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TRF3750IRGPRG4

Texas Instruments

TRF3750IRGPRG4 by Texas Instruments

TRF3750IRGPRG4 by Texas Instruments is a PLL frequency synthesizer with 20 terminals, operating at 3.3V/5V. It features a temperature range of -40 to 85°C and terminal finish of NiPdAu. Ideal for industrial applications requiring precise frequency synthesis in compact form factor.

Median Price

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Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 2,106 parts In-Stock

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Digiode

USA . 636 parts In-Stock

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636

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One Stop Electronics

USA . 1,427 parts In-Stock

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$0.500

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1,427

$0.500

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Semicontronic

India . 1,011 parts In-Stock

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$6.500

100+ parts

$6.338

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$6.305

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1,011

$6.500

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$6.305

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AZTECH Wire

Italy . 762 parts In-Stock

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$15.101

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762

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Parana Technologies

USA . 804 parts In-Stock

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$15.360

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$15.749

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804

$15.360

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$15.749

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DigiPath Technology Company

USA . 1,554 parts In-Stock

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$16.913

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$16.913

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ChromeModa Solutions

Germany . 5,430 parts In-Stock

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$17.258

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$14.152

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$17.258

$14.152

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IDEA Electronic Components Group

UK . 1,819 parts In-Stock

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$17.258

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$16.395

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$15.532

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1,819

$17.258

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$15.532

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Corphita

USA . 2,653 parts In-Stock

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Corohmni

South Africa . 108 parts In-Stock

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Overview

Get ready to experience top-notch performance with the TRF3750IRGPRG4 by Texas Instruments. Known for their high-quality manufacturing, Texas Instruments delivers reliable products that are trusted by professionals worldwide. This Phase Locked Loops (PLL) & Frequency Synthesis Circuit is designed to provide precise frequency control and stability, making it ideal for a wide range of applications. With a nominal supply voltage of 3.3V and a temperature grade of industrial, this versatile chip carrier ensures optimal performance even in challenging conditions. Upgrade your systems with the TRF3750IRGPRG4 and enjoy unparalleled accuracy and efficiency.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

This material offers good durability and protection for the internal components of the product, making it resistant to external factors such as moisture or dust.

Surface Mount: YES

Surface mount technology makes installation and soldering of the product easier and more convenient, especially for automated assembly processes.

Nominal Supply Voltage (Vsup): 3.3 V

The specified supply voltage ensures stable and reliable operation of the product within the recommended voltage range.

Maximum Operating Temperature: 85 °C

With a high maximum operating temperature, this product can withstand elevated temperatures without compromising performance, making it suitable for industrial applications.

Technology: CMOS

The CMOS technology used in this product ensures low power consumption and high noise immunity, contributing to energy efficiency and reliable operation.

Technical Specifications

Phase Locked Loops (PLL) & Frequency Synthesis Circuits TRF3750IRGPRG4 attributes and parameters. Explore more Phase Locked Loops (PLL) & Frequency Synthesis Circuits devices from Texas Instruments

Specs

Additional Features:

CAN ALSO OPERATE WITH 5V SUPPLY, DUAL MODULUS PRESCALER : 8/9, 16/17, 32/33, 64/65

Other IC type:

JESD-30 Code:

S-PQCC-N20

JESD-609 Code:

e4

Length:

4 mm

Moisture Sensitivity Level (MSL):

2

No. of Functions:

1

No. of Terminals:

20

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

LCC20,.16SQ,20

Package Shape:

Package Style (Meter):

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

Peak Reflow Temperature (C):

260

Power Supplies (V):

3.3/5

Qualification:

Not Qualified

Maximum Seated Height:

1 mm

Sub-Category:

PLL or Frequency Synthesis Circuits

Maximum Supply Voltage (Vsup):

3.6 V

Minimum Supply Voltage (Vsup):

3 V

Nominal Supply Voltage (Vsup):

3.3 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

NICKEL PALLADIUM GOLD

Terminal Form:

NO LEAD

Terminal Pitch:

.5 mm

Terminal Position:

QUAD

Maximum Time At Peak Reflow Temperature (s):

30

Width (mm):

4 mm

Trade Compliance

TRF3750IRGPRG4 Other Function Semiconductors trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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