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UC2635N

Texas Instruments

UC2635N by Texas Instruments

The Texas Instruments UC2635N is a PLL frequency synthesizer IC with 16 terminals, operating voltage of 8-15V. It has a rectangular plastic/epoxy package style, suitable for industrial applications with temperature range -40 to 85°C. Ideal for phase-locked loops and frequency synthesis circuits due to its bipolar technology and compact dimensions (19.305mm x 7.62mm x 5.08mm).

Median Price

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Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 3,931 parts In-Stock

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3,931

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Vyrian

USA . 3,494 parts In-Stock

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3,494

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Distributors (Availability)

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Semicontronic

India . 778 parts In-Stock

1+ parts

$0.500

100+ parts

$0.488

1k+ parts

$0.485

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778

$0.500

$0.488

$0.485

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Ampacity Inc.

Singapore . 496 parts In-Stock

1+ parts

$1.500

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496

$1.500

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One Stop Electronics

USA . 1,615 parts In-Stock

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$2.500

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1,615

$2.500

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AZTECH Wire

Italy . 379 parts In-Stock

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$14.962

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379

$14.962

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Parana Technologies

USA . 1,250 parts In-Stock

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$21.392

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$21.736

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1,250

$21.392

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$21.736

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DigiPath Technology Company

USA . 2,316 parts In-Stock

1+ parts

$23.555

100+ parts

$21.671

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2,316

$23.555

$21.671

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ChromeModa Solutions

Germany . 5,264 parts In-Stock

1+ parts

$24.036

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$19.710

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5,264

$24.036

$19.710

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IDEA Electronic Components Group

UK . 105 parts In-Stock

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$24.036

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$22.834

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$21.632

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105

$24.036

$22.834

$21.632

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Corphita

USA . 4,881 parts In-Stock

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4,881

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Corohmni

South Africa . 461 parts In-Stock

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461

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Overview

Enhance your electronic designs with the UC2635N by Texas Instruments, a top-quality Phase Locked Loop & Frequency Synthesis Circuit. With a reputation for excellence, Texas Instruments delivers reliable products for various applications. Experience unmatched performance and precision with this PLL Frequency Synthesizer, offering a wide voltage range, industrial-grade temperature tolerance, and compact design. Trust in the value and benefits of Texas Instruments as you elevate your projects to new heights with the UC2635N.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Plastic/Epoxy material provides good durability and protection for the internal components of the PLL & Frequency Synthesis Circuits.

Nominal Supply Voltage (Vsup): 12 V

Operating at a nominal supply voltage of 12V ensures stable performance of the PLL & Frequency Synthesis Circuits within the specified range.

Maximum Operating Temperature: 85 °C

With a maximum operating temperature of 85°C, this product can withstand high temperatures in industrial settings without compromising performance.

Technology: BIPOLAR

Bipolar technology is known for its high speed and accuracy, making it a suitable choice for precision frequency synthesis applications.

Technical Specifications

Phase Locked Loops (PLL) & Frequency Synthesis Circuits UC2635N attributes and parameters. Explore more Phase Locked Loops (PLL) & Frequency Synthesis Circuits devices from Texas Instruments

Specs

Additional Features:

MOTION CONTROL APPLICATIONS

Other IC type:

JESD-30 Code:

R-PDIP-T16

Length:

19.305 mm

No. of Functions:

1

No. of Terminals:

16

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

DIP

Package Equivalence Code:

DIP16,.3

Package Shape:

Package Style (Meter):

IN-LINE

Peak Reflow Temperature (C):

NOT SPECIFIED

Power Supplies (V):

12

Qualification:

Not Qualified

Maximum Seated Height:

5.08 mm

Sub-Category:

PLL or Frequency Synthesis Circuits

Maximum Supply Voltage (Vsup):

15 V

Minimum Supply Voltage (Vsup):

8 V

Nominal Supply Voltage (Vsup):

12 V

Surface Mount:

NO

Technology:

BIPOLAR

Temperature Grade:

Terminal Form:

THROUGH-HOLE

Terminal Pitch:

2.54 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

NOT SPECIFIED

Width (mm):

7.62 mm

Trade Compliance

UC2635N Other Function Semiconductors trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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