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LMX2531LQ2080E

Texas Instruments

LMX2531LQ2080E by Texas Instruments

LMX2531LQ2080E by Texas Instruments is a PLL frequency synthesizer with 36 terminals, operating at temperatures from -40 to 85°C. It features a nominal voltage of 3V, suitable for industrial applications requiring precise frequency synthesis in compact square chip carrier packages.

Median Price

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Lifecycle Status

Suppliers In-Stock

4

In-Stock Inventory

1k+

Distributors (In-Stock)

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Digiode

USA . 1,884 parts In-Stock

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Anansix

USA . 1,525 parts In-Stock

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Vyrian

USA . 624 parts In-Stock

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Prism Electronics

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One Stop Electronics

USA . 646 parts In-Stock

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$7.500

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646

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Parana Technologies

USA . 2,150 parts In-Stock

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$11.181

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$11.626

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ChromeModa Solutions

Germany . 1,314 parts In-Stock

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$12.563

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$10.302

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IDEA Electronic Components Group

UK . 32 parts In-Stock

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$12.563

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$11.935

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$11.307

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32

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$11.307

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AZTECH Wire

Italy . 750 parts In-Stock

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Lixinc

USA . 12,007 parts In-Stock

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A-Z Elektronik GmbH

Germany . 6,125 parts In-Stock

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Alle Elektronik GmbH

Germany . 4,083 parts In-Stock

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Corphita

USA . 3,196 parts In-Stock

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DigiPath Technology Company

USA . 1,271 parts In-Stock

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Kepictronics

USA . 1,250 parts In-Stock

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Overview

Elevate your electronic designs with the LMX2531LQ2080E by Texas Instruments, a top-tier manufacturer known for its high-quality components. This PLL frequency synthesizer is ideal for a wide range of applications in phase-locked loops and frequency synthesis circuits. With a compact square package shape and chip carrier style, this product offers excellent performance in a small footprint. Experience the value and benefits of precise frequency control and reliable operation, backed by Texas Instruments' reputation for excellence in the industry. Upgrade your projects with the LMX2531LQ2080E today!

Feature Benefit Bullets

Surface Mount: YES

Allows for easy and convenient installation on circuit boards, saving time and effort.

Package Shape: SQUARE

Square packages are known for efficient use of space on a circuit board, promoting compact designs.

Nominal Supply Voltage (Vsup): 3 V

Operates efficiently at a common and stable voltage level, ensuring reliable performance.

No. of Terminals: 36

Provides a good number of connection points for various input and output signals, enhancing versatility.

Package Style (Meter): CHIP CARRIER, VERY THIN PROFILE

Thin profile design helps in creating sleek and space-saving electronic devices.

Maximum Operating Temperature: 85 °C

Can withstand high temperatures, making it suitable for industrial applications where heat dissipation is important.

Minimum Operating Temperature: -40 °C

Capable of functioning in extreme cold conditions, ensuring reliability in diverse environments.

Terminal Finish: TIN LEAD

Tin lead finish offers good solderability, making the product easy to integrate into circuit assemblies.

Terminal Position: QUAD

Quad terminal arrangement simplifies connections, aiding in easy integration into circuit layouts.

Maximum Seated Height: 0.8 mm

Low profile design helps in creating slim and compact electronic devices.

Width (mm): 6 mm

Compact width allows for efficient use of space on a circuit board.

Other IC type: PLL FREQUENCY SYNTHESIZER

Incorporates advanced PLL technology for precise frequency synthesis, ensuring accurate signal generation.

Minimum Supply Voltage (Vsup): 2.8 V

Allows for operation at lower voltage levels, contributing to energy efficiency.

Maximum Time At Peak Reflow Temperature (s): 30

Can withstand peak reflow temperatures for a sufficient duration, facilitating manufacturing processes.

Peak Reflow Temperature °C: 235

Capable of withstanding high reflow temperatures during assembly, ensuring product reliability.

Length: 6 mm

Compact length contributes to space-saving designs on circuit boards.

Temperature Grade: INDUSTRIAL

Designed to meet industrial temperature specifications, ensuring reliability in harsh operating conditions.

Technology: BICMOS

Utilizes BiCMOS technology for a combination of bipolar and CMOS characteristics, offering high performance and low power consumption.

Terminal Form: NO LEAD

Lead-free terminal form supports environmental sustainability and complies with RoHS regulations.

Terminal Pitch: 0.5 mm

Fine pitch spacing allows for precise connections and compact layout on circuit boards.

Maximum Supply Voltage (Vsup): 3.2 V

Operates safely within the specified maximum supply voltage range, ensuring product longevity.

Technical Specifications

Phase Locked Loops (PLL) & Frequency Synthesis Circuits LMX2531LQ2080E attributes and parameters. Explore more Phase Locked Loops (PLL) & Frequency Synthesis Circuits devices from Texas Instruments

Specs

Other IC type:

JESD-30 Code:

S-XQCC-N36

JESD-609 Code:

e0

Length:

6 mm

Moisture Sensitivity Level (MSL):

1

No. of Functions:

1

No. of Terminals:

36

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

UNSPECIFIED

Package Code:

Package Shape:

Package Style (Meter):

CHIP CARRIER, VERY THIN PROFILE

Peak Reflow Temperature (C):

235

Maximum Seated Height:

.8 mm

Maximum Supply Voltage (Vsup):

3.2 V

Minimum Supply Voltage (Vsup):

2.8 V

Nominal Supply Voltage (Vsup):

3 V

Surface Mount:

YES

Technology:

BICMOS

Temperature Grade:

Terminal Finish:

TIN LEAD

Terminal Form:

NO LEAD

Terminal Pitch:

.5 mm

Terminal Position:

QUAD

Maximum Time At Peak Reflow Temperature (s):

30

Width (mm):

6 mm

Trade Compliance

LMX2531LQ2080E Other Function Semiconductors trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

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Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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