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UC2635J

Texas Instruments

UC2635J by Texas Instruments

The Texas Instruments UC2635J is a PLL frequency synthesizer IC with 16 terminals, operating voltage range of 8-15V. It features bipolar technology, ceramic package material, and rectangular shape. Ideal for applications requiring precise frequency synthesis in temperature ranges from -25 to 85°C.

Median Price

-

Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 7,431 parts In-Stock

1+ parts

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7,431

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Digiode

USA . 4,993 parts In-Stock

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4,993

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

One Stop Electronics

USA . 676 parts In-Stock

1+ parts

$0.500

100+ parts

-

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676

$0.500

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Semicontronic

India . 1,041 parts In-Stock

1+ parts

$3.500

100+ parts

$3.412

1k+ parts

$3.395

10k+ parts

-

1,041

$3.500

$3.412

$3.395

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Ampacity Inc.

Singapore . 644 parts In-Stock

1+ parts

$4.500

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-

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644

$4.500

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AZTECH Wire

Italy . 446 parts In-Stock

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$6.517

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446

$6.517

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Parana Technologies

USA . 405 parts In-Stock

1+ parts

$11.806

100+ parts

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$12.207

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405

$11.806

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$12.207

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DigiPath Technology Company

USA . 1,203 parts In-Stock

1+ parts

$13.000

100+ parts

$11.960

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1,203

$13.000

$11.960

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ChromeModa Solutions

Germany . 1,053 parts In-Stock

1+ parts

$13.265

100+ parts

$10.877

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1,053

$13.265

$10.877

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IDEA Electronic Components Group

UK . 276 parts In-Stock

1+ parts

$13.265

100+ parts

$12.602

1k+ parts

$11.938

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276

$13.265

$12.602

$11.938

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Corphita

USA . 4,043 parts In-Stock

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4,043

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Corohmni

South Africa . 214 parts In-Stock

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214

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Overview

Unlock the potential of your electronic designs with the Texas Instruments UC2635J, a top-tier Phase Locked Loop (PLL) & Frequency Synthesis Circuit. Manufactured by industry leader Texas Instruments, this product offers unparalleled quality and reliability. Ideal for a wide range of applications, this IC type PLL Frequency Synthesizer provides precise frequency control in a compact package. Trust in Texas Instruments to deliver cutting-edge technology that enhances the performance of your projects. Choose the UC2635J for superior value, benefits, and advantages that will elevate your design capabilities.

Feature Benefit Bullets

Package Body Material: CERAMIC, GLASS-SEALED

The ceramic, glass-sealed package body material ensures durability and reliability, making this product suitable for various environments and applications.

Nominal Supply Voltage (Vsup): 12 V

The nominal supply voltage of 12V indicates that this product can be easily integrated into systems with standard power requirements, offering compatibility and ease of use.

Maximum Operating Temperature: 85 °C

With a high maximum operating temperature of 85°C, this product can withstand elevated temperatures, providing stability and performance in demanding conditions.

Technology: BIPOLAR

The bipolar technology used in this product offers precise and accurate frequency synthesis, ensuring reliable operation and consistent output signals.

Technical Specifications

Phase Locked Loops (PLL) & Frequency Synthesis Circuits UC2635J attributes and parameters. Explore more Phase Locked Loops (PLL) & Frequency Synthesis Circuits devices from Texas Instruments

Specs

Additional Features:

MOTION CONTROL APPLICATIONS

Other IC type:

JESD-30 Code:

R-GDIP-T16

No. of Functions:

1

No. of Terminals:

16

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-25 Cel

Package Body Material:

CERAMIC, GLASS-SEALED

Package Code:

DIP

Package Shape:

Package Style (Meter):

IN-LINE

Qualification:

Not Qualified

Maximum Seated Height:

5.08 mm

Maximum Supply Voltage (Vsup):

15 V

Minimum Supply Voltage (Vsup):

8 V

Nominal Supply Voltage (Vsup):

12 V

Surface Mount:

NO

Technology:

BIPOLAR

Temperature Grade:

Terminal Form:

THROUGH-HOLE

Terminal Pitch:

2.54 mm

Terminal Position:

DUAL

Width (mm):

7.62 mm

Trade Compliance

UC2635J Other Function Semiconductors trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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