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LMX2430SLEX

Texas Instruments

LMX2430SLEX by Texas Instruments

LMX2430SLEX by Texas Instruments is a PLL frequency synthesizer with 20 terminals, operating b/w -40 to 85°C. It features a supply voltage range of 2.25V to 2.75V and comes in a square chip carrier package suitable for industrial applications requiring precise frequency synthesis.

Median Price

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Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (In-Stock)

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Vyrian

USA . 5,260 parts In-Stock

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Anansix

USA . 2,669 parts In-Stock

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Digiode

USA . 2,181 parts In-Stock

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One Stop Electronics

USA . 971 parts In-Stock

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$1.500

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971

$1.500

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Ampacity Inc.

Singapore . 570 parts In-Stock

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$1.500

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570

$1.500

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Parana Technologies

USA . 957 parts In-Stock

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$16.554

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$1,537.290

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$14.899

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957

$16.554

$1,537.290

$14.899

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AZTECH Wire

Italy . 341 parts In-Stock

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$17.058

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341

$17.058

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DigiPath Technology Company

USA . 2,212 parts In-Stock

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$18.228

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$18.228

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ChromeModa Solutions

Germany . 4,379 parts In-Stock

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$18.600

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$15.252

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$18.600

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IDEA Electronic Components Group

UK . 2,085 parts In-Stock

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$18.600

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$17.670

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$16.740

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2,085

$18.600

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$16.740

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Authorized Procurement Solutions

USA . 3,000 parts In-Stock

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Corphita

USA . 2,328 parts In-Stock

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Kepictronics

USA . 50 parts In-Stock

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Overview

Elevate your electronic designs with the LMX2430SLEX from Texas Instruments, a top-tier manufacturer known for their high-quality products. This Phase Locked Loop (PLL) & Frequency Synthesis Circuit offers unparalleled precision and reliability, making it ideal for a wide range of applications. With its advanced technology and innovative design, this product provides exceptional value to customers by delivering superior performance, efficiency, and versatility. Upgrade your projects today with the LMX2430SLEX and experience the benefits of cutting-edge engineering at your fingertips.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy as the package body material makes the product lightweight and cost-effective.

Surface Mount: YES

The surface mount feature allows for easy and efficient integration into circuit boards, saving space and simplifying assembly.

Nominal Supply Voltage (Vsup): 2.5 V

The nominal supply voltage of 2.5V is ideal for many applications, providing a stable power source for the PLL & Frequency Synthesis Circuit.

No. of Terminals: 20

The 20 terminals provide multiple connection points, allowing for versatile configurations and connections within the circuit.

Maximum Operating Temperature: 85 °C

The high maximum operating temperature of 85°C ensures reliability and performance in various environmental conditions.

Minimum Operating Temperature: -40 °C

The low minimum operating temperature of -40°C allows for operation in cold environments without compromising functionality.

Package Style (Meter): CHIP CARRIER, VERY THIN PROFILE

The chip carrier style with a very thin profile enables compact design and efficient use of space in electronic devices.

Minimum Supply Voltage (Vsup): 2.25 V

The minimum supply voltage of 2.25V ensures compatibility with a wide range of power sources, making the product flexible in various applications.

Terminal Pitch: 0.5 mm

The small terminal pitch of 0.5mm allows for high-density mounting, enabling more terminals to be placed in a limited space for increased functionality.

Temperature Grade: INDUSTRIAL

The industrial temperature grade ensures that the product can withstand harsh operating conditions commonly found in industrial environments.

Technical Specifications

Phase Locked Loops (PLL) & Frequency Synthesis Circuits LMX2430SLEX attributes and parameters. Explore more Phase Locked Loops (PLL) & Frequency Synthesis Circuits devices from Texas Instruments

Specs

Other IC type:

JESD-30 Code:

S-PQCC-N20

Length:

3.5 mm

Moisture Sensitivity Level (MSL):

1

No. of Functions:

1

No. of Terminals:

20

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Shape:

Package Style (Meter):

CHIP CARRIER, VERY THIN PROFILE

Peak Reflow Temperature (C):

260

Maximum Seated Height:

.6 mm

Maximum Supply Voltage (Vsup):

2.75 V

Minimum Supply Voltage (Vsup):

2.25 V

Nominal Supply Voltage (Vsup):

2.5 V

Surface Mount:

YES

Temperature Grade:

Terminal Form:

NO LEAD

Terminal Pitch:

.5 mm

Terminal Position:

QUAD

Maximum Time At Peak Reflow Temperature (s):

30

Width (mm):

3.5 mm

Trade Compliance

LMX2430SLEX Other Function Semiconductors trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

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Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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