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CD74HCT7046AMG4

Texas Instruments

CD74HCT7046AMG4 by Texas Instruments

CD74HCT7046AMG4 by Texas Instruments is a Phase Locked Loop IC with 16 terminals, operating at 5V. It has a temperature range of -55 to 125°C and uses CMOS technology. This PLL circuit is ideal for military applications requiring precise frequency synthesis in compact designs.

Median Price

$2.016

Lifecycle Status

Suppliers In-Stock

4

In-Stock Inventory

1k+

Distributors (In-Stock)

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Vyrian

USA . 5,561 parts In-Stock

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Digiode

USA . 3,574 parts In-Stock

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Bristol Electronics

USA . 40 parts In-Stock

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$2.016

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$2.016

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$2.016

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$2.016

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$2.016

Microfarads

USA . 39 parts In-Stock

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39

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One Stop Electronics

USA . 929 parts In-Stock

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$6.500

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AZTECH Wire

Italy . 685 parts In-Stock

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$15.353

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685

$15.353

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Parana Technologies

USA . 541 parts In-Stock

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$21.997

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$22.535

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541

$21.997

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DigiPath Technology Company

USA . 1,499 parts In-Stock

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$24.222

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$22.284

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ChromeModa Solutions

Germany . 3,408 parts In-Stock

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$24.716

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$20.267

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IDEA Electronic Components Group

UK . 1,267 parts In-Stock

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$24.716

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$23.480

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$22.244

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Native Components

USA . 892 parts In-Stock

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$141.230

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$135.581

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Northwest PG Solutions

USA . 1,841 parts In-Stock

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Corphita

USA . 4,712 parts In-Stock

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Microchip USA

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Glotronic Ltd.

UK . 3,790 parts In-Stock

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Authorized Procurement Solutions

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Overview

Unlock the power of precision frequency synthesis with the CD74HCT7046AMG4 by Texas Instruments. This top-quality Phase Locked Loop (PLL) circuit offers unparalleled performance and reliability, thanks to the renowned expertise of its manufacturer. Ideal for a wide range of applications, this compact and versatile device delivers exceptional value to customers seeking robust and efficient solutions. Experience superior functionality and seamless integration with the CD74HCT7046AMG4, setting new standards in frequency control technology.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy material makes the product lightweight and durable, ensuring long-term reliability in various applications.

Surface Mount: YES

Being surface mount compatible allows for easy installation on printed circuit boards, saving space and improving assembly efficiency.

Nominal Supply Voltage (Vsup): 5V

Operating at a standard 5V supply voltage makes it compatible with a wide range of systems and power sources, ensuring ease of integration.

Maximum Operating Temperature: 125 °C

With a high maximum operating temperature, the product can perform reliably in demanding environmental conditions without risk of overheating.

Minimum Operating Temperature: -55 °C

The ability to function at low temperatures makes the product suitable for use in various industrial and outdoor settings, increasing its versatility.

Technology: CMOS

The CMOS technology used in the product offers low power consumption and high noise immunity, making it an efficient and reliable choice for frequency synthesis circuits.

Technical Specifications

Phase Locked Loops (PLL) & Frequency Synthesis Circuits CD74HCT7046AMG4 attributes and parameters. Explore more Phase Locked Loops (PLL) & Frequency Synthesis Circuits devices from Texas Instruments

Specs

Other IC type:

JESD-30 Code:

R-PDSO-G16

JESD-609 Code:

e4

Length:

9.9 mm

Moisture Sensitivity Level (MSL):

1

No. of Functions:

1

No. of Terminals:

16

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-55 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

SOP

Package Equivalence Code:

SOP16,.25

Package Shape:

Package Style (Meter):

SMALL OUTLINE

Peak Reflow Temperature (C):

260

Power Supplies (V):

5

Qualification:

Not Qualified

Maximum Seated Height:

1.75 mm

Sub-Category:

PLL or Frequency Synthesis Circuits

Maximum Supply Current (Isup):

.16 mA

Maximum Supply Voltage (Vsup):

5.5 V

Minimum Supply Voltage (Vsup):

4.5 V

Nominal Supply Voltage (Vsup):

5 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

Nickel/Palladium/Gold (Ni/Pd/Au)

Terminal Form:

GULL WING

Terminal Pitch:

1.27 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

NOT SPECIFIED

Width (mm):

3.9 mm

Trade Compliance

CD74HCT7046AMG4 Other Function Semiconductors trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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