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LMX2316TMX

Texas Instruments

LMX2316TMX by Texas Instruments

LMX2316TMX by Texas Instruments is a PLL frequency synthesizer with 16 terminals, operating voltage range of 2.3V to 5.5V, and industrial temperature grade of -40°C to 85°C. It features a small outline package with thin profile and shrink pitch, making it suitable for applications requiring precise frequency synthesis in compact spaces. The device utilizes BICMOS technology and offers peak reflow temperature of 260°C for robust performance in various electronic systems.

Median Price

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Lifecycle Status

Suppliers In-Stock

9

In-Stock Inventory

1k+

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Vyrian

USA . 7,952 parts In-Stock

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Digiode

USA . 5,211 parts In-Stock

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Sea View Technologies

USA . 573 parts In-Stock

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Bristol Electronics

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Anansix

USA . 484 parts In-Stock

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Nova Conductors

Japan . 73 parts In-Stock

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Semi Source

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Prism Electronics

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Ampacity Inc.

Singapore . 478 parts In-Stock

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$2.500

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One Stop Electronics

USA . 1,634 parts In-Stock

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$3.500

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Corohmni

South Africa . 231 parts In-Stock

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$5.298

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AZTECH Wire

Italy . 424 parts In-Stock

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Parana Technologies

USA . 572 parts In-Stock

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$14.786

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DigiPath Technology Company

USA . 712 parts In-Stock

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$15.784

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$14.521

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ChromeModa Solutions

Germany . 4,456 parts In-Stock

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IDEA Electronic Components Group

UK . 1,655 parts In-Stock

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$15.301

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$14.495

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Kepictronics

USA . 6,431 parts In-Stock

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Continental Prestige Electronics

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A-Z Elektronik GmbH

Germany . 1,929 parts In-Stock

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Corphita

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Alle Elektronik GmbH

Germany . 1,286 parts In-Stock

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Argo Parts USA

USA . 916 parts In-Stock

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Aranea Global

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Overview

Unlock precision and reliability with the LMX2316TMX by Texas Instruments. As a trusted leader in the industry, Texas Instruments delivers top-notch Phase Locked Loops (PLL) & Frequency Synthesis Circuits that guarantee optimal performance in a variety of applications. With its compact design and wide temperature range, this product is perfect for industrial settings where stability is key. Trust in Texas Instruments to provide cutting-edge technology with the LMX2316TMX, offering customers unparalleled value and efficiency.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The plastic/epoxy package body material makes the product lightweight and cost-effective.

Surface Mount: YES

Being surface mountable, this product is easy to install and saves space on the PCB.

Nominal Supply Voltage (Vsup): 3 V

Operates at a standard 3V supply voltage, making it compatible with a wide range of systems.

No. of Terminals: 16

With 16 terminals, this product offers versatile connectivity options for different applications.

Maximum Operating Temperature: 85 °C

Capable of operating at high temperatures, ensuring reliable performance in various environments.

Minimum Operating Temperature: -40 °C

Can function in low-temperature conditions, making it suitable for a range of operating environments.

Technology: BICMOS

Utilizes BiCMOS technology which combines the advantages of both bipolar and CMOS technologies for improved performance.

Maximum Supply Voltage (Vsup): 5.5 V

Can handle a maximum supply voltage of 5.5V, providing flexibility in power supply options.

Technical Specifications

Phase Locked Loops (PLL) & Frequency Synthesis Circuits LMX2316TMX attributes and parameters. Explore more Phase Locked Loops (PLL) & Frequency Synthesis Circuits devices from Texas Instruments

Specs

Other IC type:

JESD-30 Code:

R-PDSO-G16

JESD-609 Code:

e0

Length:

5 mm

Moisture Sensitivity Level (MSL):

1

No. of Functions:

1

No. of Terminals:

16

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Shape:

Package Style (Meter):

SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

Peak Reflow Temperature (C):

260

Maximum Seated Height:

1.1 mm

Maximum Supply Voltage (Vsup):

5.5 V

Minimum Supply Voltage (Vsup):

2.3 V

Nominal Supply Voltage (Vsup):

3 V

Surface Mount:

YES

Technology:

BICMOS

Temperature Grade:

Terminal Finish:

TIN LEAD

Terminal Form:

GULL WING

Terminal Pitch:

.65 mm

Terminal Position:

DUAL

Width (mm):

4.4 mm

Trade Compliance

LMX2316TMX Other Function Semiconductors trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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