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TLC2932IPWLE

Texas Instruments

TLC2932IPWLE by Texas Instruments

TLC2932IPWLE by Texas Instruments is a PLL & Frequency Synthesis Circuit with 14 terminals, operating at -20 to 75°C. It has a supply voltage range of 4.75-5.25V and CMOS technology, suitable for commercial applications requiring precise frequency control in compact designs.

Median Price

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Lifecycle Status

Suppliers In-Stock

12

In-Stock Inventory

1k+

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Vyrian

USA . 2,025 parts In-Stock

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Lakeland Logistics Inc

USA . 1,604 parts In-Stock

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Bristol Electronics

USA . 1,604 parts In-Stock

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Sea View Technologies

USA . 1,554 parts In-Stock

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Digiode

USA . 1,103 parts In-Stock

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LIBRA Elektronik GmbH

Germany . 86 parts In-Stock

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PC Components Company LLC

USA . 64 parts In-Stock

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Mil-Aero Solutions, Inc.

USA . 40 parts In-Stock

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Prism Electronics

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Dark Horse Electronics

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Resion

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Inventory MP

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One Stop Electronics

USA . 1,113 parts In-Stock

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$3.500

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Parana Technologies

USA . 2,004 parts In-Stock

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$15.728

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$16.090

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DigiPath Technology Company

USA . 1,303 parts In-Stock

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$17.319

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$15.933

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ChromeModa Solutions

Germany . 6,120 parts In-Stock

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$17.672

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$14.491

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IDEA Electronic Components Group

UK . 2,361 parts In-Stock

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$15.905

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AZTECH Wire

Italy . 825 parts In-Stock

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Component Stockers USA

USA . 571 parts In-Stock

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$99.990

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A-Z Elektronik GmbH

Germany . 5,015 parts In-Stock

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Corphita

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Overview

Enhance your electronic projects with the Texas Instruments TLC2932IPWLE, a top-quality Phase Locked Loop (PLL) & Frequency Synthesis Circuit designed to deliver precision and reliability. Manufactured by the trusted brand Texas Instruments, this product offers unparalleled performance and durability. Ideal for applications requiring precise frequency control, this versatile component operates at a nominal supply voltage of 5V, making it suitable for a wide range of projects. Experience the value and benefits of using the TLC2932IPWLE in your designs, where accuracy and efficiency are paramount. Elevate your creations with this innovative solution from Texas Instruments.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Plastic/epoxy material provides durability and protection for the components inside the package.

Surface Mount: YES

Surface mount technology makes it easier to assemble and install the product on circuit boards.

Nominal Supply Voltage (Vsup): 5 V

Operates at a standard 5V supply voltage, making it compatible with many other electronic components.

Maximum Operating Temperature: 75 °C

Capable of operating at high temperatures, providing reliability in various environments.

Technology: CMOS

CMOS technology offers low power consumption and high noise immunity, making the product efficient and reliable.

Technical Specifications

Phase Locked Loops (PLL) & Frequency Synthesis Circuits TLC2932IPWLE attributes and parameters. Explore more Phase Locked Loops (PLL) & Frequency Synthesis Circuits devices from Texas Instruments

Specs

Additional Features:

ALSO REQUIRE 3V SUPPLY

Other IC type:

JESD-30 Code:

R-PDSO-G14

Length:

5 mm

No. of Functions:

1

No. of Terminals:

14

Maximum Operating Temperature:

75 Cel

Minimum Operating Temperature:

-20 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

TSSOP14,.25

Package Shape:

Package Style (Meter):

SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

Peak Reflow Temperature (C):

NOT SPECIFIED

Power Supplies (V):

3/5

Qualification:

Not Qualified

Maximum Seated Height:

1.2 mm

Sub-Category:

PLL or Frequency Synthesis Circuits

Maximum Supply Voltage (Vsup):

5.25 V

Minimum Supply Voltage (Vsup):

4.75 V

Nominal Supply Voltage (Vsup):

5 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Form:

GULL WING

Terminal Pitch:

.65 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

NOT SPECIFIED

Width (mm):

4.4 mm

Trade Compliance

TLC2932IPWLE Other Function Semiconductors trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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