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CD54HC4046AF

Texas Instruments

CD54HC4046AF by Texas Instruments

CD54HC4046AF by Texas Instruments is a CMOS Phase Locked Loop IC with 16 terminals. It operates b/w -55 to 125 °C, with Vsup ranging from 2V to 6V. Ideal for military-grade applications requiring precise frequency synthesis and PLL functionality in a compact IN-LINE package.

Median Price

$22.714

Lifecycle Status

Suppliers In-Stock

10

In-Stock Inventory

1k+

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Freelance Electronics

USA . 4 parts In-Stock

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Vyrian

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Holdelec - ElecDif-Pro

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LWI Electronics Inc

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Corel Iberica Componentes, S.L.

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Mil-Aero Solutions, Inc.

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A2Z Electronics, Inc.

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One Stop Electronics

USA . 271 parts In-Stock

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$2.500

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Parana Technologies

USA . 260 parts In-Stock

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DigiPath Technology Company

USA . 765 parts In-Stock

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$2.830

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ChromeModa Solutions

Germany . 1,913 parts In-Stock

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IDEA Electronic Components Group

UK . 1,867 parts In-Stock

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Ampacity Inc.

Singapore . 712 parts In-Stock

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AZTECH Wire

Italy . 844 parts In-Stock

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Supply Digital

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Northwest PG Solutions

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Native Components

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Overview

Upgrade your electronics with the CD54HC4046AF from Texas Instruments, a top-tier manufacturer known for quality and reliability. This Phase Locked Loop (PLL) & Frequency Synthesis Circuit offers precise frequency control and synchronization, making it ideal for a wide range of applications. With its ceramic and glass-sealed package, this product ensures durability and performance in any environment. Trust Texas Instruments to deliver cutting-edge technology that meets your needs seamlessly. Experience the value and benefits of the CD54HC4046AF today!

Feature Benefit Bullets

Package Body Material: CERAMIC, GLASS-SEALED

The ceramic, glass-sealed packaging provides excellent protection for the components inside, ensuring long-term reliability and durability.

Nominal Supply Voltage (Vsup): 3 V

The 3V nominal supply voltage makes it compatible with a wide range of applications and power sources.

Maximum Operating Temperature: 125 °C

With a maximum operating temperature of 125°C, this product can withstand high heat environments, making it suitable for a variety of industrial and military applications.

Technology: CMOS

The CMOS technology used in this product ensures low power consumption and high noise immunity, making it energy-efficient and reliable.

Technical Specifications

Phase Locked Loops (PLL) & Frequency Synthesis Circuits CD54HC4046AF attributes and parameters. Explore more Phase Locked Loops (PLL) & Frequency Synthesis Circuits devices from Texas Instruments

Specs

Other IC type:

JESD-30 Code:

R-GDIP-T16

JESD-609 Code:

e0

Length:

21.34 mm

No. of Functions:

1

No. of Terminals:

16

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-55 Cel

Package Body Material:

CERAMIC, GLASS-SEALED

Package Code:

DIP

Package Equivalence Code:

DIP16,.3

Package Shape:

Package Style (Meter):

IN-LINE

Power Supplies (V):

2/6

Qualification:

Not Qualified

Maximum Seated Height:

5.08 mm

Sub-Category:

PLL or Frequency Synthesis Circuits

Maximum Supply Current (Isup):

.16 mA

Maximum Supply Voltage (Vsup):

6 V

Minimum Supply Voltage (Vsup):

2 V

Nominal Supply Voltage (Vsup):

3 V

Surface Mount:

NO

Technology:

CMOS

Temperature Grade:

Terminal Finish:

TIN LEAD

Terminal Form:

THROUGH-HOLE

Terminal Pitch:

2.54 mm

Terminal Position:

DUAL

Width (mm):

7.62 mm

Trade Compliance

CD54HC4046AF Other Function Semiconductors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

NSN

5962-01-308-6360, 5962013086360

NIIN

013086360

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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