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UC2633QTR

Texas Instruments

UC2633QTR by Texas Instruments

The Texas Instruments UC2633QTR is a PLL frequency synthesizer with 20 terminals in a square chip carrier package. Operating voltage range of 8-15 V, suitable for applications requiring precise frequency synthesis. With a temperature range of -25 to 85°C, it is ideal for various electronic devices.

Median Price

-

Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 8,111 parts In-Stock

1+ parts

-

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8,111

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Digiode

USA . 4,194 parts In-Stock

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4,194

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Semicontronic

India . 1,106 parts In-Stock

1+ parts

$3.500

100+ parts

$3.412

1k+ parts

$3.395

10k+ parts

-

1,106

$3.500

$3.412

$3.395

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One Stop Electronics

USA . 1,118 parts In-Stock

1+ parts

$5.500

100+ parts

-

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1,118

$5.500

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Ampacity Inc.

Singapore . 438 parts In-Stock

1+ parts

$5.500

100+ parts

-

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438

$5.500

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AZTECH Wire

Italy . 685 parts In-Stock

1+ parts

$14.569

100+ parts

-

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685

$14.569

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Parana Technologies

USA . 1,041 parts In-Stock

1+ parts

$19.088

100+ parts

-

1k+ parts

$19.138

10k+ parts

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1,041

$19.088

-

$19.138

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DigiPath Technology Company

USA . 1,021 parts In-Stock

1+ parts

$21.018

100+ parts

$19.337

1k+ parts

-

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1,021

$21.018

$19.337

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ChromeModa Solutions

Germany . 6,530 parts In-Stock

1+ parts

$21.447

100+ parts

$17.587

1k+ parts

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6,530

$21.447

$17.587

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IDEA Electronic Components Group

UK . 761 parts In-Stock

1+ parts

$21.447

100+ parts

$20.375

1k+ parts

$19.302

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761

$21.447

$20.375

$19.302

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Corphita

USA . 815 parts In-Stock

1+ parts

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815

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Corohmni

South Africa . 291 parts In-Stock

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291

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Overview

Unlock precision and reliability with the UC2633QTR by Texas Instruments, a top-of-the-line Phase Locked Loop (PLL) & Frequency Synthesis Circuit. Crafted with quality materials and cutting-edge technology, this chip carrier package offers seamless integration and superior performance in a wide range of applications. From telecommunications to industrial automation, this versatile product ensures stable and accurate frequency synthesis for your projects. Experience the value and benefits that Texas Instruments brings to the table with the UC2633QTR, delivering unmatched quality and efficiency to customers worldwide.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Provides a durable and reliable packaging for the circuit, ensuring longevity and protection from external elements.

Surface Mount: YES

Enables easy and efficient installation onto circuit boards, saving time and effort during assembly.

Nominal Supply Voltage (Vsup): 12 V

Operates effectively at a standard voltage level, making it compatible with a wide range of power sources.

Maximum Operating Temperature: 85 °C

Can withstand higher temperatures without malfunctioning, ensuring stable performance in various environments.

Minimum Operating Temperature: -25 °C

Capable of functioning in low temperature conditions, providing versatility for use in different climates.

Technical Specifications

Phase Locked Loops (PLL) & Frequency Synthesis Circuits UC2633QTR attributes and parameters. Explore more Phase Locked Loops (PLL) & Frequency Synthesis Circuits devices from Texas Instruments

Specs

Additional Features:

MOTION CONTROL APPLICATIONS

Other IC type:

JESD-30 Code:

S-PQCC-J20

Length:

8.965 mm

No. of Functions:

1

No. of Terminals:

20

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-25 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

LDCC20,.4SQ

Package Shape:

Package Style (Meter):

CHIP CARRIER

Peak Reflow Temperature (C):

NOT SPECIFIED

Power Supplies (V):

12

Qualification:

Not Qualified

Maximum Seated Height:

4.57 mm

Sub-Category:

PLL or Frequency Synthesis Circuits

Maximum Supply Voltage (Vsup):

15 V

Minimum Supply Voltage (Vsup):

8 V

Nominal Supply Voltage (Vsup):

12 V

Surface Mount:

YES

Technology:

BIPOLAR

Temperature Grade:

Terminal Form:

J BEND

Terminal Pitch:

1.27 mm

Terminal Position:

QUAD

Maximum Time At Peak Reflow Temperature (s):

NOT SPECIFIED

Width (mm):

8.965 mm

Trade Compliance

UC2633QTR Other Function Semiconductors trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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