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UC2635L

Texas Instruments

UC2635L by Texas Instruments

UC2635L by Texas Instruments is a PLL Frequency Synthesizer with 20 terminals, operating voltage range of 8-15V. It features ceramic-metal package, quad terminal position, and operates b/w -25 to 85°C. Ideal for applications requiring precise frequency synthesis in compact spaces.

Median Price

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Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 6,475 parts In-Stock

1+ parts

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6,475

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Digiode

USA . 2,759 parts In-Stock

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2,759

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Distributors (Availability)

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One Stop Electronics

USA . 944 parts In-Stock

1+ parts

$1.500

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-

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944

$1.500

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Parana Technologies

USA . 2,229 parts In-Stock

1+ parts

$3.069

100+ parts

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$3.584

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2,229

$3.069

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$3.584

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DigiPath Technology Company

USA . 130 parts In-Stock

1+ parts

$3.379

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130

$3.379

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ChromeModa Solutions

Germany . 2,152 parts In-Stock

1+ parts

$3.448

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$2.827

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2,152

$3.448

$2.827

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IDEA Electronic Components Group

UK . 1,494 parts In-Stock

1+ parts

$3.448

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$3.103

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1,494

$3.448

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$3.103

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Semicontronic

India . 1,551 parts In-Stock

1+ parts

$3.500

100+ parts

$3.412

1k+ parts

$3.395

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1,551

$3.500

$3.412

$3.395

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Ampacity Inc.

Singapore . 600 parts In-Stock

1+ parts

$4.500

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600

$4.500

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AZTECH Wire

Italy . 799 parts In-Stock

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$17.899

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799

$17.899

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Corphita

USA . 2,619 parts In-Stock

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2,619

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Corohmni

South Africa . 150 parts In-Stock

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Overview

Unlock the power of precise frequency synthesis with the Texas Instruments UC2635L PLL circuit. Crafted with quality ceramic and metal-sealed materials, this chip carrier package offers reliability and durability for a wide range of applications. From telecommunications to aerospace, this versatile PLL frequency synthesizer ensures optimal performance in any environment. Trust Texas Instruments' decades of expertise in semiconductor manufacturing to deliver unmatched value and performance in every product. Elevate your projects with the UC2635L and experience unparalleled precision and efficiency like never before.

Feature Benefit Bullets

Package Body Material: CERAMIC, METAL-SEALED COFIRED

This material provides excellent protection for the internal components, ensuring durability and reliability in various operating conditions.

Surface Mount: YES

Allows for easy and convenient installation on circuit boards, saving time and effort during assembly.

Nominal Supply Voltage (Vsup): 12 V

Optimal voltage level for stable and efficient performance of the device, ensuring consistent output.

No. of Terminals: 20

Sufficient number of terminals for versatile connectivity options and compatibility with different circuit configurations.

Maximum Operating Temperature: 85 °C

High maximum operating temperature tolerance enables reliable operation in harsh environments without compromising performance.

Technology: BIPOLAR

Bipolar technology offers high speed and precision, making it ideal for frequency synthesis circuits where accuracy is crucial.

Technical Specifications

Phase Locked Loops (PLL) & Frequency Synthesis Circuits UC2635L attributes and parameters. Explore more Phase Locked Loops (PLL) & Frequency Synthesis Circuits devices from Texas Instruments

Specs

Additional Features:

MOTION CONTROL APPLICATIONS

Other IC type:

JESD-30 Code:

S-CQCC-N20

Length:

8.89 mm

No. of Functions:

1

No. of Terminals:

20

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-25 Cel

Package Body Material:

CERAMIC, METAL-SEALED COFIRED

Package Code:

Package Shape:

Package Style (Meter):

CHIP CARRIER

Qualification:

Not Qualified

Maximum Seated Height:

2.54 mm

Maximum Supply Voltage (Vsup):

15 V

Minimum Supply Voltage (Vsup):

8 V

Nominal Supply Voltage (Vsup):

12 V

Surface Mount:

YES

Technology:

BIPOLAR

Temperature Grade:

Terminal Form:

NO LEAD

Terminal Pitch:

1.27 mm

Terminal Position:

QUAD

Width (mm):

8.89 mm

Trade Compliance

UC2635L Other Function Semiconductors trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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