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CD74HC4046AMG4

Texas Instruments

CD74HC4046AMG4 by Texas Instruments

CD74HC4046AMG4 by Texas Instruments is a Phase Locked Loop IC with 16 terminals, operating voltage of 2-6V, and temperature range of -55 to 125°C. It is ideal for frequency synthesis circuits in military-grade applications due to its CMOS technology and compact small outline package design.

Median Price

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Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (In-Stock)

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Vyrian

USA . 4,446 parts In-Stock

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Digiode

USA . 3,242 parts In-Stock

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Semi Source

USA . 17 parts In-Stock

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Native Components

USA . 242 parts In-Stock

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$0.398

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$0.382

242

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Northwest PG Solutions

USA . 417 parts In-Stock

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$0.438

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$0.386

417

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One Stop Electronics

USA . 1,113 parts In-Stock

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$3.500

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AZTECH Wire

Italy . 256 parts In-Stock

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$11.222

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Parana Technologies

USA . 324 parts In-Stock

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$11.384

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$11.808

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DigiPath Technology Company

USA . 1,782 parts In-Stock

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$12.535

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$11.532

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ChromeModa Solutions

Germany . 6,396 parts In-Stock

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$12.791

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$10.489

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IDEA Electronic Components Group

UK . 462 parts In-Stock

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$12.791

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$12.151

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$11.512

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Corphita

USA . 4,541 parts In-Stock

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Microchip USA

USA . 1,758 parts In-Stock

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Overview

Unlock precision and reliability with the CD74HC4046AMG4 by Texas Instruments, a leading manufacturer in Phase Locked Loops (PLL) & Frequency Synthesis Circuits. This compact and versatile device offers unparalleled performance in a wide range of applications. With a nominal supply voltage of 3V and military-grade temperature rating, this IC delivers consistent results under extreme conditions. Experience the value of superior quality and seamless operation with the CD74HC4046AMG4, setting new standards in frequency synthesis technology.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The plastic/epoxy material makes the package lightweight and durable, making it suitable for various applications.

Surface Mount: YES

Being surface mountable, this product is easy to install on PCBs, saving both space and assembly time.

Nominal Supply Voltage (Vsup): 3 V

Operates at a standard 3V supply voltage, compatible with many electronic systems and devices.

Maximum Operating Temperature: 125 °C

Can operate at high temperatures without performance degradation, ideal for industrial or automotive applications.

Technology: CMOS

Utilizes CMOS technology for low power consumption and improved reliability, ensuring efficient operation.

Technical Specifications

Phase Locked Loops (PLL) & Frequency Synthesis Circuits CD74HC4046AMG4 attributes and parameters. Explore more Phase Locked Loops (PLL) & Frequency Synthesis Circuits devices from Texas Instruments

Specs

Other IC type:

JESD-30 Code:

R-PDSO-G16

JESD-609 Code:

e4

Length:

9.9 mm

Moisture Sensitivity Level (MSL):

1

No. of Functions:

1

No. of Terminals:

16

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-55 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

SOP

Package Equivalence Code:

SOP16,.25

Package Shape:

Package Style (Meter):

SMALL OUTLINE

Peak Reflow Temperature (C):

260

Power Supplies (V):

2/6

Qualification:

Not Qualified

Maximum Seated Height:

1.75 mm

Sub-Category:

PLL or Frequency Synthesis Circuits

Maximum Supply Current (Isup):

.16 mA

Maximum Supply Voltage (Vsup):

6 V

Minimum Supply Voltage (Vsup):

2 V

Nominal Supply Voltage (Vsup):

3 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

Nickel/Palladium/Gold (Ni/Pd/Au)

Terminal Form:

GULL WING

Terminal Pitch:

1.27 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

NOT SPECIFIED

Width (mm):

3.9 mm

Trade Compliance

CD74HC4046AMG4 Other Function Semiconductors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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