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HEF4046BP

NXP Semiconductors

HEF4046BP by NXP Semiconductors

HEF4046BP by NXP Semiconductors is a Phase Locked Loop (PLL) IC with 16 terminals, operating voltage of 3-15V. It features CMOS technology, temperature range -40 to 85°C, and nickel palladium gold finish. Widely used in frequency synthesis circuits for industrial applications due to its compact rectangular package design.

Median Price

$2.908

Lifecycle Status

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Nova Conductors

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Argo Parts USA

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Continental Prestige Electronics

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Overview

Unlock the power of precision with the HEF4046BP by NXP Semiconductors. Designed for Phase Locked Loops & Frequency Synthesis Circuits, this product offers unparalleled quality and reliability from a trusted manufacturer. Perfect for industrial applications, this versatile component allows for seamless frequency synchronization while ensuring optimal performance. Experience the value and benefits that the HEF4046BP brings to your projects, setting you apart from the competition. Elevate your designs with this cutting-edge technology today.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Provides durability and protection for the components inside the package.

Nominal Supply Voltage (Vsup): 5 V

Common and easily available supply voltage, simplifying power requirements.

Temperature Grade: INDUSTRIAL

Suitable for industrial applications with a wide temperature range of -40°C to 85°C.

Technology: CMOS

CMOS technology offers low power consumption and high noise immunity.

Terminal Form: THROUGH-HOLE

Allows for easy and secure installation on a circuit board.

Technical Specifications

Phase Locked Loops (PLL) & Frequency Synthesis Circuits HEF4046BP attributes and parameters. Explore more Phase Locked Loops (PLL) & Frequency Synthesis Circuits devices from NXP Semiconductors

Specs

Additional Features:

WITH TWO PHASE COMPARATORS

Other IC type:

JESD-30 Code:

R-PDIP-T16

JESD-609 Code:

e4

Length:

21.6 mm

No. of Functions:

1

No. of Terminals:

16

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

DIP

Package Equivalence Code:

DIP16,.3

Package Shape:

Package Style (Meter):

IN-LINE

Power Supplies (V):

5/15

Qualification:

Not Qualified

Maximum Seated Height:

4.7 mm

Sub-Category:

PLL or Frequency Synthesis Circuits

Maximum Supply Voltage (Vsup):

15 V

Minimum Supply Voltage (Vsup):

3 V

Nominal Supply Voltage (Vsup):

5 V

Surface Mount:

NO

Technology:

CMOS

Temperature Grade:

Terminal Finish:

NICKEL PALLADIUM GOLD

Terminal Form:

THROUGH-HOLE

Terminal Pitch:

2.54 mm

Terminal Position:

DUAL

Width (mm):

7.62 mm

Trade Compliance

HEF4046BP Other Function Semiconductors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

NXP Semiconductors

NXP is a leading semiconductor company that creates cutting-edge technology to power secure connections in a smarter world. Founded in 2006, they have grown to become one of the top five global semiconductor companies and serve their customers in over 70 countries around the world.

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The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

Executive Director, President, CEO

Kurt Sievers

Executive VP, CFO

Bill Betz

Executive VP, Chief Sales Officer

Ron Martino

Manufacturer fab locations 7

Fab name Location Fab Initiation Wafer Capacity

ICN8

Fabrication

Fab Initiation

1996

Netherlands

Nijmegen

Wafer Capacity

55,000

1996

55,000

ATMC (Austin Tech & Mfg Center)

Fabrication

Fab Initiation

1995

USA

Austin

Wafer Capacity

30,000

1995

30,000

N/A

Fabrication

Fab Initiation

1989

Germany

Boeblingen

Wafer Capacity

1989

CHD

Fabrication

Fab Initiation

1993

USA

Chandler

Wafer Capacity

30,000

1993

30,000

OHTC

Fabrication

Fab Initiation

1991

USA

Austin

Wafer Capacity

24,000

1991

24,000

New Expansion Fab

Fabrication

Fab Initiation

2026

USA

Austin

Wafer Capacity

2026

ECHO

Fabrication

Fab Initiation

2020

USA

Chandler

Wafer Capacity

10,000

2020

10,000

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