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CD74HC4046APWTG4

Texas Instruments

CD74HC4046APWTG4 by Texas Instruments

CD74HC4046APWTG4 by Texas Instruments is a 16-terminal PLL & Frequency Synthesis Circuit with Vsup range of 2-6V. Operating b/w -55 to 125°C, it's MILITARY grade CMOS technology IC suitable for applications requiring phase-locked loop functionality in compact spaces.

Median Price

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Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 8,977 parts In-Stock

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Digiode

USA . 3,105 parts In-Stock

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3,105

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Nova Conductors

Japan . 40 parts In-Stock

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40

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One Stop Electronics

USA . 576 parts In-Stock

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$0.500

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576

$0.500

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Ampacity Inc.

Singapore . 1,535 parts In-Stock

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$6.500

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$6.500

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AZTECH Wire

Italy . 534 parts In-Stock

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$6.781

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534

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Parana Technologies

USA . 1,062 parts In-Stock

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$14.964

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$15.387

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$14.964

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$15.387

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DigiPath Technology Company

USA . 2,084 parts In-Stock

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$16.477

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$15.159

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2,084

$16.477

$15.159

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ChromeModa Solutions

Germany . 3,529 parts In-Stock

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$16.813

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$13.787

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3,529

$16.813

$13.787

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IDEA Electronic Components Group

UK . 476 parts In-Stock

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$16.813

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$15.972

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$15.132

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476

$16.813

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Corphita

USA . 3,834 parts In-Stock

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Bastille Electronics

Australia . 48 parts In-Stock

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Overview

Unlock the power of precision with the CD74HC4046APWTG4 by Texas Instruments, a top-quality Phase Locked Loop (PLL) & Frequency Synthesis Circuit. Designed with cutting-edge technology and superior craftsmanship, this product offers unparalleled performance and reliability. Perfect for a wide range of applications, this compact and versatile device delivers exceptional value and benefits to customers seeking seamless frequency control solutions. Elevate your projects with the Texas Instruments CD74HC4046APWTG4 and experience the difference quality makes.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Plastic/Epoxy material makes the package lightweight and durable, ideal for portable and rugged applications.

Surface Mount: YES

Surface mount capability allows for easy installation on PCBs, saving space and reducing assembly time.

Nominal Supply Voltage (Vsup): 3 V

Operates at a standard 3V supply voltage, making it compatible with a wide range of systems.

Maximum Operating Temperature: 125 °C

High maximum operating temperature ensures reliability in extreme environmental conditions.

Technology: CMOS

CMOS technology offers low power consumption and high noise immunity, increasing efficiency and reliability of the circuit.

Technical Specifications

Phase Locked Loops (PLL) & Frequency Synthesis Circuits CD74HC4046APWTG4 attributes and parameters. Explore more Phase Locked Loops (PLL) & Frequency Synthesis Circuits devices from Texas Instruments

Specs

Other IC type:

JESD-30 Code:

R-PDSO-G16

JESD-609 Code:

e4

Length:

5 mm

Moisture Sensitivity Level (MSL):

1

No. of Functions:

1

No. of Terminals:

16

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-55 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

TSSOP16,.25

Package Shape:

Package Style (Meter):

SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

Peak Reflow Temperature (C):

260

Power Supplies (V):

2/6

Qualification:

Not Qualified

Maximum Seated Height:

1.2 mm

Sub-Category:

PLL or Frequency Synthesis Circuits

Maximum Supply Voltage (Vsup):

6 V

Minimum Supply Voltage (Vsup):

2 V

Nominal Supply Voltage (Vsup):

3 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

NICKEL PALLADIUM GOLD

Terminal Form:

GULL WING

Terminal Pitch:

.65 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

30

Width (mm):

4.4 mm

Trade Compliance

CD74HC4046APWTG4 Other Function Semiconductors trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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