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CD74HCT7046AM96E4

Texas Instruments

CD74HCT7046AM96E4 by Texas Instruments

CD74HCT7046AM96E4 by Texas Instruments is a Phase Locked Loop IC with 16 terminals, operating at 5V. It has a temperature range of -55 to 125°C and is suitable for military-grade applications requiring PLL & frequency synthesis circuits in compact designs. The package is small outline, surface mountable, with nickel palladium gold finish.

Median Price

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Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

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Vyrian

USA . 3,709 parts In-Stock

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Digiode

USA . 1,563 parts In-Stock

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Semicontronic

India . 322 parts In-Stock

1+ parts

$3.500

100+ parts

$3.412

1k+ parts

$3.395

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322

$3.500

$3.412

$3.395

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Ampacity Inc.

Singapore . 164 parts In-Stock

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$3.500

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$3.500

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Native Components

USA . 958 parts In-Stock

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$5.010

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958

$5.010

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AZTECH Wire

Italy . 679 parts In-Stock

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$5.043

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One Stop Electronics

USA . 766 parts In-Stock

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$5.500

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$5.500

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Parana Technologies

USA . 143 parts In-Stock

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$16.241

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$16.553

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143

$16.241

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$16.553

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ChromeModa Solutions

Germany . 3,600 parts In-Stock

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$18.248

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$14.963

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IDEA Electronic Components Group

UK . 994 parts In-Stock

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$18.248

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$17.336

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$16.423

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Northwest PG Solutions

USA . 1,592 parts In-Stock

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$4.910

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DigiPath Technology Company

USA . 1,042 parts In-Stock

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$16.452

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Corphita

USA . 990 parts In-Stock

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Corohmni

South Africa . 365 parts In-Stock

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Robosynatics

Brazil . 100 parts In-Stock

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$16.109

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$14.917

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$14.917

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$14.917

Lucentia Tech

USA . 100 parts In-Stock

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$16.109

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$14.917

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$14.917

100

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$16.109

$14.917

$14.917

Overview

Unlock the power of precise frequency synthesis with the CD74HCT7046AM96E4 by Texas Instruments. Crafted with unparalleled quality and expertise, this Phase Locked Loop (PLL) offers unrivaled performance in a small outline package, making it ideal for military-grade applications where accuracy is paramount. With a nominal supply voltage of 5V and dual terminal position, this innovative solution provides customers with the reliability and precision they need to succeed in their projects. Discover the value and benefits that Texas Instruments brings to the table with the CD74HCT7046AM96E4.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The plastic/epoxy package body material provides durability and protection for the components inside the PLL and frequency synthesis circuits, ensuring reliable performance.

Surface Mount: YES

Being surface mountable makes the product easy to integrate into electronic circuits, saving space and simplifying assembly processes.

Nominal Supply Voltage (Vsup): 5 V

The 5V supply voltage is a standard voltage level that is widely available, making it compatible with a variety of systems and power sources.

Maximum Operating Temperature: 125 °C

The high maximum operating temperature allows the PLL and frequency synthesis circuits to function reliably in harsh environmental conditions without overheating.

Technology: CMOS

CMOS technology offers low power consumption and high noise immunity, making the product energy-efficient and reliable in noise-sensitive applications.

Technical Specifications

Phase Locked Loops (PLL) & Frequency Synthesis Circuits CD74HCT7046AM96E4 attributes and parameters. Explore more Phase Locked Loops (PLL) & Frequency Synthesis Circuits devices from Texas Instruments

Specs

Other IC type:

JESD-30 Code:

R-PDSO-G16

JESD-609 Code:

e4

Length:

9.9 mm

Moisture Sensitivity Level (MSL):

1

No. of Functions:

1

No. of Terminals:

16

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-55 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

SOP

Package Equivalence Code:

SOP16,.25

Package Shape:

Package Style (Meter):

SMALL OUTLINE

Peak Reflow Temperature (C):

260

Power Supplies (V):

5

Qualification:

Not Qualified

Maximum Seated Height:

1.75 mm

Sub-Category:

PLL or Frequency Synthesis Circuits

Maximum Supply Voltage (Vsup):

5.5 V

Minimum Supply Voltage (Vsup):

4.5 V

Nominal Supply Voltage (Vsup):

5 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

NICKEL PALLADIUM GOLD

Terminal Form:

GULL WING

Terminal Pitch:

1.27 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

30

Width (mm):

3.9 mm

Trade Compliance

CD74HCT7046AM96E4 Other Function Semiconductors trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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