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LMX2352TM

Texas Instruments

LMX2352TM by Texas Instruments

LMX2352TM by Texas Instruments is a PLL frequency synthesizer with 24 terminals, operating at -40 to 85°C. It has a supply voltage of 3/5V and consumes up to 6mA. This BICMOS technology IC is ideal for industrial applications requiring precise frequency synthesis in compact designs.

Median Price

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Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (In-Stock)

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Vyrian

USA . 4,101 parts In-Stock

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Anansix

USA . 1,869 parts In-Stock

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1,869

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Digiode

USA . 453 parts In-Stock

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453

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One Stop Electronics

USA . 1,231 parts In-Stock

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$6.500

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$6.500

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AZTECH Wire

Italy . 715 parts In-Stock

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$6.647

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715

$6.647

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Parana Technologies

USA . 5 parts In-Stock

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$8.259

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$8.875

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5

$8.259

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$8.875

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DigiPath Technology Company

USA . 1,866 parts In-Stock

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$9.094

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$8.367

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1,866

$9.094

$8.367

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ChromeModa Solutions

Germany . 1,385 parts In-Stock

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$9.280

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$7.610

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1,385

$9.280

$7.610

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IDEA Electronic Components Group

UK . 1,063 parts In-Stock

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$9.280

100+ parts

$8.816

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$8.352

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1,063

$9.280

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$8.352

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Lixinc

USA . 6,576 parts In-Stock

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6,576

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Alle Elektronik GmbH

Germany . 3,782 parts In-Stock

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Corphita

USA . 3,004 parts In-Stock

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Overview

Experience the next level of precision and performance with the LMX2352TM by Texas Instruments. Crafted with top-notch quality and expertise, this Phase Locked Loop (PLL) & Frequency Synthesis Circuit is designed to deliver unparalleled accuracy and reliability in a wide range of applications. From telecommunications to radar systems, this product offers exceptional value, benefits, and advantages to customers seeking seamless frequency control solutions. Trust Texas Instruments to elevate your projects with cutting-edge technology and innovation.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

This material is durable and cost-effective, making the product reliable and affordable.

Surface Mount: YES

Allows for easy and efficient assembly onto circuit boards, saving time and labor costs.

Package Shape: RECTANGULAR

Rectangular shape makes it easy to integrate into various electronic devices and systems.

Power Supplies (V): 3/5

Can operate with different power supplies, providing flexibility in design and compatibility.

No. of Terminals: 24

Sufficient number of terminals for connecting to other components and circuits, enabling versatile applications.

Package Style (Meter): SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

Compact and slim design saves space on the circuit board and allows for dense packaging of components.

Maximum Operating Temperature: 85 °C

Can withstand high temperatures, suitable for industrial environments and extended use.

Minimum Operating Temperature: -40 °C

Operates in low temperatures, making it suitable for a wide range of environmental conditions.

Terminal Position: DUAL

Dual terminal position provides redundancy and improves connection stability.

Other IC type: PLL FREQUENCY SYNTHESIZER

Incorporates PLL technology for precise frequency synthesis, ensuring accurate and stable output signals.

Temperature Grade: INDUSTRIAL

Designed to meet industrial temperature requirements, ensuring reliable performance in harsh conditions.

Maximum Supply Current (Isup): 6 mA

Low supply current consumption for energy-efficient operation and extended battery life.

Technology: BICMOS

Utilizes BiCMOS technology for high-speed operation and low power consumption, ideal for modern electronic devices.

Terminal Form: GULL WING

Gull wing terminals are robust and provide secure solder connections during assembly.

Terminal Pitch: 0.635 mm

Fine terminal pitch allows for precise connections and compact layout on the circuit board.

Technical Specifications

Phase Locked Loops (PLL) & Frequency Synthesis Circuits LMX2352TM attributes and parameters. Explore more Phase Locked Loops (PLL) & Frequency Synthesis Circuits devices from Texas Instruments

Specs

Other IC type:

JESD-30 Code:

R-PDSO-G24

No. of Terminals:

24

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

TSSOP24,.25

Package Shape:

Package Style (Meter):

SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

Peak Reflow Temperature (C):

NOT SPECIFIED

Power Supplies (V):

3/5

Qualification:

Not Qualified

Sub-Category:

PLL or Frequency Synthesis Circuits

Maximum Supply Current (Isup):

6 mA

Surface Mount:

YES

Technology:

BICMOS

Temperature Grade:

Terminal Form:

GULL WING

Terminal Pitch:

.635 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

NOT SPECIFIED

Trade Compliance

LMX2352TM Other Function Semiconductors trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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