts

$4.942

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1,422

$4.500

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$4.942

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One Stop Electronics

USA . 1,015 parts In-Stock

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$4.500

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1,015

$4.500

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DigiPath Technology Company

USA . 1,786 parts In-Stock

1+ parts

$4.955

100+ parts

$4.558

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1,786

$4.955

$4.558

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IDEA Electronic Components Group

UK . 1,806 parts In-Stock

1+ parts

$5.056

100+ parts

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$4.550

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1,806

$5.056

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$4.550

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ChromeModa Solutions

Germany . 1,424 parts In-Stock

1+ parts

$5.056

100+ parts

$4.146

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1,424

$5.056

$4.146

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AZTECH Wire

Italy . 480 parts In-Stock

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$17.407

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480

$17.407

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Component Stockers USA

USA . 254 parts In-Stock

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$99.990

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254

$99.990

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Perfect Parts

USA . 2,549 parts In-Stock

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2,549

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A-Z Elektronik GmbH

Germany . 1,367 parts In-Stock

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Corphita

USA . 986 parts In-Stock

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986

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Overview

The Texas Instruments LMX2335LTMX is a top-of-the-line Phase Locked Loop (PLL) & Frequency Synthesis Circuit designed with precision and innovation. With a small outline, thin profile package and industrial-grade technology, this product offers high performance and reliability. Perfect for applications requiring accurate frequency synthesis, this PLL Frequency Synthesizer boasts a wide supply voltage range and low supply current, making it cost-effective and efficient. Trust Texas Instruments to deliver superior quality and functionality in every product, creating value for customers seeking cutting-edge solutions in the field of electronics.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Plastic/Epoxy package body material offers good durability and resistance to external elements, making this product suitable for various environmental conditions.

Surface Mount: YES

Surface mount capability allows for easy and efficient installation on circuit boards, saving time and effort during manufacturing.

Nominal Supply Voltage (Vsup): 5 V

Operates at a standard 5V supply voltage, making integration into existing systems straightforward and convenient.

Package Style: SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

The small outline, thin profile, and shrink pitch package style enables space-efficient PCB layouts and compact designs for devices.

Technology: BICMOS

BICMOS technology offers a balance between the advantages of both bipolar and CMOS technologies, providing high-speed operation and low power consumption for improved performance.

Technical Specifications

Phase Locked Loops (PLL) & Frequency Synthesis Circuits LMX2335LTMX attributes and parameters. Explore more Phase Locked Loops (PLL) & Frequency Synthesis Circuits devices from Texas Instruments

Specs

Other IC type:

JESD-30 Code:

R-PDSO-G16

JESD-609 Code:

e0

Length:

5 mm

Moisture Sensitivity Level (MSL):

1

No. of Functions:

1

No. of Terminals:

16

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

TSSOP16,.25

Package Shape:

Package Style (Meter):

SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

Peak Reflow Temperature (C):

260

Maximum Seated Height:

1.1 mm

Maximum Supply Current (Isup):

2.6 mA

Maximum Supply Voltage (Vsup):

5.5 V

Minimum Supply Voltage (Vsup):

2.7 V

Nominal Supply Voltage (Vsup):

5 V

Surface Mount:

YES

Technology:

BICMOS

Temperature Grade:

Terminal Finish:

TIN LEAD

Terminal Form:

GULL WING

Terminal Pitch:

.65 mm

Terminal Position:

DUAL

Width (mm):

4.4 mm

Trade Compliance

LMX2335LTMX Other Function Semiconductors trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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