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TLC2932IPWRG4

Texas Instruments

TLC2932IPWRG4 by Texas Instruments

TLC2932IPWRG4 by Texas Instruments is a Phase Locked Loop IC with 14 terminals, operating b/w -40 to 85°C. It has a supply voltage range of 4.75-5.25V and peak reflow temp of 260°C. Ideal for frequency synthesis circuits in industrial applications due to its compact size and CMOS technology.

Median Price

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Lifecycle Status

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8

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1k+

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Vyrian

USA . 6,791 parts In-Stock

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Specialty Parts & Electronic Components, Inc. (S.P.E.C.)

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Bristol Electronics

USA . 1,568 parts In-Stock

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Dan-Mar Components

USA . 1,568 parts In-Stock

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Sensible Micro Corp

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Digiode

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EMSNET

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One Stop Electronics

USA . 231 parts In-Stock

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AZTECH Wire

Italy . 804 parts In-Stock

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Parana Technologies

USA . 1,252 parts In-Stock

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DigiPath Technology Company

USA . 1,051 parts In-Stock

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ChromeModa Solutions

Germany . 798 parts In-Stock

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IDEA Electronic Components Group

UK . 350 parts In-Stock

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A-Z Elektronik GmbH

Germany . 6,231 parts In-Stock

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Computer Components Inc. - USA

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Corphita

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Cyclops Electronics Ltd (Excess)

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Kepictronics

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Overview

Unlock the power of precision frequency control with the TLC2932IPWRG4 by Texas Instruments. Crafted with top-quality materials and advanced CMOS technology, this Phase Locked Loop offers unparalleled performance in PLL & Frequency Synthesis Circuits. Ideal for industrial applications, this compact and versatile device operates seamlessly within a wide temperature range, ensuring reliability and stability. Elevate your projects with the TLC2932IPWRG4 and experience the innovation and excellence that only Texas Instruments can deliver.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The plastic/epoxy material is durable and cost-effective, making the product suitable for various applications where reliability and affordability are important factors.

Surface Mount: YES

The surface mount capability allows for easy and efficient assembly, saving time and effort during the manufacturing process.

Nominal Supply Voltage (Vsup): 5 V

A reliable and common voltage supply of 5V ensures compatibility with a wide range of systems and applications.

Maximum Operating Temperature: 85 °C

The high maximum operating temperature of 85°C allows for reliable performance even in demanding environments where temperature fluctuations may occur.

Technology: CMOS

CMOS technology offers low power consumption and high noise immunity, making the product energy-efficient and reliable in noisy electrical environments.

Technical Specifications

Phase Locked Loops (PLL) & Frequency Synthesis Circuits TLC2932IPWRG4 attributes and parameters. Explore more Phase Locked Loops (PLL) & Frequency Synthesis Circuits devices from Texas Instruments

Specs

Additional Features:

ALSO REQUIRE 3V SUPPLY

Other IC type:

JESD-30 Code:

R-PDSO-G14

JESD-609 Code:

e4

Length:

5.1 mm

Moisture Sensitivity Level (MSL):

1

No. of Functions:

1

No. of Terminals:

14

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

TSSOP14,.25

Package Shape:

Package Style (Meter):

SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

Peak Reflow Temperature (C):

260

Power Supplies (V):

3/5

Qualification:

Not Qualified

Maximum Seated Height:

1.2 mm

Sub-Category:

PLL or Frequency Synthesis Circuits

Maximum Supply Voltage (Vsup):

5.25 V

Minimum Supply Voltage (Vsup):

4.75 V

Nominal Supply Voltage (Vsup):

5 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

NICKEL PALLADIUM GOLD

Terminal Form:

GULL WING

Terminal Pitch:

.65 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

30

Width (mm):

4.5 mm

Trade Compliance

TLC2932IPWRG4 Other Function Semiconductors trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

PCN

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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