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CD74HC4046ANSRE4

Texas Instruments

CD74HC4046ANSRE4 by Texas Instruments

CD74HC4046ANSRE4 by Texas Instruments is a Phase Locked Loop (PLL) IC with 16 terminals. It operates at supply voltages b/w 2-6V and has a low supply current of 0.16mA. Ideal for military-grade applications due to its wide temperature range (-55 to 125°C) and small outline package style.

Median Price

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Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

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Vyrian

USA . 5,785 parts In-Stock

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Digiode

USA . 2,108 parts In-Stock

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Semicontronic

India . 1,295 parts In-Stock

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$1.500

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$1.462

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$1.455

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$1.500

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One Stop Electronics

USA . 646 parts In-Stock

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$3.500

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Ampacity Inc.

Singapore . 1,275 parts In-Stock

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$4.500

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AZTECH Wire

Italy . 477 parts In-Stock

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$12.062

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Parana Technologies

USA . 1,884 parts In-Stock

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$15.166

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$15.567

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ChromeModa Solutions

Germany . 3,228 parts In-Stock

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$17.041

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$13.974

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$17.041

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IDEA Electronic Components Group

UK . 151 parts In-Stock

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$17.041

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$16.189

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$15.337

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$15.337

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QUARKTWIN TECHNOLOGY LTD

USA . 28,160 parts In-Stock

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Corphita

USA . 4,740 parts In-Stock

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Microchip USA

USA . 2,200 parts In-Stock

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Northwest PG Solutions

USA . 2,011 parts In-Stock

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DigiPath Technology Company

USA . 1,241 parts In-Stock

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Perfect Parts

USA . 1,170 parts In-Stock

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Corohmni

South Africa . 218 parts In-Stock

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Native Components

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Overview

Enhance your electronic designs with the CD74HC4046ANSRE4 by Texas Instruments, a top-tier manufacturer known for delivering exceptional quality and reliability. This Phase Locked Loops (PLL) & Frequency Synthesis Circuit offers unparalleled performance and precision in various applications. With a compact package design and wide operating temperature range, this product ensures optimal functionality in diverse environments. Experience the value and benefits of Texas Instruments' cutting-edge technology, providing customers with superior solutions for their electronic needs. Elevate your projects with the CD74HC4046ANSRE4 today!

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

This material provides good insulation and protection for the components inside the package, ensuring durability and reliability.

Surface Mount: YES

Surface mount technology allows for easy and efficient assembly onto circuit boards, saving space and improving overall performance.

Nominal Supply Voltage (Vsup): 3 V

Operates efficiently at a commonly used voltage level, making it compatible with a wide range of applications.

Maximum Operating Temperature: 125 °C

Can withstand high temperatures, making it suitable for various environmental conditions and applications.

Minimum Operating Temperature: -55 °C

Has a wide temperature range, ensuring stable performance in extreme cold conditions.

Technology: CMOS

CMOS technology offers low power consumption and high noise immunity, making the product energy efficient and reliable.

Technical Specifications

Phase Locked Loops (PLL) & Frequency Synthesis Circuits CD74HC4046ANSRE4 attributes and parameters. Explore more Phase Locked Loops (PLL) & Frequency Synthesis Circuits devices from Texas Instruments

Specs

Other IC type:

JESD-30 Code:

R-PDSO-G16

JESD-609 Code:

e4

Length:

10.2 mm

Moisture Sensitivity Level (MSL):

1

No. of Functions:

1

No. of Terminals:

16

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-55 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

SOP

Package Equivalence Code:

SOP16,.3

Package Shape:

Package Style (Meter):

SMALL OUTLINE

Peak Reflow Temperature (C):

260

Power Supplies (V):

2/6

Qualification:

Not Qualified

Maximum Seated Height:

2 mm

Sub-Category:

PLL or Frequency Synthesis Circuits

Maximum Supply Current (Isup):

.16 mA

Maximum Supply Voltage (Vsup):

6 V

Minimum Supply Voltage (Vsup):

2 V

Nominal Supply Voltage (Vsup):

3 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

Nickel/Palladium/Gold (Ni/Pd/Au)

Terminal Form:

GULL WING

Terminal Pitch:

1.27 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

NOT SPECIFIED

Width (mm):

5.3 mm

Trade Compliance

CD74HC4046ANSRE4 Other Function Semiconductors trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

PCN

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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