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LMX2531LQX1742

Texas Instruments

LMX2531LQX1742 by Texas Instruments

LMX2531LQX1742 by Texas Instruments is a PLL frequency synthesizer with 36 terminals and a supply voltage range of 2.8V to 3.2V. Operating temperature ranges from -40°C to 85°C, making it suitable for industrial applications requiring precise frequency synthesis in compact square package design. With BICMOS technology and quad terminal position, this chip carrier device offers high performance in a very thin profile for surface mount applications.

Median Price

-

Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 9,807 parts In-Stock

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9,807

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Digiode

USA . 3,255 parts In-Stock

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3,255

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Anansix

USA . 2,542 parts In-Stock

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2,542

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Distributors (Availability)

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One Stop Electronics

USA . 685 parts In-Stock

1+ parts

$6.500

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-

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685

$6.500

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AZTECH Wire

Italy . 435 parts In-Stock

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$19.688

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435

$19.688

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Parana Technologies

USA . 1,174 parts In-Stock

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$20.442

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$20.494

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1,174

$20.442

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$20.494

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IDEA Electronic Components Group

UK . 2,263 parts In-Stock

1+ parts

$22.968

100+ parts

$21.820

1k+ parts

$20.671

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2,263

$22.968

$21.820

$20.671

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ChromeModa Solutions

Germany . 961 parts In-Stock

1+ parts

$22.968

100+ parts

$18.834

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961

$22.968

$18.834

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Corphita

USA . 4,321 parts In-Stock

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DigiPath Technology Company

USA . 111 parts In-Stock

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$20.708

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111

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$20.708

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Overview

Unlock unparalleled precision and reliability with the Texas Instruments LMX2531LQX1742 PLL Frequency Synthesizer. Crafted with cutting-edge BICMOS technology, this phase-locked loop circuit offers industrial-grade performance in a compact square package. From wireless communication systems to radar applications, this innovative solution ensures optimal frequency synthesis for your critical projects. Trust Texas Instruments for superior quality and performance that exceeds expectations. Elevate your designs with the LMX2531LQX1742 and experience unmatched value and benefits that propel your projects to success.

Feature Benefit Bullets

Surface Mount: YES

Easy to mount on PCBs, reduces assembly time and costs.

Nominal Supply Voltage (Vsup): 3 V

Compatible with common power supply voltages, ensures stable operation.

Maximum Operating Temperature: 85 °C

Can operate in a wide range of temperatures, suitable for industrial environments.

Technology: BICMOS

Combines benefits of both bipolar and CMOS technologies, offering high performance and low power consumption.

Technical Specifications

Phase Locked Loops (PLL) & Frequency Synthesis Circuits LMX2531LQX1742 attributes and parameters. Explore more Phase Locked Loops (PLL) & Frequency Synthesis Circuits devices from Texas Instruments

Specs

Other IC type:

JESD-30 Code:

S-XQCC-N36

JESD-609 Code:

e0

Length:

6 mm

Moisture Sensitivity Level (MSL):

1

No. of Functions:

1

No. of Terminals:

36

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

UNSPECIFIED

Package Code:

Package Shape:

Package Style (Meter):

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

Peak Reflow Temperature (C):

235

Qualification:

Not Qualified

Maximum Seated Height:

.8 mm

Maximum Supply Voltage (Vsup):

3.2 V

Minimum Supply Voltage (Vsup):

2.8 V

Nominal Supply Voltage (Vsup):

3 V

Surface Mount:

YES

Technology:

BICMOS

Temperature Grade:

Terminal Finish:

TIN LEAD

Terminal Form:

NO LEAD

Terminal Pitch:

.5 mm

Terminal Position:

QUAD

Maximum Time At Peak Reflow Temperature (s):

30

Width (mm):

6 mm

Trade Compliance

LMX2531LQX1742 Other Function Semiconductors trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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