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CD74HCT4046AM96G4

Texas Instruments

CD74HCT4046AM96G4 by Texas Instruments

CD74HCT4046AM96G4 by Texas Instruments is a Phase Locked Loop (PLL) & Frequency Synthesis Circuit with 1 function. It operates at a nominal voltage of 5V and has a temperature range of -55 to 125°C. This IC is commonly used in military applications due to its small size and CMOS technology.

Median Price

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Lifecycle Status

Suppliers In-Stock

4

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 3,636 parts In-Stock

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3,636

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Digiode

USA . 2,911 parts In-Stock

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2,911

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Nova Conductors

Japan . 700 parts In-Stock

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700

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Bristol Electronics

USA . 619 parts In-Stock

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619

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Distributors (Availability)

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One Stop Electronics

USA . 1,310 parts In-Stock

1+ parts

$2.500

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$2.500

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Ampacity Inc.

Singapore . 1,410 parts In-Stock

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$5.500

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$5.500

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Parana Technologies

USA . 195 parts In-Stock

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$12.930

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$13.417

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195

$12.930

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$13.417

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DigiPath Technology Company

USA . 461 parts In-Stock

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$14.237

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$13.098

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461

$14.237

$13.098

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ChromeModa Solutions

Germany . 3,999 parts In-Stock

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$14.528

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$11.913

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$14.528

$11.913

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IDEA Electronic Components Group

UK . 197 parts In-Stock

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$14.528

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$13.802

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$13.075

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197

$14.528

$13.802

$13.075

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AZTECH Wire

Italy . 273 parts In-Stock

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$14.836

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Glotronic Ltd.

UK . 3,790 parts In-Stock

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Corphita

USA . 2,642 parts In-Stock

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Bastille Electronics

Australia . 68 parts In-Stock

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Overview

Experience unmatched precision and reliability with the CD74HCT4046AM96G4 by Texas Instruments. As a leading manufacturer in Phase Locked Loops (PLL) & Frequency Synthesis Circuits, Texas Instruments delivers exceptional quality that you can trust. This product offers a wide range of applications, ensuring versatility for all your needs. With its compact size and durable construction, it guarantees seamless integration into any project. Discover the value and benefits that this top-notch product brings to the table. Upgrade your performance and achieve optimal results with the CD74HCT4046AM96G4 by Texas Instruments.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy material in the package body provides durability and protection for the internal components, making this product suitable for various environments.

Surface Mount: YES

With surface mount capability, this product offers easy installation and integration onto circuit boards, simplifying the assembly process.

No. of Functions: 1

Having one function ensures simplicity and ease of use, making this product ideal for applications requiring a single function.

Package Shape: RECTANGULAR

The rectangular package shape allows for efficient use of space, making this product suitable for compact designs.

Nominal Supply Voltage (Vsup): 5 V

With a nominal supply voltage of 5V, this product offers compatibility with standard power sources, providing versatility and flexibility in operation.

Power Supplies (V): 5

This product supports power supplies with voltages of 5V, enabling seamless integration into existing systems or devices.

No. of Terminals: 16

The 16 terminals provide ample connectivity options, allowing for a wide range of input and output configurations, enhancing versatility in application.

Package Style (Meter): SMALL OUTLINE

The small outline package style ensures space-efficiency and saves valuable board space, making this product an excellent choice for compact electronic designs.

Maximum Operating Temperature: 125 °C

With a maximum operating temperature of 125°C, this product can withstand higher temperature environments, making it suitable for demanding industrial or automotive applications.

Minimum Operating Temperature: -55 °C

The minimum operating temperature of -55°C ensures reliable performance, even in extreme cold conditions, making this product suitable for a wide range of environments.

Terminal Finish: NICKEL PALLADIUM GOLD

The nickel palladium gold terminal finish provides enhanced conductivity and superior corrosion resistance, ensuring optimal signal transmission and extending the product's lifespan.

Terminal Position: DUAL

The dual terminal position allows for flexibility in integration, providing multiple connection options for easier circuit design.

Maximum Seated Height: 1.75 mm

With a maximum seated height of 1.75mm, this product offers a low profile, making it suitable for applications with space constraints or where height is a critical factor.

Width (mm): 3.9 mm

The compact width of 3.9mm contributes to the overall space-saving design, making this product well-suited for miniaturized electronic applications.

Other IC type: PHASE LOCKED LOOP

The inclusion of a phase-locked loop (PLL) allows for precise and stable frequency synthesis, making this product an excellent choice for applications requiring accurate frequency control.

Minimum Supply Voltage (Vsup): 4.5 V

With a minimum supply voltage of 4.5V, this product operates efficiently even with lower power sources, providing flexibility in power management.

Maximum Time At Peak Reflow Temperature (s): 30

The maximum time allowed at the peak reflow temperature of 30 seconds ensures proper soldering and reliability during assembly, contributing to the long-term performance of the product.

Peak Reflow Temperature °C: 260

With a peak reflow temperature of 260°C, this product can withstand the high temperatures involved in the soldering process, ensuring a secure and durable bond.

Length: 9.9 mm

The length of 9.9mm offers a compact form factor, making this product suitable for space-constrained designs without compromising functionality.

Temperature Grade: MILITARY

Designed for military-grade applications, this product meets stringent temperature and durability requirements, making it highly reliable and suitable for mission-critical systems.

Technology: CMOS

Utilizing CMOS technology, this product offers low power consumption, enabling energy-efficient operation and extended battery life in portable devices.

Terminal Form: GULL WING

The gull wing terminal form provides secure and reliable solder connections, minimizing the risk of disconnections or poor conductivity during operation.

Terminal Pitch: 1.27 mm

With a terminal pitch of 1.27mm, this product allows for precise and efficient soldering, facilitating reliable electrical connections and making it suitable for automated assembly processes.

Moisture Sensitivity Level (MSL): 1

Featuring a moisture sensitivity level of 1, this product is resistant to moisture-related damages during handling and operation, ensuring long-term reliability.

Maximum Supply Voltage (Vsup): 5.5 V

With a maximum supply voltage of 5.5V, this product offers compatibility with slightly higher voltage sources, providing additional flexibility in power supply options.

Technical Specifications

Phase Locked Loops (PLL) & Frequency Synthesis Circuits CD74HCT4046AM96G4 attributes and parameters. Explore more Phase Locked Loops (PLL) & Frequency Synthesis Circuits devices from Texas Instruments

Specs

Other IC type:

JESD-30 Code:

R-PDSO-G16

JESD-609 Code:

e4

Length:

9.9 mm

Moisture Sensitivity Level (MSL):

1

No. of Functions:

1

No. of Terminals:

16

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-55 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

SOP

Package Equivalence Code:

SOP16,.25

Package Shape:

Package Style (Meter):

SMALL OUTLINE

Peak Reflow Temperature (C):

260

Power Supplies (V):

5

Qualification:

Not Qualified

Maximum Seated Height:

1.75 mm

Sub-Category:

PLL or Frequency Synthesis Circuits

Maximum Supply Voltage (Vsup):

5.5 V

Minimum Supply Voltage (Vsup):

4.5 V

Nominal Supply Voltage (Vsup):

5 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

NICKEL PALLADIUM GOLD

Terminal Form:

GULL WING

Terminal Pitch:

1.27 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

30

Width (mm):

3.9 mm

Trade Compliance

CD74HCT4046AM96G4 Other Function Semiconductors trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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