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LMX2350SLB

Texas Instruments

LMX2350SLB by Texas Instruments

LMX2350SLB by Texas Instruments is a PLL frequency synthesizer with 24 terminals in a chip carrier package. It operates b/w -40 to 85°C, consuming 8.75mA at 3/5V. Ideal for industrial applications requiring precise frequency synthesis and phase-locked loops.

Median Price

-

Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 4,818 parts In-Stock

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Digiode

USA . 4,417 parts In-Stock

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Anansix

USA . 2,144 parts In-Stock

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Distributors (Availability)

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One Stop Electronics

USA . 1,414 parts In-Stock

1+ parts

$4.500

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$4.500

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AZTECH Wire

Italy . 801 parts In-Stock

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$7.515

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801

$7.515

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Parana Technologies

USA . 741 parts In-Stock

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$13.478

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$13.990

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741

$13.478

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$13.990

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DigiPath Technology Company

USA . 164 parts In-Stock

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$14.841

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164

$14.841

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ChromeModa Solutions

Germany . 4,944 parts In-Stock

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$15.144

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$12.418

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$12.418

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IDEA Electronic Components Group

UK . 1,804 parts In-Stock

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$15.144

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$14.387

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$13.630

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1,804

$15.144

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$13.630

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Corphita

USA . 5,288 parts In-Stock

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Overview

Unlock the power of precision with the Texas Instruments LMX2350SLB Phase Locked Loop. Designed with cutting-edge BICMOS technology, this industrial-grade PLL Frequency Synthesizer offers unparalleled performance and reliability. With a compact chip carrier package, surface mount capability, and wide operating temperature range, this versatile device is perfect for a variety of applications. Experience seamless frequency synthesis and outstanding signal stability with the LMX2350SLB, bringing value and innovation to your projects.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Provides durability and protection for the inner components of the product.

Surface Mount: YES

Enables easy and efficient installation on circuit boards.

Package Shape: RECTANGULAR

Fits well with standard electronic components and layout designs.

Power Supplies (V): 3/5

Supports a wide range of power supply options for various applications.

No. of Terminals: 24

Provides versatile connectivity options for different circuit configurations.

Package Style (Meter): CHIP CARRIER

Offers compact design for space-constrained applications.

Maximum Operating Temperature: 85 °C

Ensures reliability and performance even under high temperature conditions.

Minimum Operating Temperature: -40 °C

Allows operation in a wide range of temperature environments.

Terminal Position: QUAD

Facilitates easy connection and alignment on circuit boards.

Other IC type: PLL FREQUENCY SYNTHESIZER

Indicates that the product is specifically designed for precision frequency control applications.

Temperature Grade: INDUSTRIAL

Suitable for industrial environments where temperature fluctuations are common.

Maximum Supply Current (Isup): 8.75 mA

Provides efficient power consumption for energy-saving operation.

Technology: BICMOS

Combines the benefits of both bipolar and CMOS technologies for optimized performance.

Terminal Form: NO LEAD

Eliminates the risk of lead contamination and makes the product environmentally friendly.

Terminal Pitch: 0.5 mm

Allows for fine-pitch connections, enabling high-density circuit designs.

Technical Specifications

Phase Locked Loops (PLL) & Frequency Synthesis Circuits LMX2350SLB attributes and parameters. Explore more Phase Locked Loops (PLL) & Frequency Synthesis Circuits devices from Texas Instruments

Specs

Other IC type:

JESD-30 Code:

R-PQCC-N24

No. of Terminals:

24

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

LCC24,.17X.14,20

Package Shape:

Package Style (Meter):

CHIP CARRIER

Peak Reflow Temperature (C):

NOT SPECIFIED

Power Supplies (V):

3/5

Qualification:

Not Qualified

Sub-Category:

PLL or Frequency Synthesis Circuits

Maximum Supply Current (Isup):

8.75 mA

Surface Mount:

YES

Technology:

BICMOS

Temperature Grade:

Terminal Form:

NO LEAD

Terminal Pitch:

.5 mm

Terminal Position:

QUAD

Maximum Time At Peak Reflow Temperature (s):

NOT SPECIFIED

Trade Compliance

LMX2350SLB Other Function Semiconductors trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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