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LMX2335TM

Texas Instruments

LMX2335TM by Texas Instruments

LMX2335TM by Texas Instruments is a PLL frequency synthesizer with 16 terminals, operating at temperatures from -40 to 85°C. It has a supply voltage range of 2.7-5.5V and consumes up to 12mA current. This IC is ideal for applications requiring precise frequency synthesis in industrial settings.

Median Price

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Lifecycle Status

Suppliers In-Stock

4

In-Stock Inventory

1k+

Distributors (In-Stock)

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Vyrian

USA . 3,826 parts In-Stock

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Digiode

USA . 3,137 parts In-Stock

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Anansix

USA . 2,712 parts In-Stock

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Bristol Electronics

USA . 255 parts In-Stock

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255

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One Stop Electronics

USA . 1,308 parts In-Stock

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$6.500

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$6.500

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AZTECH Wire

Italy . 509 parts In-Stock

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$9.118

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509

$9.118

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Parana Technologies

USA . 421 parts In-Stock

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$22.226

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$22.887

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421

$22.226

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$22.887

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DigiPath Technology Company

USA . 1,062 parts In-Stock

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$24.474

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$22.516

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1,062

$24.474

$22.516

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ChromeModa Solutions

Germany . 4,166 parts In-Stock

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$24.973

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$20.478

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$24.973

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IDEA Electronic Components Group

UK . 1,171 parts In-Stock

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$24.973

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$23.724

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$22.476

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1,171

$24.973

$23.724

$22.476

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Corphita

USA . 5,110 parts In-Stock

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Assy Fe

Spain . 1,000 parts In-Stock

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SIE Connect GmbH (Excess)

Germany . 84 parts In-Stock

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Overview

Elevate your systems with the Texas Instruments LMX2335TM PLL Frequency Synthesizer. Crafted with precision and quality by a trusted manufacturer, this compact device offers unparalleled performance for your Phase Locked Loops & Frequency Synthesis Circuits. With a wide operating temperature range and low power consumption, it's perfect for industrial applications. Unlock the potential of your projects with the value and reliability that only Texas Instruments can deliver.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Plastic/epoxy material provides durability and protection against environmental factors, making this product reliable for long-term use.

Surface Mount: YES

Surface mount capability allows for easy integration onto PCBs, saving space and simplifying the assembly process.

Nominal Supply Voltage (Vsup): 5 V

Operates efficiently at a common 5V supply voltage, making it compatible with standard power sources.

No. of Terminals: 16

Provides ample connectivity options for interfacing with other components in the circuit.

Maximum Operating Temperature: 85 °C

Withstands high temperatures, ensuring reliable performance in challenging environments.

Temperature Grade: INDUSTRIAL

Designed for industrial applications, offering robust performance in demanding conditions.

Technology: BICMOS

Utilizes advanced BiCMOS technology for high-speed operation and low power consumption.

Technical Specifications

Phase Locked Loops (PLL) & Frequency Synthesis Circuits LMX2335TM attributes and parameters. Explore more Phase Locked Loops (PLL) & Frequency Synthesis Circuits devices from Texas Instruments

Specs

Other IC type:

JESD-30 Code:

R-PDSO-G16

JESD-609 Code:

e0

Length:

5 mm

No. of Functions:

1

No. of Terminals:

16

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

TSSOP20,.25

Package Shape:

Package Style (Meter):

SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

Power Supplies (V):

3/5

Qualification:

Not Qualified

Maximum Seated Height:

1.1 mm

Sub-Category:

PLL or Frequency Synthesis Circuits

Maximum Supply Current (Isup):

12 mA

Maximum Supply Voltage (Vsup):

5.5 V

Minimum Supply Voltage (Vsup):

2.7 V

Nominal Supply Voltage (Vsup):

5 V

Surface Mount:

YES

Technology:

BICMOS

Temperature Grade:

Terminal Finish:

Tin/Lead (Sn/Pb)

Terminal Form:

GULL WING

Terminal Pitch:

.65 mm

Terminal Position:

DUAL

Width (mm):

4.4 mm

Trade Compliance

LMX2335TM Other Function Semiconductors trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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